May 24-25, 2011
Room 1202 Martin Hall
University of Maryland
College Park, MD
Joan Lee
(joanyuan@calce.umd.edu)
$500 (20% discount for IPC members and CALCE members) REGISTER
TODAY!
CALCE and IPC
will sponsor a technical seminar from May 24-25, 2011 at the University
of Maryland’s College Park Campus. This seminar is intended to provide
attendees with an interactive forum to discuss the latest concerns, trends
and technologies in electronics that impact product reliability. CALCE, IPC
and Members of the JISSO International Council,
will speak on embedded technologies, batteries, environmental regulations,
counterfeit avoidance, test and simulation methods, as well as the emerging
field of prognostics.
Attendees will also get a snapshot of both integrated electronics
development and manufacturing, and receive valuable input on technologies
that
will impact the electronics industry over the next 10 years. If you want to
gain a comprehensive understanding of the key issues in electronic interconnections,
this seminar is a must.
About the organizers
The purpose of the Jisso
International Council is to facilitate,
coordinate, and promote the orderly implementation of advanced electronic
packaging
and other advanced technologies by standardization and other means. The Council
is supported by three main regional groups in each of three global hemispheres.
These are the Jisso Japan Council (sponsored by JEITA, JPCA), the Jisso North
American Council (sponsored by IPC, JEDEC, and iNEMI), and the Jisso
European Council (sponsored by the EIPC).
Location and Hotel Accommodations
The event will be held on the campus of the University
of Maryland. You can find local accommodations by visiting
http://www.uga.umd.edu/admissions/visit/accommodations.asp
The Holiday Inn, Greenbelt, MD, located just minutes from
the College Park campus, will be holding a block of rooms open until Tuesday,
May 3.
Attendees may reserve these rooms at a reduced rate ($119/night)
by identifying themselves as part of the 'Jisso' group. Visit:
http://www.holidayinn.com/hotels/us/en/greenbelt/wasgb/hoteldetail
to learn more.
Click Here for
directions to the University of Maryland Campus
Registration
(joanyuan@calce.umd.edu)
$500
(20% discount for IPC members and CALCE members)
REGISTER
TODAY!
May
24th |
8:00 am Coffee,
Refreshments |
|
Welcome |
CALCE |
Jisso Background/Programs
|
Denny Fritz
– MacDermid, Inc |
CALCE specific programs/results
|
Michael Osterman,
CALCE |
Nanotechnology in assembly |
Alan Rae,
Tpf Enterprises (invited) |
10:00
am Break – Martin Building Lobby |
3D Semiconductor Package,
Assembly and Test Challenges |
Vern Solberg,
Tessera |
Robust laminate materials
that are not at their limit of capability |
Silvio Bertling,
NELCO (invited) |
Tin Whiskers Risk and
Mitigation Strategies |
S. Han, CALCE
|
12:00
pm Lunch – |
Solderless Interconnect
|
Joe Fjelstad,
Verdant Electronics |
Counterfeit Part Detection
Methods |
Bhanu Sood,
CALCE |
Embedded Component Activity
in Europe |
Michael Weinhold.
EIPC |
Data transfer through
participants in the supply chain handoff |
J. Messina,
NIST |
3:00 pm Break -
Martin Building
Lobby |
IPC program on environment /td>
| Stephanie Castorina
-IPC |
Status of pertinent
Environment regulation |
Krista Crotty,
Alberi EcoTech |
Sustainability Concerns
In Electronic Production |
Carol Handwerker,
Purdue University |
iNEMI Environmental Inititiative |
Bob Pfahl, iNEMI |
May
25 – Day 2 of the CALCE Seminar (Reliability) |
8:00 am Morning
Coffee – Martin Building Lobby |
Reliability
overview |
Jack Fisher |
Collision
of Quality and Reliability Requirements |
Bill Dieffenbacher, BAE
– |
Reliability
of Embedded Capacitors |
Mohammad Alam, CALCE
|
Reliability
of Lithium Ion Batteries |
Nick Williard, CALCE |
10:00
am Break |
PWB Stress
Testing- Current Status. |
Mark Northrup, IEC Electroncis
|
Assembly
Stress Testing – Current Status |
Abhijit Dasgupta, CALCE |
CALCE Prognostics
and Health |
Nikhil. Lakhkar - CALCE |
Noon-Adjourn
|
|
