Dr. Michael H. Azarian is an assistant research scientist at the CALCE Electronic Products and Systems Center. He holds a Ph.D. in Materials Science and Engineering from Carnegie Mellon University, a Masters degree in Metallurgical Engineering and Materials Science from Carnegie Mellon, and a Bachelors degree in Chemical Engineering from Princeton University. He brings to CALCE over 13 years of professional experience in the data storage, advanced materials, and fiber optics industries, having worked for Philips Research Laboratories in Eindhoven, the Netherlands, W. L. Gore & Associates, Inc. in Elkton, MD, and Bookham Technology in San Jose, CA, as well as several start-up companies. He was most recently Manager of Quality and Reliability at Bookham Technology where he was responsible for qualification of optoelectronic products for telecommunications applications. He has published in the fields of nano-tribology, scanning probe microscopy, structure and properties of thin films, and colloid science, and holds 5 U.S. patents for inventions in data storage and contamination control. His research interests include reliability of photonic and high speed electronic devices, failure mechanisms in electronic components, tribology of the magnetic head-disk interface, and sensor technology. He has also been an invited conference speaker on nano-tribology, instructor of tribology at IBM, and guest lecturer on optoelectronic reliability at San Jose State University.
Dr. Diganta Das (Ph.D., Mechanical Engineering, University of Maryland, College Park, BS, Manufacturing Science and Engineering, Indian Institute of Technology) is a member of the research staff at the Center for Advanced Life Cycle Engineering (CALCE). His expertise is in reliability, environmental and operational ratings of electronic parts, uprating, electronic part reprocessing, technology trends in the electronic parts and parts selection and management methodologies. Dr. Das has published more than 50 articles on these subjects. He had been the technical editor for two IEEE standards. He is an editorial board member for the journal Microelectronics Reliability and Circuit World. He is a Six Sigma Black Belt and a member of IEEE and IMAPS
Dr. Abhijit Dasgupta (Theoretical and Applied Mechanics, Ph.D., University of Illinois) is a faculty member of Mechanical Engineering of the University of Maryland with research experiences and interests in the area of mechanics of material behavior, including thermo-mechanical material constitutive modeling, damage analysis, fracture mechanics and the mechanics of fatigue damage in heterogeneous materials and assemblies. He is currently involved in several research projects dealing with the physics of failure and reliability of electronic components assemblies and interconnects. His interests and expertise also include stress analysis and the use of general-purpose finite element programs, such as ANSYS, SAP, ABAQUS. He has developed various special purpose finite element codes for analysis of nonlinear problems, such as viscoplastic problems, large- deformation stability problems, etc.; and for the analysis of mixed-mode fracture in anisotropic materials with the help of conservation integrals.
Dr. Bongtae Han (Engineering Mechanics, Ph.D., Virginia Polytechnic Institute) is an Associate Professor of the Mechanical Engineering Department. Dr. Han joined the faculty of the University of Maryland in August 1999. He is currently directing the Laboratory for Opto-Mechanics and Multi-layer Systems, which is equipped with various experimental photomechanics tools for thermo-mechanical analysis. His research interest is centered on design/process optimization of microelectronics devices for optimum mechanical reliability. His previous professional career includes Assistant Professor at Clemson University (1996-1999) and Advisory Engineer at IBM Microelectronics (1992-1996). Dr. Han is responsible for development of Portable Engineering Moir Interferometer, and holds a related patent. He has co-authored a book entitled "High Sensitivity Moir Experimental Analysis for Mechanics and Materials", Springer-Verlag, 1994 and has published over 50 journal and conference papers in the field of microelectronics and experimental mechanics. He served as an Executive Board Member and the Chairman of the Electronic Packaging Division of the Society for Experimental Mechanics (SEM). He currently serves as an Associate Technical Editor for the international journal of Experimental Mechanics. He also holds a membership in ASME, IEEE, IMAPS and SPIE.
Dr. Patrick McCluskey (Mechanical Engineering, Ph.D., Lehigh University) is an Assistant Professor of Mechanical Engineering at the University of Maryland, where he is also the Assistant Director for component research at the CALCE and the Director of the Electronic Components Alliance. He is the principal investigator for topics related to computer aided risk assessment of microelectronics, electronic packaging design for high temperature and high power applications, and the insertion of commercial components into high reliability applications. He is the author or co-author of numerous papers and presentations on his research, and is the co-editor of the book, High Temperature Electronics. He has taught graduate level and executive short courses covering all levels of electronics packaging and assembly. He is a member of IEEE, ASM, ECS, MRS, and serves on the IPC and JEDEC Moisture Sensitivity task forces.
Dr. Michael Osterman (Mechanical Engineering, Ph.D. University of Maryland, College Park) is a Senior Research Scientist and the CALCE Consortium Director at the University of Maryland. Dr. Osterman is one of the principle researchers in the CALCE effort to develop simulation models for temperature cycling fatigue of Pb-free solder. He has been involved in the study of tin whiskers since 2002 and has authored several articles related to the tin whisker phenomenon. He has led a long term lead-free reliability study at CALCE and is currently leading a mixed solder interconnect reliability study. He has written various book chapters and numerous articles in the area of electronic packaging. In addition, he heads the development of simulation based failure assessment software at CALCE. He is a member of IEEE, ASME, and SMTA.
Dr. Michael Pecht (Engineering Mechanics, Ph.D., University of Wisconsin) is the Director of the CALCE at the University of Maryland and a Full Professor. He is a Professional Engineer, an IEEE Fellow and an ASME Fellow and a Westinghouse Fellow. He has written eleven books on electronics products development. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is currently the chief editor for Microelectronics Reliability International. He serves on the board of advisors for various companies and provides expertise in design, test and reliability assessment of electronics products and systems.
Dr. Peter A. Sandborn (Electrical Engineering, Ph.D., University of Michigan) is an Associate Professor with research experiences and interests in the area of electronic packaging tradeoff analysis, multichip module design, design for manufacturability and assembly of multichip systems, design to cost, and design for environment. He is currently involved in several research projects dealing with the physics of failure and reliability of electronic components assemblies and interconnects, parts selection and management, process modeling for MEMs, and detailed cost modeling of electronic packaging. Previously, Dr. Sandborn was a senior member of technical staff at MCC, a founder and the chief technical officer of Savantage, Inc. and a technical contributor at Nu Thena Systems, Inc. He has written one book on the conceptual design of multichip modules and systems and is the author of over 50 technical papers on electronic packaging and semiconductor device simulation.
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