The majority of the publications listed below have links leading to an abstract. CALCE Consortium members with a CALCE web account can access the full text of articles through these links. Non-members wishing to access the full text, may do so on a monthly subscription basis. For more information, please go to the registration page. Other publications include Books, Webbooks and Databases, and Open Forum.

Listed below are articles and book chapters which have been published by CALCE.

Tests on the Relationship between the Oxide Thickness of CMOS Chips and Their Resistance to Gamma Radiation, A. Tokuhiro, M. Bertino, H. Dharavat, J. Munson, J. Farmer, M. Pecht, and D. Das.

Failure Analysis and Redesign of A Helix Upper Dispenser, S. Woo and M. Pecht, Engineering Failure Analysis, Vol 15, Issue 6,  Pg 642-653, Sep 2008.

Microstructure and Intermetallics Formation in SnAgCu BGA Components attached with SnPb Solder under Isothermal Aging, A. Choubey, M. Osterman, and M. Pecht. IEEE Transactions on Device and Materials Reliability, Vol 8, Issue 1, pp 160-167, 2008.

Failure Site Isolation on Passive RFID Tags, B. Sood, D. Das, M. Azarian, M. Pecht, B. Bolton, and T. Lin. , Proceedings of the 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits July 7-11, Singapore, pp. 337-341, 2008.

Intermetallics Characterization of Lead-free Solder Joints under Isothermal Aging, A. Choubey, H. Yu, M. Osterman, M. Pecht, F. Yun, L., Youghong and X. Ming., Journal of Electronic Materials, Vol. 37, No. 8, pp. 1130-1138, August 2008.

No-fault-found and Intermittent Failures in Electronic Products, Qi. Haiyu., S. Ganesan and M. Pecht, Microelectronics Reliability, Vol. 48, Issue 5, pp. 663-674, May 2008.

Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 8, Issue 1, pp 182-192, March 2008

Effect of Solder Joint Degradation on RF Impedance, D. Kwon, M. Azarian, and M. Pecht, 12th IEEE Workshop on Signal Propagation on Interconnect, Avignon, France, pp. 1-4, 2008.

Detection of Solder Joint Degradation Using RF Impedance Analysis, D. Kwon, M. Azarian, and M. Pecht, IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 606-610, 2008.

China's Efforts in Prognostics and Health Management, Shunong Zhang, Rui Kang, Xiaofei He, and Michael G. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 2, June 2008.

Enhanced Reliability Modeling of RAID Storage Systems, Jon G. Elerath(Network Appliance Inc.), Michael Pecht(University of Maryland)., DSN, PP.175-184 Dependable Systems and Networks, 2007.

Technology Assessment of Sensor Systems for Prognostics and Health Monitoring, B. Tuchband, S. Cheng, and M. Pecht, IMAPS on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications (MASH), May, 2007.

Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products, H. Qi, N. Vichare, M. Azarian, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, 2007.

Design of Experiments for Board Level Solder Joint Reliability of PBGA Package under Various Manufacturing and Multiple Environmental Loading Conditions, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, 2007.

High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints, H, Qi, Q, Zhan, E. Tinsley, M. Osterman, and M Pecht, IEEE Transactions on COmponents and Packaging Technologies, 2007.

Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design, N. Vichare, P. Rodger, V. Eveloy, and M. Pecht, International Journal of Quality Technology and Quantitative Management, 2007.

Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development, P. Sandborn and P. Sandborn, International Journal of Engineering Education, 2007.

Semiconductor Manufacturers' Efforts to Improve Trust in the Electronic Part Supply Chain, Chatterjee, K. and Das, D., Components and Packaging Technologies, IEEE Transactions on , vol.30, no.3, pp.547-549, Sept. 2007

Carbon Fiber-Based Grid Array Interconnects, Y. Deng, M. pecht, J. Swift, and S. Wallace, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, pp. 716-723, Dec, 2007.

Strain Range Fatigue Life Assessment of Lead-free Solder Interconnects Subject to Temperature Cycle Loading, M. Osterman and M. Pecht, Soldering & surface Mount Technology, Vol. 19, No. 2, pp. 12-17, 2007.

Multivariate State Estimation Technique for Remaining Useful Life Prediction of Electronic Products, S. Cheng and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 26-32, Arlington, VA, Nov, 2007.

Health Monitoring of Electronic Products Using Symbolic Time Series Analysis, S. Kumar and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 73-80, Arlington, VA, Nov, 2007.

Support Vector Prognostics Analysis of Electronic Products and Systems, V. Sotiris and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 120-127, Arlington, VA, Nov, 2007.

Assessment of China's and India's Science and Technology Literature - Introduction, Background, and Approach Technological Forecasting and Social Change, R. Kostoff, S. Bhattacharya, and M. Pecht, Technological Forecasting and Social Change, Vol. 74, Issue 9, pp. 1519-1538, November 2007.

Chinese science and technology - Structure and infrastructure Technological Forecasting and Social Change, R. Kostoff, M. Briggs, R. Rushenberg, C. Bowles, A. Icenhour, K. Nikodym, R. Barth, and M.l Pecht, Technological Forecasting and Social Change, Vol. 74, Issue 9, pp. 1539-1573, November 2007.

Comparisons of the structure and infrastructure of Chinese and Indian Science and Technology Technological Forecasting and Social Change, R. Kostoff, M. Briggs, R. Rushenberg, C. Bowles, M. Pecht, D. Johnson, S. Bhattacharya, A. Icenhour, K. Nikodym, R. Barth, and S. Dodbele, Technological Forecasting and Social Change, Vol. 74, Issue 9, pp. 1609-1630, November 2007.

Prognostics Implementation of Electronics under Vibration Loading, J. Gu, D. Barker and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 12, pp. 1849-1856, Dec. 2007.

Creep and Stress Relaxation of Hypo-Eutectic Sn3.0Ag0.5Cu Pb-free Alloy: Testing and Modeling, G. Cuddalorepatta and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.

Vibration Durability Assessment of Sn3.0Ag0.5Cu & Sn37Pb SOlders under Harmonic Excitation, Y. Zhou and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.

Uncertainty Assessment of Prognostics of Electronics Subject to Random Vibration, J. Gu, D. Barker, and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp.50-57, 2007.

Isothermal Aging Effects on Flex Cracking of Multilayer Ceramic Capacitors with Standard and Flexible Terminations, M. Keimasi, M. Azarian, and M. Pecht, Microelectronics Reliability, Vol. 47, pp. 2215-2225, 2007.

