Point of Contact: Michael Osterman (osterman@calce.umd.edu)

Estimating the cyclic fatigue life of solders is important in design and assessment of electronic equipment.  Over the past few years, CALCE has conducted extensive tests to determine the temperature cycle durability of select lead-free solders. This presentation will cover the testing, test results and models derived from this work.  In particular, SN100C and SAC305 solders will be discussed.

About Presenter:

Dr. Michael Osterman (Ph.D. Mechanical Engineering, University of Maryland, College Park) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman is one of the principle researchers in the CALCE effort to develop simulation models for failure of Pb-free solders. In addition, he has lead CALCE in the study of tin whiskers since 2002 and has authored several articles related to the tin whisker phenomenon. Further, he has written various book chapters and numerous articles in the area of electronic packaging. He is a member of ASME, IEEE and SMTA.