Eric Stellrecht, Prof. B.T. Han and Prof. Michael Pecht, of the CALCE Electronic Products and Systems Center won the Best of the Year paper for the article "Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages" published in the IEEE Transactions on Components and Packaging Technologies. The paper was selected from among all the manuscripts published in 2004 which included many outstanding international papers.

The authors will be given the award at the 55th Electronic Components and Packaging Technology Conference (ECTC) in Orlando, Florida on 2 June 2005. The award includes $2500 cash prize (shared by the authors) and a certificate for each author.