Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
Created: 6/15/97 Updated: 2/5/98
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
by Pradeep Lall, Motorola
Michael Pecht, CALCE
Edward Hakim, U.S. Army
CRC Press, New York, NY, 1997

Over the past six years, the CALCE has been studying and providing its members with information on the influence of temperature on microelectronics and system reliability. With the passing of the time limits of CALCE Consortium confidentiality, a book is now available to provide help in evaluating device architecture trade-offs and the effects of operating temperatures on device performance and reliability.

Various sections of the book address the steady state and cyclic temperature effects on electrical parameters and the reliability of both bipolar and MOSFET devices; identify models quantifying the temperature effects on package elements; and address the impacts of various design for temperature trade-offs on electronic systems. Temperature-related models are assessed in terms of their use for determining the maximum and minimum allowable temperature stresses for a given system architecture. Derating methods are also reviewed.

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Catalog number: 9450
May 1996, c., ISBN: 0-8493-9450-3
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