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Prof. Pecht presents keynote on Understanding Risk Prediction in Electronic Systems at International Symposium on Microelectronics and Packaging

The 15th edition of ISMP was organized by The Korean Microelectronic and Packaging Society and held at Seoul, Korean during October 24-26, 2016. The symposium provided an excellent venue for scientists and engineers to discuss recent advances in electronic packaging technology and materials, processing, simulation, testing and reliability.

Prof. Michael Pecht presented the first keynote talk on “Understanding Predicting the Risks in Electronics Systems” and discussed methods for reliability prediction and the risks associated with the prediction methods.

Please contact Prof. Pecht for more information or to schedule a course or talk on this topic at your facilities.

The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products, and systems.

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