Data Requirements for calcePWA Analysis

A brief outline of the information required to perform a calcePWA Physics of Failure Analysis 

is provided below:
 
   

Component Information:

Package Length
Package Width
Number of Pins (I/O)
Lead Style
       Lead Dimensions 
       Lead Material
Actual Power Dissipation Rate 
Theta JC
Package Material

Assembly Related Information

Package Standoff 
Standoff Volume (Filled/Unfilled)
Fill Material
Center Position on Board (X,Y)
Board Side (Top/Bottom) 

Board Information:

Number of Layers
Layer Material
Layer Thickness
Board Outline (xi,yi)..(xn,yn)

Via/Plated Through Holes

Minimum Drill Size
Plating Thickness
Plating Material
Filled/Unfilled

 Board Information (continued)

Minimum Feature Sizes*

Line to Line Spacing
Line to Pad Spacing
Pad to Pad Spacing
Line to Pad Spacing
Pad to Plane Spacing
Pad to Line Corner Spacing
Non Plated Though Hole to Line Spacing

Assembly Related Information*

Solder Mask (Yes/No)
Tin/Lead Coat (Yes/No)
Post Coat (Yes/No)

Operational Information:

Maximum Voltage Bias* 
Support Points/Type
Heat Sink Locations and Temperatures.

Environmental Information:

Ambient Temperature 
        Maximum
        Minimum
Relative Humidity*
Operational PSD profile
Worst Case Shock Profile 
Amplitude
Duration
Wave Form
 

* - These parameters are required for conductive filament formation.

The calcePWA Physics of Failure Evaluation will provide:
                    1) Temperature profile of the PWA.
                    2) Displacement profile of the PWA.
                    3) Minimum component case and junction temperatures.
                    4) Minimum temperature cycles to component solder and lead failure.
                    5) Minimum vibrational cycles to component solder and lead failure.
                    6) Minimum temperature cycles to barrel failure of worst case plated through hole.
                    7) Time to failure due to conductive filament formation.*

* not implemented.