Tin Whisker Alert
A failure mode is re-emerging that has been responsible for the loss of billions of dollars worth of satellites, missiles and other equipment - electrically conductive 'tin whiskers'. Tin whiskers can develop under typical operating conditions on any product type that uses lead-free pure tin coatings. Driven by the accelerating movement to lead-free products, tin whiskers pose major safety, reliability and potential liability threats to all makers and users of high reliability electronics and associated hardware. Existing approaches are not sufficient to control tin whiskering in high-reliability systems. The risk is here now, and unless decisive action is taken soon to fund development and implementation of a strategic action plan to devise short-term stopgap procedures and medium-term investigation of mitigation alternatives, serious consequences are inevitable.Tin Whisker Information
Latest information can be found at http://www.calce.umd.edu/tin-whiskers/
Tin Whisker Alert (Whitepaper) A candid discussion of the concern over failures in electronics related to "tin-whiskers" and its potential re-emergence due to the move lead-free solders.
Tin Whisker Risks (Whitepaper) A technical discussion of the "tin-whiskers" phenomenon, current knowledge and remaining questions.
Tin Whisker Experiences (Whitepaper) A collection of experiences where "tin-whiskers" have been observed.
Tin Whisker Mitigation Guide (Whitepaper) A guide for mitigating the risk of tin-whiskers as a failure source in electronic hardware.
| ISO 9001 |
Acronyms | Related Sites |
| Site Map
Copyright © 2008 by CALCE and the University of Maryland, All Rights Reserved