LED Assembly, Reliability, and Testing (A.R.T.) Symposium
Technical Symposium & Expo: November 28-29, 2017
Workshops: November 30, 2017
Research Triangle Park, NC
Program Chair: Dr. Diganta Das, CALCE (diganta@umd.edu)
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Tuesday, November 28 |
Topic |
Speaker |
Session 1: Opening Session |
Opening Remarks
|
Diganta Das, Ph.D., CALCE, University of Maryland |
Keynote Address 1: High Power LED Solder Joint Reliability
|
Ralph C. Tuttle, CREE |
Session 2: LED Applications |
Optical Wireless Communication Using LEDs for Smart Lighting IoT
|
John Muth, North Carolina State University |
High Reliability Solder Alloy for Automotive LED Applications
|
Jie Geng, Ph.D., Indium Corporation |
Counterfeit LEDs and How to Detect Them
|
Diganta Das, Ph.D., CALCE, University of Maryland |
Session 3: LED Packaging |
Solder Alloy Selection for LED Die Bonding and Package Assembly
|
Nicholas Herrick, Alpha Assembly Solutions |
Bonding a Ceramic XLamp� to an Al Heatsink with a Very Thin Bondline Using BondFlowT
|
Richard Koba, Ph.D., Materion and Jim Fravillig, Fraivillig Technologies |
Flexible Reel-to-Reel Multi-Component LED Assembly Production
|
Gerald Steinwasser, M�hlbauer |
Session 4: Failures and Failure Mechanisms |
Creating Pad Peeling Failure Mechanisms with Reverse Voltage and Humidity for Chip LEDs
|
�nder S�netci, Arcelik |
Understanding LED Failures
|
Martine Simard-Normandin, Ph.D., MuAnalysis Inc. |
LED Faults Found by 2D and CT X-Ray
|
Keith Bryant, Yxlon International |
Wednesday, November 29 |
Session 5: LED Luminaires |
Keynote Address 2: Assembly, Reliability, and Testing (A.R.T.) of LED Luminaires
|
Warren Weeks, Hubbel Lighting Inc. |
Mimicking Real LED Lamp Stress Factors: Thermal Cycling in Luminaires and Lamp Failure Analysis
|
Kelly Roundtree, RTI International |
Session 6: LED Solder Joint Reliability and Processing |
Failure in LED Interconnects: Effects of Substrate Material and Solder Alloy
|
Maxim Serebreni, DfR Solutions |
The Development of a Novel Solder Alloy to Improve LED Solder Interconnect Durability
|
Mehran Malalekian, Ph.D., AIM |
Non-Destructive Hand Rework of LED Assemblies
|
Aaron Caplan, PACE Worldwide |
Session 7: Board Processing with LEDs |
Solder Flux Cleaning, Reliability, and Optical Performance of UV Flipchip LEDs
|
Nicholas Herrick, Alpha Assembly Solutions |
LED Cleanliness Risk Assessment and Process Control at the Assembly Site
|
Mike Bixenman, DBA, KYZEN Corporation |
Closing Comments
|
Diganta Das, Ph.D., CALCE, University of Maryland |
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