Created: 11/05/04

Failure-Free Integrated Circuit Packages
Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements

Edited by Charles Cohn, Charles A. Harper

McGraw-Hill Professional, Two Penn Plaza, Now York, NY 10121-2298.

Worth more than a thousand words, each illustration in Failure-Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic package. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis technique.

Failure-Free Integrated Circuit Packages helps you:

• Find, identify, and correct potential failure before they occur
• Improve device reliability
• Learn form case studies of IC package failure modes
• Quickly locate failure through visual comparisons
• Apply state-of-the-art failure analysis techniques
• Comprehend the physics behind the failure mechanism
• Understand the limitations of reliability testing and lifetime estimation

Fundamentals of IC package technologies ReliabilityPhysics and chemistry of failures in packaged devices Strategies for locating failures Failure analysis techniques Failure modes common in organic IC packages Emerging assembly materials for IC packaging

ISBN: 0-07-143484-4
McGraw-Hill Professional
Two Penn Plaza
Now York, NY 10121-2298.