Building 89, Room 1103
University of Maryland
College Park, MD 20742
Tel: 301-405-5323
Fax: 301-314-9269

Last Chance to Submit an Abstract for the International Symposium on
3D Power Electronics Integration and Manufacturing

The deadline for abstract submissions for the International Symposium on 3D Power Electronics Integration and Manufacturing has been extended to January 15, 2018.

Contributed papers are sought that address important challenges related to the packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

  • Additive Manufacturing
  • Embedded Components and Embedding Technologies
  • Systems Integration and Thermal Management for High-density Packaging
  • Multiphysics Modeling and Simulation of Integrated Packaging and Circuit Solutions
  • Materials (e.g., interconnects, encapsulants, substrates)
  • Heterogeneous Integration
  • Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
  • Quality and Reliability, including Prognostics and Condition Monitoring
ABSTRACT FORMAT: The abstract should consist of two pages of text with sections on the purpose of the study, the approach, and the results and significance, and one page of figures, tables, and references.

Questions pertaining to the 3D-PEIM Symposium may be addressed to:

General Chair: Prof. Patrick McCluskey, Univ, of Maryland (
Technical Program Chair: Prof. Guo-Quan Lu, Virginia Tech (
Past General Chair: Prof. Douglas Hopkins, NC State University (

The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products, and systems.

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