This webinar will provide of review of on-going research associated with failure of printed wiring assemblies under static and dynamic flexural loading.

About the Presenter:

Prof. Abhijit Dasgupta is a professor of Mechanical Engineering at the University of Maryland. His research focus includes Mechanics of electronic packaging materials and “smart” composite materials; research focused on nanomechanics, micromechanics, damage mechanics and computational mechanics.

For more information see bio