edited by F. Patrick McCluskey, R. Grzybowski, and T. Podlesak
CRC Press, Inc., New York, NY, 1997
High Temperature Electronics
The development of electronics that can operate at high temperatures has
been identified as a critical technology for the next century.
Increasingly, engineers will be called upon to design avionics and
automotive and geophysical electronic systems requiring components and
packaging reliable to 200 º C and beyond. Packaging and device
engineers
and technologists will find this book required reading for its coverage of
the techniques and tradeoffs involved in materials selection, design, and
thermal management and for its presentation of best design practices using
actual fielded systems as examples.
Features:
Based on research conducted at CALCE Electronic Packaging
Research
Center at the University of Maryland and supported by its over 40
industrial and governmental members
Chapter contributions by the leading industry and academic
experts
in electronic products
A unified treatment of all major aspects and applications of
high
temperature electronics
Suitable as a graduate text and as a valuable design guide and
reference