Prognostics of Ceramic Capacitor Temperature-Humidity-Bias Reliability Using Mahalanobis Distance Analysis, L. Nie, M. Azarian, M. Keimasi, and M. Pecht, Circuit World, Vol. 33, No.3, pp. 21-28, 2007.

Tin Whiskers: How to Mitigate and Manage the Risks, S. Mathew, M. Osterman, T. Shibutani, Q. Yu and M. Pecht, Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, pp.1-8, Shanghai, China, June 26-28, 2007.

New Methods to Predict Reliability of Electronics, J. Gu and M. Pecht, Proceedings of the Seventh International Conference on Reliability, Maintainability and Safety, pp 440-451, 2007.

The Effect of Electrostatic Discharge on Electrical Overstress Susceptibility in a Gallium Arsenide MESFET-Based Device, V. Eveloy, Y. Hwang, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol, 7, No. 1, pp. 200-208, March 2007.

Regulations and Market Trends in Lead-free and Halogen-free Electronics, L. Nie and M. Pecht, Circuit World, Vol. 33, NO. 2, pp. 4-9, 2007.

Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, pp. 242-247, June 2007.

Reliability Assessment on Insertion Mount Assembly under Vibration Conditions, H. Qi, G. Plaza, S. Ganesan, M. Osterman, and M. Pecht, 2007 Electronic Components and Technology Conference, Reno, Nevada, pp. 407-414, May 29-June 1, 2007

Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process, S. Sengupta, D. Das, S. Ganesan, W. Rollins, D. Pinsky, T. Lin and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, NO. 2, pp. 128-137, April, 2007.

Using a Reliability Capability Maturity Model to Benchmark Electronics Companies, S. Tiku and M. Pecht, International Journal of Quality & Reliability Management, Vol, 24, No. 5, pp. 547-563, 2007.

Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads, S. Mathew, D. Das, M. Osterman, M. Pecht, R. Ferebee, and J. Clayton, Journal of the IEST, Vol. 50, No. 1, pp 86-97, April 2007.

The Use of Prognostics in Military Electronic Systems, B. Tuchband and M. Pecht, Proceedings of the 32nd GOMACTech Conference, pp. 157-160, Lake Buena Vista, FL, March 19-22, 2007.

Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket, S. Yang, J. Wu, D. Tsai, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 30, NO. 1, pp. 81-85, March 2007.

Assessment of Risk Resulting from Unattached Tin Whisker Bridging, T. Fang, S. Mathew, M. Osterman, and M. Pecht, Circuit World, Vol. 33, No. 1, pp. 5-8, 2007.

Durability of Repaired and Aged Lead-free Electronic Assemblies, A. Choubey, M. Osterman, M. Pecht, and D. Hillman, IPC Printed Circuits Expo, APEX, and Designers Summit, Los Angeles, CA. Feb 18-22, 2007

An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics, G. Zhang, C. Kwan, R. Xu, N. Vichare, and M. Pecht, IEEE Aerospce Conference, Big Sky, MT, March 2007.

Prognostics Implementation Methods for Electronics, J. Gu, N. Vichare, T. Tracy, and Michael Pecht, 53rd Annual Reliability & Maintainability Symposium (RAMS), Florida, 2007.

Solving the Counterfeit Electronics Problem, K. Chatterjee, D. Das, and M. Pecht, Proceedings of Pan Pacific Microelectronics Symposium (SMTA), pp. 294-300, Hawaii, Jan 30-Feb 1, 2007.

The Impact of Electrical Current, Mechanical Bending, and Thermal Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 1, pp. 88-92, January, 2007.

Test Methodology for Durability Estimation of Surface Mount Interconnects under Drop Testing Conditions, J. Varghese and A. Dasgupta, Microelectronics Reliability, Vol. 47, Issue 1, pp. 93-107, January, 2007.

Vibration Durability Comparison of Sn37Pb vs SnAgCu SOlders, Y. Zhou, E. Scanff, and A. Dasgupta, 2006 ASME International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 5-10, 2006.

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board, S. Mathew, D. Das, M. Osterman, M. Pecht, and R. Ferebee, ASME Journal of Electronic Packaging, Vol. 128, Issue 4, pp. 339-345, December 2006.

Management of Information and Data Used for Failure Assessment of Printed Circuit Board Assembly, M. Ramot, D. Das, and M. Pecht, Proceedings of the IMAPS 2006 Conference, 2006.

The Effect of Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No. 4, pp. 252-258, October 2006.

Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-Plated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests, P. Zhao, M. Pecht, S. Kang, and S. Park, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 4, pp. 818-826, December, 2006.

Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy, Y. Deng, M. Pecht, and K. Rogers, IEEE Transactions on Companents and Packaging Technologies, Vol. 29, No. 4, pp. 804-808, December, 2006.

Uprating of Electronic Parts to Address Obsolescence, M. Pecht and D. Humphrey, Microelectronics International, Vol. 23, No. 2, pp 32-36, 2006.

Impact of Environmental Regulations on Green Electronics Manufacture, R. Ciocci and M. Pecht, Microelectronics International, Vol. 23, No. 2, pp 45-50, 2006.

The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages, T. Lin, M. Pecht, D. Das, and K. Teo, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp. 522- 527, July 2006.

Establishing a Relationship Between Warranty and Reliability, M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 184- 190, July 2006.

Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux, S. Zhan, M. Azarian, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 217-233, July 2006.

Forecasting the Cost of Unreliability for Products with Two-Dimensional Warranties, A. Kleyner and P. Sandborn, Proceedings of the European Safety and Reliability Conference (ESREL), Estoril, Portugal, Sept 18-22, 2006.

A Methodology for Assessing the Remaining Life of Electronic Products, S. Mathew, P. Rodgers, V. Eveloy, N. Vichare, and M. Pecht, International Journal of Performability Engineering, Vol. 2, No. 4, pp. 383-395, October, 2006.

Low Temperature Electrical Measurements of Silicon Bipolar Monolithic Microwave Integrated Circuit (MMIC) Amplifiers, M. Keimasi, S. Ganesan, and M. Pecht, Microelectronics Reliability, Vol. 46, pp. 326-334, 2006.

Use of High Temperature Operating Life Data to Mitigate Risks in Long-Duration Space Applications that Deploy Commercial-Grade Plastic Encapsulated Semiconductor Devices, S. Ganesan, M. Pecht, and S. Ling, Microelectronics Reliability, Vol. 46, pp. 360-366, 2006.

