Lead-free Electronics A new reference book for Pb-free electronics is now available from CALCE EPSC Press. (CALCE Consortium Members)

Tests on the Relationship between the Oxide Thickness of CMOS Chips and Their Resistance to Gamma Radiation, A. Tokuhiro, M. Bertino, H. Dharavat, J. Munson, J. Farmer, M. Pecht, and D. Das.

Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy, Y. Deng, M. Pecht, and K. Rogers.

Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-Plated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests, P. Zhao, M. Pecht, S. Kang, and S. Park.

Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, EEE Transactions on Device and Materials Reliability.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, ITHERM Conference, San Deigo, CA, May 30, 2006.

Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, EEE Transactions on Device and Materials Reliability.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells - Experimental Approach, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, Capacitor and Resistor Technology Symposium, Orlando, FL, pp. 15-25, April 3-6, 2006.

Lead-Free Assemblies in High Temperature Applications, A. Choubey, J. Wu, S. Ganesan, and M. Pecht, Proceeding of IMAPS International Conference on High Temperature Electronics (HITECH 2006), May 2006.

Effect of Aging on Pull Strength of SnPb, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components, A. Choubey, D. Menschow, S. Ganesan, and M. Pecht, Journal of SMTA, Vol. 19, Issue 2, pp. 33-37, April 2006.

Comparison of Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Eutectic Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, Capacitor and Resistor Technology Symposium, Orlando FL, pp. 15-25, April 3-6, 2006.

Electronic Device Encapsulation Using Red Phosphorus Flame Retardants, M. Pecht and Y. Deng, Microelectronics Reliability, Vol. 46, Issue 1, pp. 53-62, January 2006.

Failures in Semiconductor Device Encapsulated with Red Phosphorus Flame Retardant, Y. Deng and M. Pecht, 11th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition, pp. 399-404, January 17-19, 2006.

Cyclic Mechanical Durability Of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, G. Cuddalorepatta and A. Dasgupta, ASME International Mechanical Engineering Congress and RD&D Expo, Orlando, FL, November 5-11, 2005.

The Story Behind the Red Phosphorus Mold Compound Device Failures, Y. Deng and M. Pecht, 2005 International Symposium on Electronics Materials and Packaging (EMAP2005), pp. 1-5, Tokyo, Japan, December 11-14, 2005.

Lead-free Assembly Defects in Plastic Ball Grid Array Packages, S. Ganesan, G. Kim, J. Wu, M. Pecht, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 219-223, Wroclaw, Poland, October 23-26, 2005.

Effects Printed Circuit Board Materials on Lead-free Interconnect Durability, H. Qi, S. Ganesan, J. Wu, M. Pecht, P. Matkowski, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 140-144, Wroclaw, Poland, October 23-26, 2005.

A Tin Whisker Risk Assessment Algorithm, T. Fang, M. Osterman, and M. Pecht, 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, pp. 61-65, Philadelphia, PA, September 25-29, 2005.

Reliability Issues of No-Clean Flux Technology with Lead-Free Solder Alloy for High Density Printed Circuit Boards, S. Zhan, M. Azarian, and M. Pecht, 38th International Symposium on Microelectronics, pp. 367-375, Philadelphia, PA, September 25-29, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Key Concerns in the Assembly of Lead-Free Electronics, V. Eveloy, Y. Fukuda, S. Ganesan, J. Wu, and M. Pecht, Proceedings IMAPS Taiwan 2005 International Technical Symposium, pp. 167-183, June 2005.

Assessment of Long-term Reliability in Lead-free Assemblies, S. Ganesan, J. Wu, and M. Pecht, International Conference on Asian Green Electronics, Session 3, pp. 140-155, Shanghai, China, March 15-18, 2005.

Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, Proceedings of 2004 International IEEE Conference on Asian Green Electronics, pp. 127-125, 2004.

The Impact of Lead-Free Legislation Exemptions on the Electronics Industry, M. Pecht, Y. Fukuda and S. Rajagopal, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 4, pp. 221-232, October 2004.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, and C. Hillman, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2.004.

