| Created: 10/24/95 |
Updated: 4/18/97 |
Project Number: C93-16
Physics-of-Failure Based Reliability Study
Point of Contact: Dr. Michael Pecht
email: pecht@eng.umd.edu
Phone: (301) 405-5323
Fax: (301) 314-9269
Objectives
Develop guidelines to facilitate incorporation of Physics-of-Failure tools
in product and process development stage of electronic systems.
Background
Physics-of-Failure (PoF) is an established design tool in many engineering
disciplines. This method is a design tool geared towards understanding
the root causes of failures. The underlying physics of the failures provide
tools for developing products that will have higher reliability.
Physics-of-Failure is a promising methodology for electronic systems
development. However, it is still slow in gaining acceptance in the
electronics. One of the reason for that is lack of understanding
on how these tools can be used in electronics system development steps
such as testing, accelerated testing, stress management. There is
a need for guidelines that companies can use for to introduce Physics-of-Failure
methodology in all phases of product development process.
Work accomplished
Various stages of electronic product development are studied with a view
to incorporate PoF in those stages. Documents to guide companies in incorporating
PoF tool in those stages are created and distributed. These documents include:
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Defect related reliability and screening levels
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Effects of manufacturing and design process variability on reliability
of electronics
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Accelerated testing
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Design and reliability assessment
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Tutorials on electronics failure mechanisms:
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Electromigration
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Material aging due to inter-diffusion
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Electrical overstress and electrostatic discharge
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Conductive-filament formation
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Material fatigue
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Radiation effect on polymers
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Mechanical wear modes and mechanisms
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Buckling
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Excessive elastic deformation
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Plastic deformation