The Other Half of the DMSMS Problem - Software Obsolescence, P. Sandborn and G. Plunkett, DMSMS Knowledge Sharing Portal Newsletter, Vol. 4, Issue 4, pp. 3 and 11, June 2006.

Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems, P. Singh and P. Sandborn, The Engineering Economist, Vol. 51, No. 2, pp. 115-139, April-June 2006.

Using Reverse Engineering as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling, P. Sandborn, J. Myers, T. Barron, and M. McCarthy, Proceedings of the International Electronics Packaging Education Conference (at the Electronic Components and Technology Conference), May 30, 2006.

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly, Z. Shi and P. Sandborn, Journal of Electronic Testing Theory and Applications (JETTA), Vol. 22, pp. 49-60, 2006.

Contact Resistance and Fretting Corrosion of Lead-free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, pp. 402-410, June, 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, ITHERM Conference, San Deigo, CA, May 30, 2006.

Investigation of the Size and Spatial Distribution of Fillers in Mold Compounds after Device Packaging, Y. Huang, D. Bigio, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, pp. 364-370, June, 2006.

Statistical Analysis of Tin Whisker Growth, T. Fang, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 46, Issues 5-6, pp. 846-849, May-June, 2006.

A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects , M. Osterman, A. Dasgupta, B. Han, 56th Electronic Component and Technology Conference, pp. 884 - 890, May 30-June 2, 2006

Learning from the Migration to Lead-free Solder, R. Ciocci and M. Pecht, Soldering & Surface Mount Technology, Vol. 18, No. 3, 2006.

Methods for Binning and Density Estimation of Load Parameters for Prognostics and Health Management, Vichare N., Rodgers P., and Pecht, M., International Journal of Performability Engineering, Vol. 2, No. 2, pp. 149-161, April 2006.

Prognostics and Health Management of Electronics , N. Vichare and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 1, pp. 222-229, March 2006.

A Variant of Conductive Filament Formation Failures in PWBs with 3 and 4 mil Spacings, K. Rogers and M. Pecht, Circuit World, Vol. 32, No. 3, pp. 11-18, 2006.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells - Experimental Approach, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, Capacitor and Resistor Technology Symposium, Orlando, FL, pp. 15-25, April 3-6, 2006.

Lead-Free Assemblies in High Temperature Applications, A. Choubey, J. Wu, S. Ganesan, and M. Pecht, Proceeding of IMAPS International Conference on High Temperature Electronics (HITECH 2006), pp. 384-389, May 2006.

Effect of Aging on Pull Strength of SnPb, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components, A. Choubey, D. Menschow, S. Ganesan, and M. Pecht, Journal of SMTA, Vol. 19, Issue 2, pp. 33-37, April 2006.

Moisture Induced Degradation of Multilayer Ceramic Capacitors, D. Donahoe, M. echt, I. Lloyd, and S. Ganesan, Microelectronics Reliability, Vol. 46, pp. 400-408, 2006.

Comparison of Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Eutectic Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, Capacitor and Resistor Technology Symposium, Orlando FL, pp. 15-25, April 3-6, 2006.

Non-Destructive Techniques for Detection of Defects in Multilayer Ceramic Capacitors, M. Azarian, M. Keimasi, and M. Pecht, Components for Military and Space Electronics Conference, pp. 125-130, Los Angeles, CA, February 6-9, 2006.

Implementation of Six Sigma Quality System in Celestica with Practical Examples, L. Ladani, D. Das, J. Cartwright, R. Yenkner, and J. Razmi, Int. J. Six Sigma and Competitive Advantage, Vol. 2, No. 1, pp. 69-88, 2006.

Open Trace Defects in FR4 Printed Circuit Boards, S. Ganesan and M. Pecht, Circuit World, Vol. 32, No. 1, pp. 3-7, 2006.

Electronic Device Encapsulation Using Red Phosphorus Flame Retardants, M. Pecht and Y. Deng, Microelectronics Reliability, Vol. 46, Issue 1, pp. 53-62, January 2006.

Failures in Semiconductor Device Encapsulated with Red Phosphorus Flame Retardant, Y. Deng and M. Pecht, 11th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition, pp. 399-404, January 17-19, 2006. 

Vibration Tests Utilization in the Study of Reliability of Connections in Microelectronics, P. Matkowski and H. Qi, 2005 International Students and Young Scientists Workshop "Photonics and Microsystems", pp. 61-64, July 7-8, 2005

Using Cut-Out Features for Efficient Printed Circuit Board Testing and Failure Analysis, J. Wu and S. Ganesan, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 1, pp. 166-168, March 2005.

Guidelines for Drop Testing of Portable Electronic Products Using a Bottom-Up Approach, J. Varghese, J. Okura, K. Ojala, and A. Dasgupta, Proceedings of the JEDEX Semiconductor Conference, 2005.

Drop Testing of Printed Wiring Assemblies, J. Varghese and A. Dasgupta, Proceedings of the IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR), 2005.

Characterization of Non-Conductive Adhesives, D. Farley, A. Dasgupta, and J. Caers, Proceedings of ASME InterPACK, July 17-22, 2005.

Characterizing Non-Conductive Adhesives using Finite Element Analysis: Residual Stress Determination,D. Farley, A. Dasgupta, and J. Caers, Proceedings of SEM Annual Conference and Exposition, June 7-9, 2005.

Cyclic Mechanical Durability Of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, G. Cuddalorepatta and A. Dasgupta, ASME International Mechanical Engineering Congress and RD&D Expo, Orlando, FL, November 5-11, 2005.

Effects of Re-Finishing of Terminations by Solder-Dipping on Plastic Quad Flatpack Electronic Parts, S. Sengupta, D. Das, S. Ganesan, and M. Pecht, EPTC Annual Conference, Singapore, December 2005.

Risk Factors in Oil and Gas Well Electronics Compared to Other Electronic Industries, S. Tiku, A. Veneruso, R. Etchells, and M. Pecht, Oil & Gas Science and Technology - Rev. IFP, Vol. 60 (2005), No. 4, pp. 721-730, Institut Français du Pètrole, 2005.

The Story Behind the Red Phosphorus Mold Compound Device Failures, Y. Deng and M. Pecht, 2005 International Symposium on Electronics Materials and Packaging (EMAP2005), pp. 1-5, Tokyo, Japan, December 11-14, 2005.

