Point of Contact: Michael Osterman (osterman@calce.umd.edu)

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While reworked/repaired SMT assemblies have been assumed to be as good as new, CALCE Project C05-07 demonstrated that this may not be the case. As a result, an expanded rework/repair study was initiated under C07-07. The rework project continued under C08-07 and is expected to be completed under C09-07. This webinar will provide an overview of the project and the findings to date.

About Presenter:

Dr. Michael Osterman (Ph.D. Mechanical Engineering, University of Maryland, College Park) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman is one of the principle researchers in the CALCE effort to develop simulation models for failure of Pb-free solders. In addition, he has lead CALCE in the study of tin whiskers since 2002 and has authored several articles related to the tin whisker phenomenon. Further, he has written various book chapters and numerous articles in the area of electronic packaging. He is a member of ASME, IEEE and SMTA.