Mixed (Pb-free Parts/SnPb Paste) Assembly Consortium

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The CALCE Mixed (Pb-free Parts/SnPb Solder) Assembly Consortium Study was initiated in Fall 2006 to examine the reliability of interconnects formed in mixed (Pb-free Parts/SnPb Solder) assemblies. Testing includes:
  • Temperature Cycling (-40 to 125 oC)
  • Random Vibration
  • Lead Pull Strength
  • Microstructural Analysis

Study Participments

  • Emerson
  • Goodrich Control Systems, UK
  • Hamilton-Sunstrand
  • Lockheed Martin

    Request Participant's Web Account

    Postings:

    Impact of Board pad finish on the SnPb and Lead-free Solder Interconnect Reliability for Leadless Chip Resistors under Random Vibration Loading (Participant's Web Account Required)

    Vibration Step Stress Test Report (Participant's Web Account Required)

    Status Presentation May 2007 (Participant's Web Account Required)

    Temperature Cycle (-40 to 125 oC) Test Data (Participant's Web Account Required)

    Microstructural Analysis Report (Participant's Web Account Required)

    Pull Strength Report (Participant's Web Account Required)

    Point of Contact: M. Osterman


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