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Symposium on Reprocessing Tin Whisker Mitigation, and Assembly Rework (2008)
November 11-12, 2008
The Samuel Riggs IV Alumni Center
University of Maryland
College Park, 20742
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November 11, 2008 (Tuesday)
| Session I |
Welcome / Introduction
Michael Osterman, CALCE |
GEIA Standardization Activities Related to
Lead-free Materials
Anduin Touw, Boeing
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CALCE Study on BGA Reballing
Lei Nie, CALCE |
Value-add Solutions for the BGA Supply Chain
J. Carrigan and N. Leonardi , Premier |
| Sesion II |
BGA Reballing Reliability
Ray Cirimele, BEST |
Interfacial Reactions between Sn63-Pb37 Solder and ENIG and Electrolytic Nickel Under-Ball-Metallization
Minerva Cruz and Russell. Winslow, Six Sigma |
OEM Perspective on BGA Reballing
Michael Davisson, Agilent
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| Session III |
Manual Pretinning of COTS components
James Lake, Lockheed Martin |
CALCE Study on Reliability of Assembled Solder Dipped Parts
Diganta Das, CALCE |
Effectiveness of Solder Dip as a Whisker Mitigation Strategy
Sony Mathew, CALCE
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| Session IV |
Overview of GEIA Handbook on Repair and Rework of Lead Free Electronics
Tim Kalt, WPAFB |
Issues Related to Mixed Solder Assemblies and Assembly Rework
Polina Snugovsky, Celestica
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Assembly Rework and Lead-free Impact
Bob Farrell, Benchmark |
CALCE Study on Lead-free and Mixed Solder Rework
Michael Osterman, CALCE |
November 12, 2008 (Wednesday)
| Session I |
Tin Whisker Failure Risk
Jay Brusse, Perot Systems/NASA Goddard |
Tin Whisker Risk Assessment
(Paper)
David Pinskey, Raytheon
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Safety/Reliability Risk Management Process to Mitigate the Effects of Tin Whiskers
David Humphrey, Honeywell |
Tin Whisker Review of BOM
David Cavanaugh, Benchmark
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| Sesion II |
Evaluation of Conformal Coatings as a Tin Whisker Mitigation Strategy, Part III
Tom Woodrow, Boeing |
Tin Whisker Containment with Flexible Ceramic Conformal Coatings
Ofer Sneh, Sundew Technologies |
Update on POSS-thiol Based Mitigation of Sn-Whiskers
Raymond Thompson, Vista Engineering
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| Session III |
CALCE Tin Whisker Growth Tests
(Whisker Growth Video)
Lyudmyla Panashchenko , CALCE |
The Use of Tin/Bismuth Plating for Tin Whisker Mitigation on Fabricated Mechanical Parts
David Hillman, Rockwell Collins |
Whisker/Hillock Formation
on Indentation Stressed Sn Film
Kil-won Moon, NIST
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| Session IV |
Tin Whisker and Surface Defect Formation on Electroplated Films and Reflowed Joints
Carol Handwerker,
Aaron Pedigo, and John
Blendell, Purdue University |
Shorting Propensity of Tin Whiskers
Sungwon Han, CALCE
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