International Microelectronics and Packaging Society (IMAPS)
University of Maryland Student Chapter

University of Maryland and IMAPS | Upcoming Events | Past Events | IMAPS Members |



The International Microelectronics and Packaging Society’s roots stretch over forty years with the formation of the International Society for Hybrid Microelectronics (ISHM) in 1967.  In 1997 ISHM merged with the International Electronic Packaging Society (IEPS) to form IMAPS and has since become the largest society dedicated to the advancement of microelectronics and electronic packaging.

The IMAPS student chapter at the University of Maryland is composed of several graduate students whose focus is in the field of microelectronics and electronics packaging.  Many members are involved in microelectronics reliability through their graduate research at the Center for Advanced Life Cycle Engineering (CALCE).

University of Maryland and IMAPS

The University of Maryland has one of the world's largest research center focusing on electronics reliability. This center, the Center for Advanced Life Cycle Engineering, was established in 1986. Since then, CALCE has grown to be recognized as one of international leaders in reliability of electronics based on Physics-of-Failure analysis. The wide scope of CALCE’s research on reliability of electronics products and systems spans prognostics and health management of electronics, cost modeling, MEMS reliability and more. CALCE is led by founder and director, IMAPS Fellow and George Dieter Professor of Mechanical Engineering, Michael Pecht. Professor Pecht is a world renowned reliability engineer and educator with numerous awards.

The IMAPS student chapter at University of Maryland, College Park was started in 2000. It comprised of graduate students and research staff from CALCE. The student chapter was originally headed and advised by Dr. Patrick McCluskey . However, the chapter eventually became dormant towards the latter half of the 2000s. It was later revived in 2011, and today consists of more than 20 graduate students and research faculty from CALCE. The chapter is currently led by Dr. Diganta Das. Dr. Michael Osterman, the director of the CALCE Electronics Products and Systems Center is also actively involved with the chapter and its activities.

The first general body meeting of IMAPS student chapter was held on March 18, 2011. Since then, the University of Maryland IMAPS student chapter has held and participated in several events. The chapter organizes a poster presentation competition every semester. The events provide the members opportunities to interact with other members of the Chesapeake chapter and various industry experts.

IMAPS Members

Faculty Advisor: Dr. Diganta Das

President: Edmond Elburn
Vice President: Subramani Manoharan
Treasurer: Saurabh Saxena
Secretary: LingXi Kong

  • Erick Gutierrez
  • Hao Huang
  • Noel Jameson
  • Nripendra Patel
  • Jose Romero
  • Yi Wu
  • Lydia Zoghbi
  • Sumeer Khanna
  • Jonathan Kordell
  • Junfu Li
  • Nga Man Jennifa Li
  • Seyed Ali Moeini
  • Guru Pandian
  • Yongzhi Zhang

Upcoming Events

The next IMAPS event will take place in the Spring of 2018 on UMD campus. More information to follow.

Recent Events

IMAPS Chesapeake Chapter - Fall Technical Symposium 2017
The IMAPS Chesapeake Chapter held a Fall Technical Symposium on November 2nd, 2017, at the Applied Physics Laboratory (APL) of Johns Hopkins University. The symposium focused on the reliability issues and emerging trends in multilayer packages and simulation techniques. This symposium was also jointly organized by the IMAPS University of Maryland (UMD) student chapter.

The evening began with a technical presentation by Bhanu Snood from the NASA Goddard Space Flight Center. Mr. Snood presented on recent work analyzing the degradation of the glass-fiber and epoxy interface in printed circuit boards. The second talk was by Rory Grondin from LPFK Laser & Electronics. Mr. Grondin presented on the use of direct laser etching as a processing technique. The final talk of the symposium was given by Dr. Will McKinzie of WEMTEC, inc. Dr. McKinzie presented on recent advances in low temperature cofired ceramic processing through the use of ultraviolet laser ablation. The proceedings for the day concluded with a dinner, giving the members of the chapter, speakers, and guests an opportunity to interact with each other.

Mr. Bhanu Snood presenting on printed circuit board degradation

Speakers and Abstracts

Speaker: Bhanu Snood
Presentation Title: An Examination of Glass-Fiber and Epoxy Interface Degradation in Printed Circuit Boards

Abstract: Multi-layer organic laminates, which make up over 90% of the present types of interconnecting substrates in today's electronics, can develop a loss of electrical insulation resistance between two conductors due to the conductive anodic filament phenomenon. The filament forms in two steps - a degradation at the polymer/glass fiber interface followed by an electrochemical reaction involving electro-deposition. Bond degradation between the glass and polymer matrix provides a path along which the electro-deposition may occur, the path may result from poor glass treatment, from mechanical stresses during PCB fabrication (such as drilling) and from the hydrolysis of the finish applied on glass fibers. The organosilane bonds between the polymer matrix and glass reinforcements can chemically degrade by hydrolysis or by thermal cycling, which induces stresses at the interface due to a coefficient of thermal expansion (CTE) mismatches. This talk will discuss these filament formation pathways, the key drivers towards degradation, experiments that help in characterizing and tracking the degradation of these interfaces. The experiments include application of nano-scale force/displacement measurements and the use of microscopic infrared spectroscopy to track the evolution of mechanically brittle networks around the glass fibers when the circuit board laminate is exposed to accelerated stress conditions.

