Created: 10/24/95 Updated: 8/18/98

Combined System and Board Level Thermal Modeling of Electronic Enclosure

Project Number : C95-14

Point of Contact:

Dr. Yogi Joshi
CALCE EPRC
email: yogi@calce.umd.edu
Phone: (301) 405-5428
Fax: (301) 314-9269
Objectives Background Work Accomplised

Objective

Develop an integrated approach for thermal analysis of electronic systems from the box level to the package level, taking advantage of the CFD/CHT tools.


Background

There have been numerous studies conducted and software codes developed to perform thermal analyses at the component, board, and system levels. In general, the user selects a level of modeling and solves the resulting discretized equations numerically. A model for convective cooling may be based on the relatively new Computational Fluid Dynamics/Computational Heat Transfer (CFD/CHT) approach, or traditional semi-empirical techniques such as thermal network methodology or modified conduction analysis. Generally, in the traditional approaches for board and component level analysis, the effect of system boundaries on the micro-climate near the boards and components is ignored. Similarly, in a system level model, the details of heat dissipation at the board and component levels are ignored. This strategy is often used to keep the numerical simulation time within acceptable limits. In order to accurately predict thermal performance of the complete electronic system, all three levels of modeling (i.e. component, board, and system) must be performed in an integrated and efficient manner.


Work Accomplished

A general approach was developed for combined system and board level thermal analysis and was illustrated for two examples. The first was an indirect air cooled avionics chassis and the second a direct natural convection air cooled system. For each of these, system level computations were carried out first using CFD/CHT technique. The board level models were kept relatively simple for these calculations. The results of the system level analysis were used to determine heat transfer coefficients on the boards. As the second part of the analysis, convection coefficient information from the system level analysis was interpolated on a finer grid to construct a board level thermal model. Importance of including influence of system effects on PWB level analysis was illustrated. A new interface for pre and post processing was developed for the system level code. This allows convenient set up and display of information for system level problems.