CALCE  Printed Wiring Assemblies

Release 2.1
CALCE - University of Maryland

What is PoF Software ?

CALCE PoF for PWAs Benefits and Capabilities

• Wide range of analysis capabilities and quicker iterations supports easier trade-off analysis, resulting in more robust designs
• Extensive parts, environment, and material databases
• Real-time design capability
• Calculation and data entry tasks improves automation productivity
• Leads to design process standardization
• Ability to examine data with other computer-aided engineering software
• Used successfully by DoD and private industry

User-friendly features

• Intuitive graphical interface and interactive graphics option
• Pull-down menus, pop-up windows, and dialogue boxes
• Documentation includes quick start tutorial and user guides, as well as interface and validation guides
• Training and technical support available
• Keyboard and mouse control

CALCE Software Objectives

• Provide software that incorporates reliability and costing tasks into the earliest stages of the design process.
• Enable design and reliability engineers to implement physics- of-failure design principles.
• Produce designs that result in cost-effective and reliable electronic components, PWBs, and systems.

CALCE Users include:

• Electronic packaging engineers
• Reliability engineers
• Maintainability engineers
• Electrical engineers
• Mechanical engineers

Integration Capabilities:

Import:
Mentor neutral file
Protel PCB format
PADS PCB format
CALCE ASCII format
Zuken-Recal CADIF - Under Development
VISULA - Under Development

Export:

Protel PCB format
AutoCAD DXF format
CALCE ASCII format

Description of CALCE Tools

• System Executive: Used to execute, edit, and create product hierarchies, which may include components, printed wiring board assemblies, boxes, sub-systems, and systems; define the mission profile; and access CALCE databases and utilities to maximize productivity.

• Component Database: Used to view, store, add, or edit component attributes.

• Materials Database: Used to create and edit extensive records of electrical, thermal, and mechanical properties of materials used in PWB construction.

• Environment Database: Used to create and edit environments which are used to apply external boundary conditions and stresses to individual PWB designs.

• Board Definition: Used to model the bare board and board features, such as vias, plated through holes, board stack up, and board outline.

  
  

  Board Manager Display (16K)
  
  
  
• Component Selection and Layout: Used to define the parts list and layout for a given design. Allows selection from component database as well as user defined parts. A component placement feature provides for two sided placement. An built-in automated placement feature allows for quick initial placements.

• Environmental Profiler: Used to create and edit life cycle or mission profile which will be applied to the PWB design. This feature is used analyze the PWB design under a variety of environmental conditions.

• Thermal Analysis: Models the cooling mechanisms conduction, forced convection through embedded fin structures, flow over components, and in-line rails and displays the results graphically. Natural convection may be included with any of these cooling mechanisms.

  
  

  Display Tool Display (32K)
  
  
  
• Vibration and Shock Analysis: Uses a finite element analysis (FEA) to determine the first three natural frequencies and mode shapes of a PWB. The PWB can be composed of a complex multi-layer composite structure. You specify the finite element boundary conditions and the mesh size degree of refinement.

• Fatigue Analysis for Solder Joints: Predicts the solder joint life to failure for J-leaded, gull winged, and leadless chip carriers from vibration cycles and thermal/power cycling. Calculated for corner solder joints because they experience the greatest deformation and/or effects due to thermal expansion mismatch.

  
  

  Vibration Analysis Display (21K)
  
  
  
• Fatigue Analysis for Plated Through Holes: Estimates PTH fatigue life when it is subjected to repeated thermal cyclic loads. The program calculates stress, strain, and cycles to failure.

• Printed Report Generator: Generates printouts of analysis results.

• Shock Analysis Tool: Provides the ability to make multiple shock assessments of the PWA. Determine whether part attach will survive a shock load.

• PWA Sensitivity Tool: Provides the ability to make multiple sensitivity assessments of the PWA. The tool provides a text parameter entry system and a graphical display of analysis results.

Hardware Requirements of Sparc Compatible Computer

System: Sun Sparc/Ultra Station with Color Monitor

 Operating Environment: SunOS 4.1.x; Solaris 2.4 or or higher.

 Window Systems (Sun 4.1.X only): X Windows Version X11R4 or later; OSF Motif runtime version 1.2

 Software: HTML Browser

 Memory: 32 MB or more RAM 180 MB available hard disk space.

 Disk Storage: 90 MB for system, approximately 8 MB per PWA model.

 Installation Media: Internet Download, 8mm data cartridge, 1.25" data cartridge tap drive for installation.