| C12-01 |
PoF Models for Combined Vibration Fatigue and Temperature Cycling in SAC Assemblies
|
| C12-02 |
PoF Models for Multiaxial Vibration Fatigue Continuation of C10-02 |
| C12-03 |
Evaluation of Gold Content on SAC Solder Reliability |
| C12-05 |
Electrical Characterization of Tin and Zinc Whiskers |
| C12-07 |
Modeling Solder Interconnect Fatigue for Complex Temperature Cycles |
| C12-08 |
Evaluation on ENEPIG Finish under Temperature Cycling and Drop Loading |
| C12-09 |
Evaluation of Solder Interconnects on ENEPIG under Vibration Loading |
| C12-10 |
Modification of Engelmaier’s Model to account for Leadless Solder Area |
| C12-11 |
Influence on Temperature Cycling Lifetime of Pre-Damaged Ceramic Resistor (CR)
Solder Joints |
| C12-12 |
Physics-of-Failure PoF Qualification of Complex Outdoor Lighting Systems |
| C12-15 |
Physics-of-Failure PoF Investigation of Impact Fracture of Display Systems |
| C12-16 |
TDR Reliability Analysis of Separable and Permanent Area Array Interconnects |
| C12-17 |
Impact of Extended Dwells on Solder Interconnect Reliability of Next Generation
Solders |
| C12-20 |
Lifetime Distributions of Surface Mount Aluminum Electrolytic Capacitors |
| C12-22 |
Adhesion Testing of Moisture-absorbed Specimens at High Temperatures |
| C12-23 |
High Temperature Uprateabilty Assessment |
| C12-24 |
The Cost of Lead-Free Implementation in Avionics and Aerospace Applications |
| C12-25 |
Valuation of Mitigation Activities for Supply Chain Risk Reduction |
| C12-26 |
End-of-Repair/End-of-Maintenance Costs and Life Extensions |
| C12-28 |
Qualification Method for Electronic Equipment under Free Air Cooling |
| C12-29 |
Evaluation of Authentication Tools for Electronic Products for Failure Risks |
| C12-31 |
Relay Failure Under High Current Conditions |
| C12-32 |
Impact of Sulfur Concentration and Humidity on Corrosion of Metallization in
Electronic Equipment |
| C12-33 |
Impact of Dust on Surface Insulation Resistance of Solder on Printed Circuit
Boards |
| C12-34 |
Failure Analysis and Modeling Strategy Development of Handset-PCB Assembly Subjected to Impact Loading
|
| C12-36 |
PoF Study of Flexural Deformation of PWBs in Portable Products |
| C12-38 |
High Temperature Materials for Improved Reliability |
| C12-45 |
PoF Assessment of Electronics for Long-Life Indoor LED Lighting Systems Continuation
of C11-45 |