Lead-free Assembly Defects in Plastic Ball Grid Array Packages, S. Ganesan, G. Kim, J. Wu, M. Pecht, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 219-223, Wroclaw, Poland, October 23-26, 2005.

Effects Printed Circuit Board Materials on Lead-free Interconnect Durability, H. Qi, S. Ganesan, J. Wu, M. Pecht, P. Matkowski, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 140-144, Wroclaw, Poland, October 23-26, 2005.

Identification and Utilization of Failure Mechanisms to Enhance FMEA and FMECA, S. Ganesan, V. Eveloy, D. Das, and M. Pecht, Proceedings of the IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR), Austin, Texas, October 2-5, 2005.

Characterization of Non-Conductive Adhesives, D. Farley, A. Dasgupta, J. Caers, and W. Hua, Proceedings of 6th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and micro-systems, April 17-20, 2005.

Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design, N. Vichare, P. Rodgers, V. Eveloy, and M. Pecht, IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR), Austin, TX, USA, October 2-5, 2005.

Beyond Tools: A Design for Environment Process, D.P. Fitzgerald, J.W. Herrmann, P.A. Sandborn, L.C. Schmidt, and T.H. Gogoll, International Journal of Performability Engineering, Vol. 1, No. 2, pp. 105-120, October 2005.

A Tin Whisker Risk Assessment Algorithm, T. Fang, M. Osterman, and M. Pecht, 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, pp. 61-65, Philadelphia, PA, September 25-29, 2005.

Non-invasive Electrocardiogram and Blood Pressure Monitors for Cardiovascular Disease, Y. Liu, V. Eveloy, and M. Pecht, 38th International Symposium on Microelectronics, Sensor and MEMS Packaging, pp. 66-74, Philadelphia, PA, September 25-29, 2005.

Carbon Fiber Electrical Interconnects, Y. Deng, J. Wu, and M. Pecht, 38th International Symposium on Microelectronics, Emerging Technologies, pp. 169-176, Philadelphia, PA, September 25-29, 2005.

Reliability Issues of No-Clean Flux Technology with Lead-Free Solder Alloy for High Density Printed Circuit Boards, S. Zhan, M. Azarian, and M. Pecht, 38th International Symposium on Microelectronics, pp. 367-375, Philadelphia, PA, September 25-29, 2005.

Electrochemical Migration of Land Grid Array Sockets under Highly Accelerated Stress Conditions, S. Yang, J. Wu, and M. Pecht, The Fifty-First IEEE Holm Conference on Electrical Contacts, pp. 238-244, September 2005.

Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted PQFP Components in Free Convection, V. Eveloy, P. Rodgers and M. Hashmi, Transactions of the ASME, Journal of Electronic Packaging, Vol. 127, No. 3, pp. 245-254, September 2005.

Prediction of Electronic Component-Board Transient Conjugate Heat Transfer, V. Eveloy and P. Rodgers, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, pp. 817-829, December 2005.

Distribution of a Minor Solid Constituent in a Transfer Molded e-Pad Leadframe Package, Y. Huang, S. Zhan, D. Bigio, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 3, pp. 549-554, September 2005.

A Warranty Forecasting Model Based on Piecewise Statistical Distributions and Stochastic Simulation, A. Kleyner and P. Sandborn, Reliability Engineering and System Safety, Vol. 88, No. 3, pp. 207-214, June 2005.

Environmental Qualification Testing Assessment and Failure Analysis of Embedded Resistors, L.J. Salzano II, C. Wilkinson, and P. Sandborn, IEEE Transactions on Advanced Packaging, Vol. 28, No. 3, pp. 503-520, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Mixed Flowing Gas Studies of Creep Corrosion on Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-Plated Leadframes, P. Zhao, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 5, No. 2, pp. 268-276, June 2005.

Key Concerns in the Assembly of Lead-Free Electronics, V. Eveloy, Y. Fukuda, S. Ganesan, J. Wu, and M. Pecht, Proceedings IMAPS Taiwan 2005 International Technical Symposium, pp. 167-183, June 2005.

New Aging Mechanism in Multilayer Ceramic Capacitators, D. Dohahoe and M. Pecht, Advanced Packaging, June 2005.

The Evaluation of Copper Migration During the Die Attach Curing and Second Wire Bonding Process, T. Lin, M. Pecht, D. Das, J. Pan, and W. Zhu, IEEE Transactions on Components and Packaging Technologies, Vol. 28, Issue. 2, pp. 337-344, June 2005.

Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders, S. Yoon, Z. Chen, M. Osterman, B. Han, and A. Dasgupta, 55th ECTC, pp. 1210-1214, June 2005.

An Assessment of Embedded Resistor Trimming and Rework, P. Sandborn, IEEE Transactions on Electronics Packaging Manufacturing., Vol. 28, No. 2, pp. 176- 186, April 2005.

A Data Mining Based Approach to Electronic Part Obsolescence Forecasting, P. Sandborn, F. Mauro, and R. Knox, Proceedings DMSMS Conference, Nashville, TN, April 2005.

Heart Sound Measurement and Analysis in Cardiovascular Disease Assessment, V. Eveloy, Y. Liu, and M. Pecht, Proceedings of the SMTA Medical Electronics Symposium, Minneapolis, MN, April 25-27, 2005.

Chinese Intellectual Property and Contractual Challenges, Y. Liu, P. Campbell, D. Das, and M. Pecht, International Conference on Electronics Packaging (ICEP), pp. 241-246, Japan, April 13-15, 2005.

Extending the Limits of Air-Cooling in Microelectronic Equipment, P. Rodgers, V. Eveloy, and M. Pecht, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 695-702, EuroSimE, April 2005.

Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance, J. Subramanian, P. Rodgers, J. Newson, T. Rude, Z. He, E. Besnoin, T.P. Weihs, V. Eveloy, and M. Pecht, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 681-686, EuroSimE, April 2005.

Development of Predictive Modeling Scheme for Flip-Chip on Fine Pitch Flex Substrate, C. Jang, S. Han, Y. Kim, and H. Kim, S. Yoon, S. Cho, C. Han, and B. Han, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 566-574, EuroSimE, April 2005.

Hybrid Experimental and Computational Approach for Rate Dependent Mechanical Properties Using Indentation Techniques, J. Varghese, G. Radig, D. Herkommer, and A. Dasgupta 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 510-514, EuroSimE, April 2005.

Characterization of Non-Conductive Adhesives, D. Farley, A. Dasgupta, J. Caers, and W. Hua, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 471-477, EuroSimE, April 2005.

