CALCE Consortium Research Agenda for 2001/2002

C02-01	Reliability of Optical Interfaces to MEMS Develop methods for assessing the reliability of optical interfaces to MEMS packages and use those methods to address the reliability of glass tape sealed hermetic optical waveguide MEMS packages and metalized optical fiber interfaces to chip-level MEMS packages.
C02-02	Part Obsolescence Driven Design Refresh Planning Develop methods and models for predicting the optimum schedule on which to perform design refreshes based on part obsolescence predictions, functional upgrade requirements, anticipation of additional product orders, re-qualification requirements, and budget constraint inputs.
C02-03	Embedded Passive Reliability and Tradeoff Analysis Evaluate the reliability of embedded (integral) resistors and capacitors through environmental testing of layer pairs and multilayer boards containing embedded components. Extend and verify application-specific size/cost tradeoff analysis models developed in the C01-11 project.
C02-04	Review and Assessment of Telcordia Reliability Specifications To assess Telcordia Technologies Special Report SR-332, the primary reliability prediction document used in the telecommunication industry according to the guideline of IEEE standard 1413.
C02-05	Environmentally-Friendly Electronics in Japan To investigate the technological, ecological supply chain, and economic advances make in the development of environmentally-friendly electronics, by focusing on Japan as the market leader.
C02-06	Influence of Intermetallic on the Durability of Lead-Free Solder Interconnects To characterize intermetallic growth between the lead finishes on commercial components and the NEMI recommended Pb-free alternative (i.e. Sn3.9Ag0.6Cu) to standard eutectic tin-lead reflow solder. To determine the effect of intermetallic growth on the adhesion strength at the lead/attach interfaces and relate it to time-to-failure in assemblies.
C02-07	Constitutive Relationships of Binary Lead-Free Solders To measure constitutive relationships of the binary tin alloy Sn3.5Ag from isothermal mechanical tests. To provide guidelines for accelerated stress testing. In future years we will focus on Sn0.7Cu, which is in the NEMI roadmap as well as Sn3.5Ag, Sn3.9Ag0.6Cu tested in C01-01.
C02-08	Accelerated Thermal Cycling Tests for Lead-Free Assemblies Develop strategies to use the lead-free solder properties characterized in C01-31 (Sn3.9Ag0.6Cu), in order to predict the durability of lead-free surface mount assemblies, under temperature cycling and under cyclic bending. Investigate the feasibility of using thermal shock test chambers to conduct high-ramp-rate thermal cycling tests Provide test data to further validate and verify calcePWA and calceFAST models for stress and damage analysis, especially for lead-free assemblies
C02-09	Durability Characterization of Lead-Free Solders continued Use the thermo-mechanical-microstructural (TMM) test apparatus to assess the cyclic durability of lead-free solders. In C01-02 we characterized the durability of the ternary alloy Sn3.9Ag0.6Cu, because of its importance in the current NEMI roadmap. In C02-09, the material system is the binary tin alloy Sn3.5Ag (which is also important in the NEMI roadmap). In future years we will focus on Sn0.7Cu, which is another material in the NEMI roadmap.
C02-10	Life Consumption Monitoring Develop and produce a prototype system capable of monitoring real and accelerated equipment usage from groups of multiple sensors in a form that is compatible with the input requirements of existing CALCE PoF models. Using data collected from the above system; produce the prognostic software algorithms necessary to predict remaining life. Quantify the effect that data reduction techniques used in the remaining life calculation process will have on prediction accuracy. Produce a strategy that supports the incorporation of groups of these devices in a process that enables the effective management of critical items at system level.
C02-11	Guidelines and Improvements for Conducting Virtual Qualification CADMP-II/calcePWA This project will continue to expand the coverage for virtual qualification software by updating and integrating selected device failure models from CADMP-II into calcePWA and initiating an update of CADMP II software to be compatible with current and future calcePWA software. As a focus, the project will continue the examination of circuit card assemblies reviewed under C01-31 and make use of capabilities developed under C01-17.
C02-12	Virtual Qualification of Power Components and Modules To demonstrate virtual qualification of power modules for automotive, aerospace and other applications. To investigate the effects of plastic encapsulation on the reliability of power components and modules. To determine if certain accelerated tests introduce new failure mechanisms in SMT power modules.
C02-13	Quantitative Damage Characterization of Portable Electronics Under Impact Loading To develop a high sensitivity deformation measurement technique for the impact loading, and To quantify the damage induced by the impact loading to evaluate the effect of impact loading on the fatigue damage.
C02-14	Test Tailoring Methodology for Impact Loading Continuation The preliminary test methodology developed in C01-29 will be enhanced to simulate the fundamental aspects of impact damage encountered when a portable product is dropped. The accompanying PoF analysis needed to tailor the test and interpret the results will be conducted. The principles will be demonstrated through a specific case study.
C02-15	Virtual Qualification of Components Under High G Loads This project will develop identify failure sites in components packages subjected to high G (above 15,000 G) loading conditions. The final objective to provide guidelines and models for design electronic hardware under high G loading conditions.
C02-16	Thermal Management Solutions for Low Volume Complex Electronic Systems LVCES To identify thermal management requirements and solutions that are currently available for electronic designers. To identify emerging technologies in electronic cooling To illustrate the application of these techniques to a typical avionics application
C02-17	Degradation of High-Frequency Signals through Traces Plated with Alternative Finishes and Lead-Free Solder To characterize the dispersion and attenuation of high-frequency signals plated with alternative finishes and lead-free solder, and to determine the relationship between degradation of signals and conductor and substrate losses.