About the Speaker: Mr. Bhanu Sood is a Center Lead and Commodity Risk Assessment Engineer (CRAE) for Microelectronics Packaging and Circuit Boards at NASA Goddard Space Flight Center. Mr. Sood serves as NASA GSFC Specialist who manages overall Center development efforts pertaining to electronic circuit assemblies in Goddard Space Flight Center flight missions and ground equipment. Mr. Sood serves as an Agency authority on technical committees and advisory groups and manages the establishment and implementation of new research, technology development and technology demonstration initiatives relating to electronic circuit assemblies. Mr. Sood's areas of expertise include electronics supply chain risks, risk assessment and reliability analysis.

Prior to joining NASA in 2015, Mr. Sood was the Director of Test Services and Failure Analysis Laboratory at University of Maryland's Center for Advanced Life Cycle Engineering (CALCE). In a 10+ year career at UMD, he managed reliability assessments and failure analysis of products from the aerospace, avionics, medical device, telecommunications, oil & gas and automotive industries. In his prior appointment at US Naval Research Laboratory (NRL), Mr. Sood worked on process development for 3D printing, printed micro-power sources, and patented a laser-assisted stereo-lithography based circuit fabrication technique.

Mr. Sood has authored several book chapters, over thirty peer reviewed scholarly and technical papers and several hundred technical reports. Mr. Sood chairs the NASA Printed Circuit Board Working Group and three SAE Aerospace Standards Sub-Committees. He has participated in various conferences organizing committees and currently serves on the ASM Alloy Phase Diagram and ASM Emerging Technologies Awareness Committees. Mr. Sood holds one patent, and two invention disclosures, he is a senior member of IEEE and member of SAE and ASM.

Mr. Rory Grondin presenting on direct laser etching processing techniques

Speaker: Rory Grondin
Presentation Title: Nanosecond and Picosecond Laser Processing for RF and EHF Applications

Abstract: Direct laser etching is rapidly becoming the preferred method for advanced RF/microwave and millimeter wave research applications and production on demand processing. In this presentation, several laser models will be discussed showing the differences in capabilities at near-infrared, green and ultraviolet wavelengths on various materials including PTFE based microwave substrates, flex materials, fired ceramics such as Alumina, AlN, Piezo-ceramics (PZT), Titanate and Low Temperature Co-fired Ceramic (LTCC). Specific examples will also be provided demonstrating laser etched antenna and filter performance in comparison with traditional wet/chemical-etch, simulation software and mechanical milling.

About the Speaker: Rory Grondin has worked with LPKF Laser & Electronics since 2006 advising engineers on the latest applications possible with a range of mechanical milling and advanced laser etching models. Research projects spanning multiple sectors including Government applications, medical research and communication networks have been processed expanding capabilities and enabling new product and design advances. He supports laser tool development for materials research using nano and picosecond laser processing. Rory has a BS degree from Oregon State University and has implemented new techniques for prototype development and production-on-demand processing now used by engineers in North America and around the globe.

Dr. Will McKinzie presenting on laser ablation of low temperature cofired ceramics

Speaker: Dr. Will McKinzie
Presentation Title: Laser Ablation of Low Temperature Cofired Ceramic Packages for Millimeter Wave Antenna Applications

Abstract: Low temperature cofired ceramic (LTCC) materials and conventional screen printing processes are a mature packaging technology for microwave frequency applications. In this presentation we discuss advances in LTCC processing which employ ultraviolet laser ablation to achieve smaller line widths and gaps than is possible with conventional screen printing, as small as 30 um with clean well-formed metal edges. This allows LTCC packaging to be used at higher frequencies including millimeterwave bands up to at least 100 GHz. Manufacturing test structures and two-port millimeter wave circuit test structures will be presented as examples of laser ablated LTCC test vehicles. The fine line and fine gap tolerances of about +/-8 um allow the precise fabrication of circuit transitions, antenna feed networks, matching networks, and electromagnetic bandgap (EBG) structures, all of which are essential for millimeterwave LTCC antennas. Examples of laser ablated LTCC antenna packages will be shown for 60 GHz and 77 GHz. Selected measurement results will be shown for antenna performance.

About the Speaker: Dr. Will McKinzie has been designing millimeter wave packages in silicon and LTCC since 2007, wherein the packages include integrated antennas, vertical transitions, and electromagnetic bandgap (EBG) structures for suppression of surface waves and suppression of internal parasitic modes. He earned a BSEE from the University of MO at Rolla in 1982, and MSEE and PhD EE degrees from UCLA in 1989 and 1992 where he focused on computational electromagnetics for antenna design. He has worked for large companies including Motorola, Northrop Grumman, and Titan as well as startup companies including Etenna Corporation and Paratek Microwave. In 2003, Dr. McKinzie founded WEMTEC, Inc to develop unique EBG concepts for noise suppression in power distribution networks, and for parasitic mode suppression in microwave and millimeterwave packages. He is an inventor on many issued US patents. He currently does consulting work to develop microwave and millimeterwave antennas.