Assessment of Long-term Reliability in Lead-free Assemblies, S. Ganesan, J. Wu, and M. Pecht, International Conference on Asian Green Electronics, Session 3, pp. 140-155, Shanghai, China, March 15-18, 2005.

An Investigation into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature, P. Rodgers, V. Eveloy, and M. Hashmi, Transactions of the ASME, Journal of Electronic Packaging, Vol. 127, Issue 1, pp. 67-75, March 2005.

Limits of Air-Cooling: Status and Challenges, P. Rodgers, V. Eveloy, and M. Pecht, IEEE Twenty First Annual - Semiconductor Thermal Measurement and Management Symposium, pp. 116-124, March 15-17, 2005.

A Decision Support Model for Determining the Applicability of Prognostic Health Management (PHM) Approaches to Electronic Systems, P. Sandborn, Proceedings Reliability and Maintainability Symposium, pp. 422-427, January 24-27, 2005.

Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronic Systems, P. Singh and P. Sandborn, Proceedings Reliability and Maintainability Symposium, pp. 349-354, January 24-27, 2005.

Failure Analysis and Virtual Qualification of PBGA Under Multiple Environmental Loadings, H. Qi, C. Wilkinison, M. Osterman, and M. Pecht, Electronic Components and Technology Conference, Proceedings. 54th, Vol, 1. No. 1-4, pp. 413-420, June 2004.

Electromagnetic Interference (EMI) Reduction from Printed Circuit Boards (PCB) Using Electromagnetic Bandgap Structures, S. Shahparnia, O. Ramahi, IEEE Transactions on Electromagnetic Compatibility, Vol. 46, Issue 4, pp. 580-587, November 2004.

Virtual Qualification of a Plastic Encapsulated DC-DC Converter, K. Ghosh, B. Willner, and P. McCluskey, 2004 IEEE 35th Annual Power Electronics Specialists Conference, Vol. 4, pp. 2578-2582, 2004.

Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, Proceedings of 2004 International IEEE Conference on Asian Green Electronics, pp. 127-125, 2004.

The Impact of Lead-Free Legislation Exemptions on the Electronics Industry, M. Pecht, Y. Fukuda and S. Rajagopal, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 4, pp. 221-232, October 2004.

Understanding and Validating Practical EMI/EMC Antennas Using Numerical Codes, S. Shahparnia, M. Kermani, O. Ramahi, International Symposium on Electromagnetic Compatibility, Vol. 2, pp. 691-696, August 9-13, 2004.

Electromagnetic Noise Mitigation in High-Speed Printed Circuit Boards and Packaging Using Electromagnetic Band Gap Structures, S. Shahparnia, B. Mohajer-Iravani, and O. Ramahi, Proceedings Electronic Components and Technology, Vol. 2, pp. 1831-1836, June 1-4, 2004.

Miniaturized Electromagnetic Bandgap Structures for Ultra-Wide Band Switching Noise Mitigation in High-Speed Printed Circuit Boards and Packages, S. Shahparnia, O. Ramahi, IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 211-214, October. 25-27, 2004.

An Efficient Optimization Method for the Reconstruction of Multiple Profiles, F. Seydou, T. Seppanen, and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 209-212, June 20-25, 2004.

Concurrent Complementary Operators Method for the Absorption of Evanescent Waves in Frequency-Domain Finite Element Simulations [Waveguides], X. Wu, O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 387-390, June 20-25, 2004.

Complementary Operators Method for ADI-FDTD Open-Region Simulations, M. Kermani, O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 587-590, June 20-25, 2004.

Instable ADI-FDTD Open-Region Simulation, M. Kermani, X. Wu, and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 595-598, June 20-25, 2004.

Coupled Stability Analysis for the Open-Region Finite-Difference Time-Domain Simulations, X. Wu and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 599-602, June 20-25, 2004.

A Multipole Expansions Method for Acoustic Wave Propagation in Vocal Tract, F. Seydou, T. Seppanen, and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 631-634, June 20-25, 2004.

Near-Field Scanning Microwave Microscopy for Detection of Subsurface Biological Anomalies, X. Wu and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 3, pp. 2444-2447, June 20-25, 2004.

Simple and Accurate Circuit Models for High-Impedance Surfaces Embedded in Printed Circuit Boards, S. Shahparnia and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 3565-3568, June 20-25, 2004.

High-impedance Surfaces Embedded in Printed Circuit Boards: Design Considerations and Novel Applications, S. Shahparnia and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 3569 - 3572, June 20-25, 2004.

Electromagnetic Band-Gap Structures for Multiband Mitigation of Resonant Modes in Parallel-Plate Waveguides, T. Kamgaing and O. Ramahi, IEEE Antennas and Propagation Society Symposiums, Vol. 4, pp. 3577-3580, June 20-25, 2004.

Computation of Green's Function for Finite-Size Photonic Crystals by Boundary Element Method, F. Seydou, O. Ramahi, R. Duraiswami, and T. Seppdnen, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 4320 - 4323, June 20-25, 2004.

A Closed form Solution of the Helmholtz Equation for a Class of Chaotic Resonators, F. Seydou and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 4440 - 4443, June 20-25, 2004.

Life Consumption Monitoring for Electronics Prognostics, S. Mishra, S. Ganesan, M. Pecht and J. Xie, Proceedings of the IEEE Aerospace Conference, Vol. 5, pp. 3455 - 3467, March 6-13, 2004.

Simultaneous Switching Noise Mitigation in PCB Using Cascaded High-Impedance Surfaces, S. Shahparnia and O. Ramahi, Electronic Letters, Vol. 40 Issue 2, pp. 98-100, January 22, 2004.

Reliability of Pressure-Sensitive Adhesive Tapes for Heat Sink Attachment in Air-Cooled Electronic Assemblies, V. Eveloy, P. Rodgers, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 4, No. 4, pp. 650-657, December 2004.

In Situ Temperature Measurement of a Notebook Computer - A Case Study in Health and Usage Monitoring of Electronics, N. Vichare, P. Rodgers, V. Eveloy, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 4, No. 4, pp. 658-663, December 2004.

Application of Numerical Analysis to the Optimisation of Electronic Component Reliability Screening and Assembly Processes, V. Eveloy, P. Rodgers, and M. Hashmi, Journal of Materials Processing Technology, Vol. 155-156, pp. 1788-1796, 2004.

Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronic Systems, P. Sandborn and P. Singh, Proceedings of the International Society of Logistics (SOLE) International Conference and Exhibition, Norfolk, VA, September 2004.

Avionics Architecture Approach to the Sustainable Utilization of Commercial Technology, C. Wilkinson, IEEE Aerospace and Electronic Systems Magazine, Vol. 19, No. 10, pp. 7-10, October 2004.

Prognostics and Health Management for Improved Dispatchability of Integrated Modular Avionics Equipped Aircraft, C. Wilkinson, 23rd Digital Avionics Systems Conference (DASC), Salt Lake City, UT, October 2004.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages, E. Stellrecht, B. Han, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 3, pp. 499-506, September 2004.

Fill Pattern and Particle Distribution of Underfill Material, Y. Hang, D. Bigio and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 3, pp. 493-498, September 2004.

Application of Health Monitoring to Product Take-Back Decisions, N. Vichare, P. Rodgers, M. Azarian, and M. Pecht, Proceedings of the Joint International Congress and Exhibition - Electronics Goes Green 2004, pp. 945-951, Berlin, Germany, September 6-8, 2004.

Why Gold Flash Can Be Detrimental to Long-Term Reliability, J. Xie, M. Sun, M. Pecht, and D. Barbe, ASME Journal of Electronic Packaging, Vol. 126, Issue 1, pp. 37-40, March 2004.

The Concurrent Complementary Operators Method Applied to Two-Dimensional Time-Harmonic Radiation and Scattering Problems, V. Chebolu, X. Wu, and O. Ramahi, IEEE Transactions Antennas Propagation, Vol. 53, No. 2, pp. 408-415, February 2004.

Simulation Model Development for Solder Joint Reliability for High Performance FBGA Assemblies, H. Qi, M. Osterman, M. Lee, K. Lee, O. Seyong, and T. Schmidt, 2004 IEEE 20th Annual Semiconductor Thermal Measurement and Management, pp. 300-307, March 9-11, 2004.

Accelerated Testing and Finite Element Analysis of PBGA Under Multiple Environmental Loadings, H. Qi, A. Ganesan, M. Osterman, and M. Pecht, 2004 International Conference, IEEE Business of Electronic Product Reliability and Liability, pp. 99-106, April 27-30, 2004.

Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer, P. Rodgers, and V. Eveloy, Proceedings of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, pp. 495-583, 2004.

CFD Prediction of Electronic Component Operational Temperature on PCBs, P. Rodgers and V. Eveloy, Electronics Cooling, Vol. 10, No. 2, pp. 22-28, May 2004.

Design Challenges for High-Performance Heat Sinks used in Microelectronic Equipment: Evolution and Future Requirements, P. Rodgers, and V. Eveloy, Proceedings of the Fifth International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 527-529, 2004.

Contact Discontinuity Modeling of Electromechanical Switches, J. Xie and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 2, pp. 210-216, March 2004.

Numerical Prediction of Electronic Component Operational Temperature: A Perspective, V. Eveloy, P. Rodgers, and M. Hashmi, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 2, pp. 269-282, June 2004.

Electronic Part Obsolescence Driven Product Redesign Planning, P. Singh, P. Sandborn, T. Geiser and D. Lorenson, International Journal of Advanced Manufacturing Systems, Vol. 7, No. 1, pp. 23-32, 2004.

Thermal Assessment of Glass-Metal Composition Plasma Display Panels Using Design of Experiments, M. Lee, M. Pecht, W. Lee, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 1, pp. 210-216, March 2004.

Identification of Missing or Insufficient Electrolyte Constituents in Failed Aluminium Electrolytic Capacitors, C. Hillman and N. Helmold, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Has the Electronics Industry Missed the Boat on Pb-Free Failures in Ceramic Capacitors with Pb-Free Solder Interconnects, N. Blattau and C. Hillman, IPC/JEDEC 5th International Lead Free Conference on Electronic Components and Assemblies, San Jose, CA, March 18-19, 2004.

Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, and C. Hillman, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Questions Concerning the Migration to Lead-Free Solder, R. Ciocci, and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 34-40, 2004.

Assessing Lead-Free Intellectual Property, P. Casey and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 46-51, 2004.

Failure Mechanisms in Electronic Products at High Altitudes, N. Blattau and C. Hillman, 2004 Proceedings - 8th Annual Commercialization of Military & Space Electronics Conference, Los Angeles, CA, February 9 - 12, 2004.

Minimization of Life Cycle Costs Through Optimization of the Validation Program - A Test Sample Size and Warranty Cost Approach, A. Kleyner, P. Sandborn, and J. Boyle, Reliability and Maintainability Symposium, Los Angeles, CA, January 2004.

Indium Soldering for a MOEMS Based Safety and Arming Device, M. Deeds and P. Sandborn, the 9th Pan Pacific Microelectronics Symposium Exhibits & Conference, Kahuku, Oahu, Hawaii, February 2004.

Applications of In-Situ Health Monitoring and Prognostic Sensors, J. Xie and M. Pecht, the 9th Pan Pacific Microelectronics Symposium Exhibits & Conference, Kahuku, Oahu, Hawaii, 10-12 February, 2004.

Electrochemical Migration on HASL Plated FR-4 Printed Circuit Boards, E. Bumiller, M. Pecht and C. Hillman, Proceedings of 2004 SMTA Pan Pacific Microelectronics Symposium, Oahu, HI, pp. 201-205, February 11, 2004; Journal of Surface Mount Technology, Vol. 17, Issue 2, pp. 37-41, April-June 2004.

The Temperature Ratings of Electronic Parts, R. Mishra, M. Keimasi, and D. Das, Electronics Cooling, Vol. 10, No. 1, pp. 20-29, February 2004.

Load Characterization during Transportation, A. Ramakrishnan and M. Pecht, Microelectronics Reliability, Vol. 44, No. 2, pp. 333-338, February 2004.

Back to the Top

Computer Aided Reliability Assessment, J. Wu, M. Pecht and J. Wang, Proceedings of the Fifth International Conference on Electronic Packaging Technology (ICEPT2003), pp. 36-39, October 28-30, 2003.

A Simple Finite-Difference Frequency-Domain (FDFD) Algorithm for Analysis of Switching Noise in Printed Circuit Boards and Packages, M. Ramahi, V. Subramanian, and B. Archambeault, IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, pp. 191-198, May 2003.

