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Workshop on Testing Lead-free Electronic Assemblies (2009)
April 14, 2009
Kimm Engineering Building
University of Maryland
College Park, 20742
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April 14, 2009 (Tuesday)
| Session I |
Welcome / Introduction
Michael Osterman, CALCE |
The Need for a Standard Approach for Testing of Lead-free Assemblies
Anthony J. Rafanelli, Raytheon
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Physics-of-Failure (PoF) Based Accelerated Stress Testing
Abhijit Dasgupta, CALCE |
Post Assembly Testing
of Lead Free Assemblies
Robert Farrell, Benchmark |
| Sesion II |
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
Gary Efronson, Fischer Technology |
Lead-free Reflow – Effects on PCB Material Properties
Bhanu Sood, CALCE |
Ball Shear Test and Cold Bump Test of Ball Grid Array Package
Lei Nie, CALCE
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SIR and Electrochemical Testing
Michael Azarian, CALCE |
| Session III |
Isothermal Aging Impact on Solder Interconnect Durability
Preeti Chauhan , CALCE |
Temperature Cycle Testing and Acceleration Factors for Lead-free Assemblies
Michael Osterman, CALCE
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High-Cycle Fatigue Testing of Lead-free vs. Sn-Pb Solder Joints
Nathan Barry, Aero Engine Controls |
Vibration Testing of Lead-free Assemblies
M. Al-Bassyiouni, CALCE
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| Session IV |
Torsion Testing of Electronic Assemblies
Vikram Srinivas, CALCE |
Drop Testing for Lead-free Assemblies
Abhijit Dasgupta, CALCE |
CALCE Tin Whisker Growth Tests
Lyudmyla Panashchenko , CALCE |
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