Tin Whisker Analysis of Toyota's Electronic Throttle Controls, B. Sood, M. Osterman and M. Pecht, Circuit World, Vol. 37, No. 3, 2011, pp. 4–9

Effectiveness of Conformal Coatings on Surface Mount Components as Tin Whisker Mitigation, S. Han, C. Johnson, M. Osterman, M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011

Likelihood of Metal Vapor Arc by Tin Whiskers, S. Han, M. Osterman, M. Pecht, IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications, Linthicum Heights, MD, May 17-19, 2011

Electrical Shorting Propensity of Tin Whiskers, S. Han, M. Osterman, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, No. 3, July 2010

Tin Whisker Reliability in Microelectronics, T. Shibutani, Q. Yu, and M. G. Pecht, Micromaterials and Nanomaterials, Issue 9, pp. 49-53, 2009.

Examination of Nickel Underlayer as a Tin Whisker Mitigator , Lyudmyla Panashchenko and Michael Osterman, Electronic Component and Technology Conference, May 2009.

Tin Whisker Reliability in Microelectronics, T. Shibutani, Q. Yu, and M. G. Pecht, Micromaterials and Nanomaterials, Issue 9, pp. 49-53, 2009.

Standards for Tin Whisker Test Methods on Lead-Free Components, Tadahiro Shibutani, Michael Osterman, and Michael Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, pp. 216-219, March 2009.

Evaluation of Pure Tin Plated Copper Alloy Substrates for Tin Whiskers, S. Mathew, M. Osterman, M. Pecht, and F. Dunlevey, Circuit World, Vol. 35, No. 1, pp. 3-8, 2009.

Pressure-induced Tin Whisker Formation, T. Shibutani, Q. Yu, M. Shiratori, M. Pecht, Microelectronics Reliability, Vol. 48, pp. 1033-1039, 2008

Assessment of Risk Resulting from Unattached Tin Whisker Bridging, T. Fang, S. Mathew, M. Osterman, and M. Pecht, Circuit World, Vol. 33, No. 1, pp. 5-8, 2007.

Tin Whiskers: How to Mitigate and Manage the Risks, S. Mathew, M. Osterman, T. Shibutani, Q. Yu and M. Pecht, Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, pp.1-8, Shanghai, China, June 26-28, 2007.

The Impact of Electrical Current, Mechanical Bending, and Thermal Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 1, pp. 88-92, January, 2007.

The Effect of Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No. 4, pp. 252-258, October 2006.

Statistical Analysis of Tin Whisker Growth, T. Fang, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 46, Issues 5-6, pp. 846-849, May-June, 2006.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

A Tin Whisker Risk Assessment Algorithm, T. Fang, M. Osterman, and M. Pecht, 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, pp. 61-65, Philadelphia, PA, September 25-29, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Tin Whisker Mitigation Study Draft Report (CALCE EPSC Members Only) T. Woodrow (Boeing), B. Rollins (Raytheon), R. Ogden (Raytheon), P. Nally (NAWC)
A draft report detailing experiments conducted to examined the effect of various environmental exposures on the growth of tin whiskers. This study examines "bright-Sn" on brass and alloy 42 substrates and provides limited assessment of the effectiveness of conformal coats on containing whiskers.