CALCE Researchers Receive Best Paper Honor at 2008 IMAPS Symposium

On November 4, CALCE researchers Gustavo Plaza, Dr. Michael Osterman, and Dr. Michael Pecht received the Best Paper of Session award for their paper “Vibration Durability of Mixed Solder Interconnects” at the 41st International Symposium on Microelectronics. The symposium, hosted by the International Microelectronics and Packaging Society at the Rhode Island Convention Center, focused on current developments in microelectronics packaging and was comprised of over 200 presentations, 17 professional development courses, and 200+ technology showcase and exhibition booths. Nominees for the Best Paper of Session Award are selected by the session chairs. After reviewing and discussing selected papers, session judges select award recipients according to IMAPS internal rating system.

In their study, Mr. Plaza, Dr. Osterman, and Dr. Pecht sought to address consumer-based electronic industry concerns about the reliability of lead-free parts assembled with tin-lead solder (mixed solder interconnects), particularly in such critical applications as aerospace and defense. The goal of the study was to produce data on mixed solder interconnects reliability under vibration loading. During testing at CALCE labs at the University of Maryland, CALCE researchers examined the reliability of mixed solder interconnects by applying random vibration tests to mixed solder joint assemblies. CALCE researchers employed a common layout test assembly with surface mount components, including 256 IO PBGAs, 100 IO TQFPs, 2512 and 1210 resistors. The test assemblies were then subjected to “…step-stress tests for a total of thirty six hours and a peak vibration input of 14 Grms at room temperature.” Additionally, CALCE researchers examined lead-free board finishes and TQFP lead finishes during the process.

For full text of paper please follow the links below:

CALCE website: CALCE Articles Entry

IMAPS website: http://www.imaps.org/imaps2008/techprogram.htm