LED Assembly, Reliability & Testing Symposium - November 28 - November 30, 2017

Conference Chair - Dr. Diganta Das (diganta@umd.edu), Ph.D., CALCE/University of Maryland



  



Light emitting diodes (LEDs) is increasingly the technology of choice in lighting and display applications. LEDs offer design flexibility, from zero-dimensional (dot-scale lighting) to three-dimensional lighting (color dimming using combination with different colors). LEDs have small exterior outline dimensions while offering high-energy efficiency that results in lower power consumption. With appropriate thermal management, LEDs can have longer lifespans than conventional lighting sources. LEDs are also eco-friendly products with less UV radiation and no mercury.

LEDs had a rapid progression from research laboratories and academic institutions to store shelves and light sockets. This aggressive adoption curve has made LEDs ubiquitous across multiple applications, including automotive, industrial, sports, and entertainment lighting systems. However, the main challenge to an even wider deployment platform for LEDs is the disconnect between the potential performance observed in laboratories and the real performance observed in the field. Also of concern is the ability to assemble LEDs into systems in a manner consistent with end product quality and reliability expectations.

The LED Assembly, Reliability & Testing (A.R.T.) Symposium will provide attendees with information to bridge the gap between the semiconductor physics and the architectural design level issues in LED supply chain. The design, manufacturing, reliability assessment, testing and inspection of LEDs and LED lighting products are not at the same level of development and interest. The LED A.R.T. Symposium is the forum for the industry to explore the problems faced and offer solutions.

The topics of interest include, but not limited to:

  • LED Assembly
  • Package and Board Cleaning
  • LED Failure Mechanisms
  • Architectural/Smart Lighting
  • LED Packaging
  • Ultraviolet and Infrared LEDs
  • Applications
  • Wearable Sensors-LEDS
  • Reliability and Testing
  • LED Driver Systems
  • If you would like to present at this conference, please submit a 200-300 word abstract by July 1, 2017. Please include a title, author name, and contact information with your abstract. You can also submit proposals for half or full day tutorials.

    Technical Committee

    Diganta Das, Ph.D., CALCE University of Maryland

    Bill Cardoso, Ph.D., Creative Electron

    Chips Chipalkatti, Ph.D., Dr. Chips Consulting LLC

    Gyan Dutt, Alpha Assembly Solutions

    John Radman, NTS

    Steve Yang, Ph.D., Soraa, Inc.

    For more information on the conference, exhibition, or sponsorship opportunities, please contact Jenny Ng at 952-920-7682. For more information on the Technical Program and Tutorials, contact the Program Chair, Dr. Diganta Das.


    Organized by:
    Mountain View Mountain View



    The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products, and systems.

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