SUMMARY OF THE PROJECTS
Created: 5/21/95 Updated: 4/18/97

Flexible Printed Circuit Design Guidelines

A.T. Chen, D.B. Barker
Point of Contact: dbarker@calce.umd.edu


Objectives

FPC design guidelines are needed for improved reliability in terms of usable ranges of material properties and geometry, rather, than specific materials and architecture, so as to not exclude alternate or future materials and concepts. Accurate life-estimation models that can answer fundamental design questions based upon the physics of failure are required.

Background

The two primary failure modes of FPCs are cracking of plated through-hole (PTH) barrels and lands and fatigue of the copper circuit traces. PTH failures are principally driven by thermomechanical stresses due to the CTE mismatch of the various layer materials. The copper circuit trace failures are driven both by thermomechanical stresses as well as the flexural stresses in the FPC. Very little fundamental research has been conducted on FPC design with respect to understanding and modeling active failure mechanisms.

Approach

The research effort this past year has been devoted to measuring and understanding the basic mechanical properties of the constituent materials in a typical FPC layup. Extensive testing was conducted on actual FPC samples, measuring the CTE, elastic modulus, and creep response of the material. Using this information, stress analysis modeling efforts will be started.

Work Accomplished