CALCE EPS Consortium Research for 2009

The following projects were presented to the CALCE EPS Consortium Members on October 16, 2008 and have been approved for study during the 2008 research year by the Director of the CALCE Electronics Products and Systems Consortium. For general inquiries, please contact Michael Osterman .

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C09-02 PoF Models for Vibration Fatigue Mechanisms in SAC Assemblies at Different Temperatures
C09-03 TMM Testing of SAC105 Solder
C09-04 Evaluation of Conformal Coat for Tin Whisker Mitigation
C09-05 Effectiveness of Tin Whisker Removal and Impact of Corrosion on Whisker Growth
C09-06 Tin Whisker Properties and Failure Mitigation Offered by Conformal Coats
C09-07 Solder Joint Reliability of Reprocessed Part and Reworked/Repaired SMT Assemblies
C09-08 Role of High Current on Solder Interconnect Reliability Under Temperature Cycling
C09-09 Vibration Fatigue Life of Pb-free Interconnects
C09-10 Improved Flex Cracking Calculator and Failure Detection for Multilayer Ceramic Capacitors
C09-11 Lead-Free Electronics Use and Repair Dynamic Simulation
C09-12 Physics-of-Failure PoF Qualification of Complex Electronic Systems
C09-14 Electronic Component Failure Categorization under Gun Launched High G Loading
C09-16 RF and Digital Signal Analysis for Interconnect Reliability Assessment
C09-18 Fundamental Understanding of MEMS Structures Subjected to High Shock Loads
C09-19 Reliability of Embedded Planar Capacitors
C09-20 Reliability of LGA Sockets
C09-21 Mechanical Torsion Reliability of Package on Package PoP
C09-22 Reliability Assessment of Flexible Modules
C09-23 Characterization of Thermo-mechanical Behavior of FBGA DDP-applied Memory Module
C09-24 Part Total Ownership Cost Model Extensions
C09-25 Rapid Assessment of Viscoelastic Properties of Polymeric Materials
C09-27 Degradation Analysis of Lithium Ion Batteries
C09-28 Effect of Impact Parameters on PWA Drop Durability
C09-31 Evaluation of Prestacking versus Stack and Reflow Package on Package PoP Assembly Process
C09-36 Shock & Drop Qualification of MEMS Structures for Hand-held Products
C09-37 Reliability Assessment of Power Electronic Inverter Design
C09-38 High Temperature Electronics Roadmap
C09-41 Counterfeit Parts Control Plan for the Trusted Aerospace Electronics Supply Chain
C09-47 Electrochemical Migration of Pb-free Printed Circuit Boards with Through-Hole and Surface Mount Components