ABBREVIATED REPORT ON NUMERICAL MODELING

Project Number : C96-14

A complete 3-dimensional system level CFD/CHT modeling of an electronic enclosure was carried out. Figure 1 describes the modeling domain. All the dimensions are in cm.

A horizontally oriented test board was placed in the middle of the Plexiglas enclosure. Figure 2 shows the relative location and the structure of the test board. A layer of Styrofoam was placed right under the PWB. The 4x4 array test modules are ceramic pin grid array packages (Figure 3 ). They are evenly located both along and across the flow directions on a epoxy fiberglass board.

  • Component modeling in the system level analysis

    At the system level, the test module was modeled as a simplified layered structure shown in Figure 4 . Totally three layers are used to replace the original structures. For each layer, the effective thermal properties are evaluated based on volume fraction average of each constituent part. The resulting effective conductivities for each layer are presented in Table 1 .

  • Equations for system level modeling

    Non-dimensionalized equations were employed in system level modeling:

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