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The CALCE Electronic Products and Systems Center's Lead Free Forum is dedicated to the collection, generation, organization, and dissemination of information related in the manufacture, assembly, and fielding of lead free and "green" electronic products and systems.

Current Issues and Events:

The CALCE Electronic Products and Systems Center's Lead Free Forum is dedicated to the collection, generation, organization, and dissemination of information related in the manufacture, assembly, and fielding of lead free and "green" electronic products and systems.

• Current Issues and Events:
• Proceedings of Symposium on ROHS Impact of Printed Wiring Assembly Rework/Repair and Part Reprocessing (9/11/2007)
• Briefing to LEAP Working Group (9/5/2007)
• International Symposium on Tin Whiskers (April 24-25, 2007)
• SMTA On-line Presentation (12/5/2006)
• CALCE Initiates Two New Long-term Pb-free Studies (11/29/2007)
• CALCE Releases Tin Whisker Risk Assessment Software CALCE has released a new software for estimating the failure risk posed by tin whisker growth on electrical conductors in electronic hardware.
• CALCE Releases Pb-free Solder Fatigue Life Software CALCE has released a new software for estimating the life expectancy of solder joints in electronic hardware under temperature cycle loading. The new model is for SAC solder, the most widely adopted Pb-free solder.
• Lead-free Electronics A new reference book for Pb-free electronics is now available from CALCE EPSC Press. (CALCE Consortium Members)
• Tin Whisker Studies Information related to the tin whisker as a potential source of failure in electronic hardware.

Lead Free Forum Point of Contact: M. Osterman

Please Mail Inquires to - leadfree@calce.umd.edu