CALCE Tin Whisker Research

Tin Whisker: Articles

CALCE faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 400 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the tin whiskers is presented below.

Articles

The Impact of Electrical Current, Mechanical Bending, and Thermal Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 1, pp. 88-92, January, 2007.

The Effect of Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No. 4, pp. 252-258, October 2006.

Statistical Analysis of Tin Whisker Growth, T. Fang, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 46, Issues 5-6, pp. 846-849, May-June, 2006.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

A Tin Whisker Risk Assessment Algorithm, T. Fang, M. Osterman, and M. Pecht, 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, pp. 61-65, Philadelphia, PA, September 25-29, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Tin Whisker Mitigation Study Draft Report (CALCE EPSC Members Only) T. Woodrow (Boeing), B. Rollins (Raytheon), R. Ogden (Raytheon), P. Nally (NAWC)
A draft report detailing experiments conducted to examined the effect of various environmental exposures on the growth of tin whiskers. This study examines "bright-Sn" on brass and alloy 42 substrates and provides limited assessment of the effectiveness of conformal coats on containing whiskers.