C08-01	Reliability of Pb-free and Reballed PBGAs in SnPb Assembly Process
C08-03	Effect of Cyclic Fatigue Damage Accumulation on Properties of SAC Solders
C08-04	Solder Joint Reliability of Solder Dipped SAC/SnPb and SnBi Leaded SMT Packages in a Sn37Pb Assembly Process
C08-05	Tin Whisker Shorting Propensity and Growth Assessment
C08-07	Solder Joint Reliability of Reworked/Repaired SMT Assemblies
C08-08	Thermal Aging Effect on Reliability of Pb-free Interconnects Sn96.5Ag3.0Cu0.5 and SnCuNi
C08-09	Vibration Fatigue Life of Pb-free Interconnects Sn96.5Ag3.0Cu0.5 and SnCuNi
C08-10	Investigation of Factors Affecting Flex Cracking of Standard and Flexible Termination Multilayer Ceramic Capacitors
C08-12	Physics-of-Failure Qualification of Electronic Systems
C08-14	Electronic Component Failures Under Extreme G Loading
C08-15	calcePWA Shock Model Improvements?Load Sequencing
C08-16	Comparative Analysis of Interconnect Degradation Using RF Impedance
C08-17	Accelerated Testing Guideline of COF Package Assembly
C08-18	Fundamental Understanding of MEMS Structures Subjected to High Shock
C08-19	Reliability of Embedded Capacitors
C08-20	Stress Relaxation in Stamped Metal Land Grid Array Sockets
C08-21	Modeling Mechanical Torsion of PWA in calcePWA
C08-22	Acceleration Parameter of Highly Accelerated Life Test: Combined Effect of Moisture and Temperature on PEMS Reliability
C08-23	Physics of Failure of Cu/Low-k Silicon Devices
C08-24	Sustainment Stovepipe Analysis and Avoidance
C08-25	Evaluation of Residual Stresses of PEM Induced by Effective Chemical Shrinkage of Polymer Materials
C08-26	PoF Based Design for Optimum Reliability of High Power LED
C08-27	Characterization of Halogen free PCB Laminate Materials
C08-28	Probabilistic PoF Modeling: Effect of Number of I/O on Thermal Cycling Durability Predictions (continuation C07-28)
C08-29	Thermal Performance and Reliability of Thermal Interface Materials
C08-30	Virtual Qualification of Engine Control Modules
C08-32	Field Programmable Gate Arrays FPGA Storage Qualification Test Failure Evaluation
C08-33	Derating Guideline Evaluation for Electronic Products
C08-35	Lead Free Synthesis
C08-36	Microvia Non-destructive Inspection & Qualification
C08-37	Reliability Investigation of Power Electronic Inverter Design
C08-41	Identification of Sources of Counterfeit Parts
C08-45	Durability Assessment of an Advanced Power Electronics Module
C08-46	Model-based Design Guidelines for Shock & Drop Loading
C08-47	Mitigation Measures for Electrochemical Migration on Lead-Free Assemblies with Low-Profile Components