| C09-02 |
PoF Models for Vibration Fatigue Mechanisms in SAC Assemblies at Different Temperatures
|
| C09-03 |
TMM Testing of SAC105 Solder
|
| C09-04 |
Evaluation of Conformal Coat for Tin Whisker Mitigation
|
| C09-05 |
Effectiveness of Tin Whisker Removal and Impact of Corrosion on Whisker Growth
|
| C09-06 |
Tin Whisker Properties and Failure Mitigation Offered by Conformal Coats
|
| C09-07 |
Solder Joint Reliability of Reprocessed Part and Reworked/Repaired SMT Assemblies
|
| C09-08 |
Role of High Current on Solder Interconnect Reliability Under Temperature Cycling
|
| C09-09 |
Vibration Fatigue Life of Pb-free Interconnects
|
| C09-10 |
Improved Flex Cracking Calculator and Failure Detection for Multilayer Ceramic
Capacitors
|
| C09-11 |
Lead-Free Electronics Use and Repair Dynamic Simulation
|
| C09-12 |
Physics-of-Failure PoF Qualification of Complex Electronic Systems
|
| C09-14 |
Electronic Component Failure Categorization under Gun Launched High G Loading
|
| C09-16 |
RF and Digital Signal Analysis for Interconnect Reliability Assessment
|
| C09-18 |
Fundamental Understanding of MEMS Structures Subjected to High Shock Loads
|
| C09-19 |
Reliability of Embedded Planar Capacitors
|
| C09-20 |
Reliability of LGA Sockets
|
| C09-21 |
Mechanical Torsion Reliability of Package on Package PoP
|
| C09-22 |
Reliability Assessment of Flexible Modules
|
| C09-23 |
Characterization of Thermo-mechanical Behavior of FBGA DDP-applied Memory Module
|
| C09-24 |
Part Total Ownership Cost Model Extensions
|
| C09-25 |
Rapid Assessment of Viscoelastic Properties of Polymeric Materials
|
| C09-27 |
Degradation Analysis of Lithium Ion Batteries
|
| C09-28 |
Effect of Impact Parameters on PWA Drop Durability
|
| C09-31 |
Evaluation of Prestacking versus Stack and Reflow Package on Package PoP Assembly
Process
|
| C09-36 |
Shock & Drop Qualification of MEMS Structures for Hand-held Products
|
| C09-37 |
Reliability Assessment of Power Electronic Inverter Design
|
| C09-38 |
High Temperature Electronics Roadmap
|
| C09-41 |
Counterfeit Parts Control Plan for the Trusted Aerospace Electronics Supply Chain
|
| C09-47 |
Electrochemical Migration of Pb-free Printed Circuit Boards with Through-Hole
and Surface Mount Components
|