C02-18	Electrical Characterization of Lead-Free Solder Separable Contact Interfaces continued Determine the fretting corrosion behavior of the selected lead-free solder (SnAgCu) separable contact interfaces.
C02-19	Radiation Induced Failure Mechanisms and Preventive Shielding of Electronic Parts To assess preventative polymer shielding techniques through testing and analysis on a promising shielding materials. To develop a web resource on effects of radiation on commercial electronic parts that are not radiation hardened.
C02-20	Characterization of Hygroscopic Strains due to Hygroscopic Swelling Coefficient Mismatches in Plastic Encapsulated Microelectronics This project will continue to explore the impact of humidity on plastic packages. Recent CALCE studies have shown that the strains due to hygroscopic expansion may in fact be significantly larger than those induced by temperature. In order to verify these findings, moiré interferometry will be used to determine the hygroscopic strains associated with microelectronic devices. This project will also investigate the effect of the strains on package reliability, and will develop Physics of Failure guidelines for accelerated tests.
C02-21	Modeling Durability in Large Area Die Attach To determine constitutive and fatigue properties for common and novel die attach materials in power modules. To identify/assess the impact of intermetallic reactions on attach failure in common power module configurations. To calibrate the results of the mechanical testing to the results of thermal cycling of test samples of the die attach.
C02-22	Modeling High Temperature Failures in Plastic Encapsulated Microcircuits To characterize the mechanisms that cause plastic encapsulated microcircuits to fail sooner than ceramic microcircuits in high ambient temperature applications, focusing on intermetallic formation. To investigate new materials or package design strategies that could mitigate these failure mechanisms.
C02-23	Evaluation of Conformal Coatings on Advanced PEM Device and Package Technologies The objective of this project is to determine the effects of conformal coating on the reliability of plastic encapsulated parts for use in high humidity and/or high altitude applications.
C02-24	Selection of Compounds for Molding Flip-Chipped Devices Assess promising molding compounds – process and fillers; Determine the role of filler size, distribution and shape in the properties of various resin underfills; Establish a protocol which relates final desired properties to the material systems and feed protocols; Show the effects of flow patterns to the breakup of the filler agglomerates and how to control the final particle sizes.
C02-25	Electrical Leakage in Printed Wiring Assemblies Develop a webbook that explains causes of electrical leakage in printed circuit assemblies, including migration failures and moisture absorption, describes current failure models and recommends corrective actions. Assess the effect of temperature, humidity, voltage, plating material and ionic contamination on lifetime. Investigate the migration behavior of new plating materials, including immersion tin and immersion silver Provide a foundation for future investigations of migration behavior in palladium, no-clean assemblies and the effect of lead-free manufacturing processes on the probability of ECM
C02-26	Creep Corrosion Over Noble Plating Material Determine a method of producing creep corrosion in lab. Determine methods to identify and analyze creep corrosion. Develop guidelines for assessing the susceptibility of palladium-plated components to creep corrosion. Develop strategies for mitigating the risks of creep corrosion in palladium-plated components.
C02-27	Characterization of Fiber and Epoxy Stresses in Physical Contact Fiber Optic Connectors The ultimate objective of this study is to understand the failure mechanisms of epoxy-cured, physical contact connectors so one can take steps to increase manufacturing yield and to increase the lifetime and performance of the fiber connector. One would like to understand exactly why and where the failure ultimately occurs between ferrule and the fiber in an epoxy cured connector so steps can be taken to reduce the stress drivers.
C02-28	PTH and Microvia Accelerated Life Testing - IST Versus Oven Provide understanding of reliability issues associated with accelerated life testing of plated through holes (PTH) and Microvias with conventional oven cycling and the Integrated Stress Test (IST).
C02-29	Effect of Fatigue Induced Grain Growth and Corrosion on Life of Solder Interconnects Experimentally examine relationship of changes in solder grain structure as related to fatigue damage. Acquire and refine knowledge base on the corrosive susceptibility of tin-alloys exposed to no-clean flux chemistries. Determine the optimum test method for benchmarking the corrosive potential of no-clean fluxes. Validate the fatigue and corrosion-induced degradation of eutectic and lead-free solder interconnects through in-situ monitoring and investigation of solder structure of PTC and field units. Develop an acceleration factor based upon microstructural coarsening and provide a modifier based upon the corrositivity of the no-clean flux composition
C02-30	Interconnect Durability Models for Novel Interconnects and Update of Failure Assessment Software This project will continue the work of developing and improving component interconnect failure models for calcePWA. The focus of the effort will be to introduce new package and interconnect styles which are not currently covered in calcePWA and improve the software through which the models are used.
C02-31	Characterization of Anisotropic Conductive Adhesives This project will use experimental techniques and PoF simulation to assess the constitutive behavior and thermomechanical durability performance of a selected anisotropic conductive adhesive (ACA).
C02-32	Guidelines for Assembly and Reliability Assessment of BGAs This project will provide guidelines for using BGA packages in design of electronic hardware. Key aspects will include contract assembler assessment and management, and interconnect durability assessment. Demonstrations of how CALCE software can be used to assist in qualification and test development will also be included.
C02-33	Failure Modeling in Direct Bonded Copper Substrates To model crack initiation and propagation in direct bonded copper substrates for the purpose of assessing the reliability of such substrates in power modules, with and without the presence of a heat spreader.