Has the Electronics Industry Missed the Boat on Pb-Free Failures in Ceramic Capacitors with Pb-Free Solder Interconnects, N. Blattau and C. Hillman, IPC/JEDEC 5th International Lead Free Conference on Electronic Components and Assemblies, San Jose, CA, March 18-19, 2004.

Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker and C. Hillman, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Questions Concerning the Migration to Lead-free Solder, R. Ciocci, and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 34-40, 2004.

Assessing Lead-free Intellectual Property, P. Casey and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 46-51, 2004.

Evaluation of Selected Japanese Lead-Free Consumer Electronics, Y. Fukuda, P. Casey and M. Pecht, IEEE Transactions on Electronics Packaging Manufactruing, Vol. 26, No. 4, pp. 305-312, October 2003.

Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Envirionments, D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, A. Dasgupta, The SMTA International Annual Conference, September 21-25, 2003, Chicago, IL, USA.

Lead-Free Soldering in the Japanese Electronics Industry, Y. Fukuda, M. Pecht, K. Fukuda and S. Fukuda,IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 616-624, September, 2003.

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders, Q. Zhang, A. Dasgupta and P. Haswell, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.

Isothermal Mechanical Creep and Fatigue of Pb-free Solders, Q. Zhang, P. Haswell and A. Dasgupta, International Brazing &Soldering Conference, San Diego, CA, February 16-19, 2003.

The Technical, Social and Legal Outlook for Lead-Free Solders, P. Casey and M. Pecht, IEEE International Symposium on Electronic Material and Packaging, pp. 483-492, Kaohsiung, Taiwan, December, 2002.

Challenges for Adopting Pb-Free Interconnects for "Green" Electronics, P. Casey and M. Pecht, IPC/JEDEC International Conference on Lead-Free Electronic Components and Assemblies, pp. 21-32, Taipei, Taiwan, December 10-12, 2002.

Isothermal Mechanical Fatigue of Pb-free Solders: Damage Propagation Rate & Time to Failure, Q. Zhang, P. Haswell, A. Dasgupta and Michael Osterman, 34th International SAMPE Technical Conference, Baltimore, MD, November 4-7, 2002.

Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys, Q. Zhang, P. Haswell and A. Dasgupta, Proceedings ASME IMECE 2002, New Orleans, LA, November 17-22, 2002.

Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts, J. Wu and M. Pecht, Proceedings of the 4th Electronics Packaging Technology Conference, Singapore, pp. 20-24, December 10-12, 2002.

Impact of environmental Regulations on Electronics Manufacture, Use and Disposal, R. Ciocci, J. Wu and M. Pecht, European Microelectronics Packaging and Interconnection Symposium Cracow, Poland, pp. 73-80, June 16-18, 2002.

Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu, Y. Zheng, C. Hillman, P. McCluskey, to be presented on Proceedings of the 52nd Electronic Components & Technology Conference, San Diego, 2002.

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints, Y. Zheng, C. Hillman, P. McCluskey, to be presented on AESF SUR/FIN 2002 June 24-27, Navy Pier, Chicago, IL.

Microthermomechanical Analysis of Lead-Free Sn3.9Ag0.6Cu Alloys; PartI: Viscoplastic Constitutive Properties; and PartII: Cyclic Durability Properties, Haswell,P. and Dasgupta, A. Paper N2.1, MRS Proceedings, Vol. 682E, MRS Spring Symposium on Microelectronics and Microsystems Packaging; Editors: Boudreaux, Dauskardt, Last, and McCluskey, Chicago, 2001.

Electrical Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu, M. Pecht, and R. Mroczkowski, Journal of Surface Mount Technology, Vol. 14, Issue. 2, June 2002. Also presented at Pan Pacific Microelectronics Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002

Lead-free Solder Replacement: Beyond the Material Substitution, R. Ciocci, Environmentally Conscious Manufacturing II, Vol. 4569, pp. 100-108, Newton, USA, 28-29, October 2001.

Lead-free Solder and the Consumer Electronics Market, R. Ciocci, Proceedings of 2001 Green Engineering Conference, July 29-31, 2001, Roanoke, VA.