Over the past six years, the CALCE has been
studying and providing its members with information
on the influence of temperature on microelectronics
and system reliability. With the passing of the time
limits of CALCE Consortium confidentiality, a
book is now available to provide help in evaluating
device architecture trade-offs and the effects of
operating temperatures on device performance and
Various sections of the book address the steady state
and cyclic temperature effects on electrical
parameters and the reliability of both bipolar and
MOSFET devices; identify models quantifying the
temperature effects on package elements; and
address the impacts of various design for
temperature trade-offs on electronic systems.
Temperature-related models are assessed in terms of
their use for determining the maximum and minimum
allowable temperature stresses for a given system
architecture. Derating methods are also reviewed.
- Presents the effect of temperature
in the context of microelectronics reliability, covering damage mechanisms
in the temperature range of -55°C to 150°C.
- Uses the cumulative effect of
competing failure processes on device life to determine appropriate values
of operating temperature and non-temperature related stress.
- Derives stress margin curves
for device life for mechanisms with dependencies on stresses and defects.
Assists the reader in evaluating
the life cycle reliability, cost, and weight trade-offs associated with
Catalog number: 9450
May 1996, c., ISBN: 0-8493-9450-3
CRC Press, Inc.
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Boca Raton, FL 33431
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