| Objectives | Background | Approach |
To develop and evaluate thermal management techniques for power
electronics modules employing single and two-phase flow.
Trends in power electronics call for heat fluxes at the die level to approach 100-300 W/cm2 within the next decade. At the CALCE Center a two-year program has focused on the development and testing of aluminum/silicon carbide (AlSiC) metal matrix composite (MMC) cold plates, containing pin fin arrays. Several thermal interfaces can be eliminated through the use of this MMC. It also has a thermal conductivity comparable to aluminum and a coefficient of thermal expansion well matched to power electronic packaging substrates such as aluminum nitride.
The heat transfer and pressure drop performance of the AlSiC base plates will be compared under single and two phase operating conditions. Tests wil be performed using distilled water and a 50-50 water/glycol mixuture. single phase heat transfer will be assessed using thermochromic liquid crystal imaging, while two phase heat transfer will be characterized with and without pump assist, through a range of subambient pressures. Comparisons between the achievable heat transfer an required pressure drop for each approach will be made.