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms, Z. Shi and P. Sandborn, Proceedings Test Conference, Vol. 1, pp. 937-946, September 30 - October 2, 2003.

Strain Evaluation of Epoxy-Cured Fiber-Optic Connectors, K. Broadwater, D. Barker, P. Mead, J. Kolasinski, and J. Watkins, Journal of Lightwave Technology, Vol. 21, No. 7, pp. 1668-1675, July 2003.

Design Guidelines for Avoiding Flex Cracking in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Global SMT and Packaging, Vol. 3, No. 1, pp. 18-21, January/February 2003.

Hygroscopic Swelling of Encapsulated Microcircuits - Part I, B. Han, E. Stellrecht, and M. Pecht, Advanced Packaging, pp. 31-35, June 2003.

Reliability Capability Assessment Methodology, S. Tiku and M. Pecht, Proceedings of IMAPS Brazil 2003, the International Technical Symposium on Packaging, Assembling and Testing & Exhibition, Campinas - SP, Brazil, August 6-8, 2003.

Organizational Reliability Capability, S. Tiku, M. Pecht, and J. Strutt, Proceedings of Canadian Reliability and Maintainability Symposium, Ottawa, Canada, October 16-17, 2003.

Evaluation of Selected Japanese Lead-Free Consumer Electronics, Y. Fukuda, P. Casey, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 4, pp. 305-312, October 2003.

Thermomechanical Analysis of Gold-Based SiC Die-Attach Assembly, K. Meyyappan, P. McCluskey, and L. Chen, Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 152-158, December 2003.

Reliability Prediction Modeling of Semiconductor Light Emitting Device, J. Xie and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 218-222, December 2003.

An Investigation of the Contact Resistance of a Commercial Elastomer Interconnect Under Thermal and Mechanical Stresses, W. Liu, M. Lee, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 2, pp. 39-43, June 2003.

Determining the Lifetime of Silver-Filled Isotropic Conductive Adhesive (ICA) / Solder Plated Interconnections, N. Helmold, P. Iyer, and C. Hillman, Proceedings of the IMAPS Advanced Technology Workshop on Optoelectronics Device Packaging and Materials, Bethlehem, PA, October 2003.

Optimum Technology Insertion into Systems Based on the Assessment of Viability, P. Sandborn, T. Herald, J. Houston, and P. Singh, IEEE Transaction on Components and Packaging Technologies, Vol. 26, No. 4, pp. 734-738, December 2003.

Application of 3D Measurement System with CCD Camera in Microelectronics, M. Lee, M. Pecht J. Tyson, and I. CMD, Advanced Packaging, pp. 33-34, November 2003.

Methods for Predicting the Remaining Life of Electronic Assemblies with Carbon Nanotubes and an Optical Transduction Technique, P. Casey, S. Ganesan, M. Pecht and D. Anand, Proceeding of IMECE' 03 - 2003 ASME International Mechanical Engineering Congress, Washington D.C., November 15-21, 2003.

Characterization of Anisotropic Conductive Adhesives, P. Iyer, P. Baumgaertner, D. Farley, and A. Dasgupta, Proceedings of ASME IMECE 2003 - 2003 ASME International Mechanical Engineering Congress and RD&D Expo, Washington, D.C., November 15-21, 2003.

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms, Z. Shi and P. Sandborn, Proceedings of the International Test Conference, October 2003.

Performance of Plated Additive Resistors, M. Wood, D. Fritz, D. Sawoska, F. Durso, L. Salzano, and P. Sandborn, Proceedings Taiwan Printed Circuit Association Meeting, October 2003.

Cost and Production Analysis for Substrates with Embedded Passives, P. Sandborn, B. Etienne, J. W. Herrmann, and M. M. Chincholkar, Circuit World, Vol. 30, No. 1, pp. 25-30, 2003.

Modeling Test, Diagnosis, and Rework Operations and Optimizing Their Location in General Manufacturing Processes, Z. Shi and P. Sandborn, ASME 8^th Design for Manufacturing Conference, Chicago, IL, September 2003.

Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments, D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, and A. Dasgupta, The SMTA International Annual Conference, Chicago, IL, September 21-25, 2003.

Environmental Aging and De-Adhesion of Siloxane-Polyimide-Epoxy Adhesive, S. Murray, C. Hillman and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 524-531, September 2003.

Lead-Free Soldering in the Japanese Electronics Industry, Y. Fukuda, M. Pecht, K. Fukuda and S. Fukuda, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 616-624, September 2003.

A Life Consumption Monitoring Methodology for Electronic Systems, A. Ramakrishnan and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 625-634, September 2003.

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders, Q. Zhang, A. Dasgupta and P. Haswell, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Auditing the Reliability Capability of Electronics Manufactures, S. Tiku and M. Pecht, Advances in Electronic Packaging, v 1, Advances in Electronic Packaging 2003: Volume 1, pp. 947-953, 2003
(Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.)

A Review of the Economics of Embedded Passives, P. Sandborn, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Surface Finish Effects on High-Speed Interconnects, X. Wu, M. Ramahi, G. Brist, and D. Cullen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Compact Modeling of Unshrouded Plate Fin Heat Sinks, S. Narasimhan and A. Bar-Cohen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Pool Boiling of Water and FC-72 on Copper and Graphite Foams, S. Moghaddam, M. Ohadi and J. Qi, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices, G. Solbrekken, K. Yazawaand, and A. Bar-Cohen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability, E. Stellrecht, B. Han, and M. Pecht, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement, S. Kwon, Y. Lee, and B. Han, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Wire Flexure Fatigue Model for Asymmetric Bond Height, K. Meyyappan, P. Hansen and P. McCluskey, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging, R. Swaminathan, H. Bhaskaran, P. Sandborn, G. Subramanian, M. Deeds, and K. Cochran, IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, pp. 141-151, May 2003.

Failures in Base Metal Electrode (BME) Capacitors, D. Donahoe, C. Hillman and M. Pecht, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 129-133, Scottsdale, AZ, March 31 - April 3, 2003.

Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, and C. Hillman, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 155-162, Scottsdale, AZ, March 31 - April 3, 2003.

The Economics of Embedded Passives, P. Sandborn, in Integrated Passive Component Technology, Wiley- IEEE Press, 2003.

The NEMI Roadmap: Integrated Passives Technology and Economics, J. Dougherty, J. Galvagni, L. Marcanti, R. Sheffield, P. Sandborn, and R. Ulrich, Proceedings of the Capacitor and Resistor Technology Symposium (CARTS), Scottsdale, AZ, April 2003.

Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging, H. Ardebili, E. Wong, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 206-214, March 2003.

Ion Transport in Encapsulants Used in Microcircuit Packaging, L. Lantz II and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 199-205, March 2003.

Failure Analysis of Electrostatic Discharge and Electrical Overstress Failures of GaAs MMIC, Y. Hwang, M. Lee and M. Pecht, IMAPS Advanced Technology Conference on 3-D Packaging, pp. 1-5, Baltimore, MD, March 11-13, 2003.

Fill Pattern of Underfill and Particle Distribution, Y. Huang, D. Bigio and M. Pecht, Society of Plastics Engineers Annual Technical Conference, pp. 1289-1293, Nashville, TN, May 4-8, 2003.

Investigation of Packaging Properties as a Function of Filler Microstructures, Y. Huang, D. Bigio, and M. Pecht, Society of Plastics Engineers Annual Technical Conference, pp. 1320-1324, Nashville, TN, May 4-8, 2003.

Test Tailoring Methodology for Impact Testing of Portable Electronic Products, J. Varghese and A. Dasgupta, IMAC-XXI Conference on Structural Dynamics, Kissimmee, Florida, February 3-6, 2003.

Carbon Nanotubes and an Optical Method for Life Consumption Monitoring of Electronic Assemblies, P. Casey, D. Anand, and M. Pecht, Proceedings of the 8th Annual Pan Pacific Microelectronics Symposium, Maui, HI, pp. 225-234, February 18-20, 2003.

Field Failure Due to Creep Corrosion on Components with Palladium Pre-plated Leadframes, P. Zhao and M. Pecht, Microelectronics Reliability, Vol. 43, No. 5, pp. 775-778, 2003.

Isothermal Mechanical Creep and Fatigue of Pb-free Solders, Q. Zhang, P. Haswel,l and A. Dasgupta, International Brazing &Soldering Conference, San Diego, CA, February 16-19, 2003.

Diffusion and Absorption of Corrosive Gases in Electronic Encapsulants, C. Hillman, B. Castillo, and M. Pecht, Microelectronics Reliability, Vol. 43, pp. 635-643, April, 2003.

Optical Measurement of Flip-Chip Package Warpage and Its Effect on Thermal Interfaces, B. Han, Electronics Cooling, Vol. 9, No. 1, pp. 10-14, February 2003.

Remaining Life Assessment of Aging Electronics in Avionic Applications, R. Valentin, M. Osterman, and B. Newman, The Annual Reliability and Maintainability, 2003 Proceedings, pp. 313-318, Tampa Florida, January 27-30, 2003.

A Novel Power Plane with Integrated Simultaneous Switching Noise Mitigation Capability Using High Impedance Surface, T. Kamgaing and O. Ramahi, IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1, pp. 21-23, January 2003.

Characterization of Some Commercial Thermally-Cured Potting Materials, I. Baylakoglu, C. Hillman, and M. Pecht, Proceedings of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong, January 13-14, 2003.

Back to the Top

,

Average Elastic Fields and Scale-Dependent Overall Properties of Heterogeneous Micropolar Materials Containing Spherical and Cylindrical Inhomogeneities, P. Sharma and A. Dasgupta, Physical Review B, Vol. 66, No. 22, 22410, December, 2002.

Recommendations for Future Avionics Hardware Development, C. Wilkinson, M. Pecht, J. Wasson, and L. Condra, Proceedings of the World Aviation Congress, Phoenix, AZ, November 2002.

The Technical, Social and Legal Outlook for Lead-Free Solders, P. Casey and M. Pecht, IEEE International Symposium on Electronic Material and Packaging, pp. 483-492, Kaohsiung, Taiwan, December, 2002.

Challenges for Adopting Pb-Free Interconnects for "Green" Electronics, P. Casey and M. Pecht, IPC/JEDEC International Conference on Lead-Free Electronic Components and Assemblies, pp. 21-32, Taipei, Taiwan, December 10-12, 2002.

Thermal Characteristics of Glass-Metal Composition Plasma Display Panels, M. Lee and M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 25, No. 4, pp. 488-494, 2002.

Remaining Life Assessment of Shuttle Remote Manipulator System End Effector, V. Shetty, D. Das, M. Pecht, D. Hiemstra, and S. Martin, Proceedings of the 22nd Space Simulation Conference, Ellicott City, MD, October 21-23, 2002.

Concurrent Complementary Operators for Mesh Truncation in Frequency-Domain Simulations, O. Ramahi, IEEE Microwave and Wireless Components Letters, Vol. 12, No. 3, pp. 99-101, March 2002.

Observing Real-Time Thermal Deformations in Electronic Packaging, S. Cho, S. Cho and B. Han, Experimental Techniques, Vol. 26, No. 3, pp. 25-29, May/June 2002.

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly under Accelerated Thermal Cycling Condition, B. Han, S. Cho, and J. Joo, Journal of Electronic Packaging, Transaction of the ASME, August 2002.

Effect of Underfill on Flip-Chip Solder Bumps: An Experimental Study By Microscopic Moire Interferometry, S. Cho and B. Han, The International Journal of Microcircuits and Electronic Packaging, Vol. 24, No. 3, pp. 217-239, 2002.

Virtual Life Assessment of Electronic Hardware Used in the Advanced Amphibious Assault Vehicle (AAAV), R. Valentin, J. Cunningham, M. Osterman, A. Dasgupta, M. Pecht, and D. Tsagos, Proceedings of the 2002 Winter Simulation Conference, Vol. 1, pp. 948-953, San Diego, California, December 8-11, 2002.

Stress Relaxation in Plastic Molding Compounds, M. Lee, M. Pecht, X. Huang, and R. Lee, IEEE International Symposium on Electronic Material and Packaging, pp. 1-6, Kaohsiung, Taiwan, December, 2002.

Design Guidelines for Avoiding Flex Cracking in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Proceedings of the National Electronic Packaging and Production Conference (NEPCON -West), CA version pp. 318-326, San Jose, CA, December 2002.

Isothermal Mechanical Fatigue of Pb-free Solders: Damage Propagation Rate & Time to Failure, Q. Zhang, P. Haswell, A. Dasgupta, and M. Osterman, 34th International SAMPE Technical Conference, Baltimore, MD, November 4-7, 2002.

Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys, Q. Zhang, P. Haswell, and A. Dasgupta, Proceedings ASME IMECE 2002, New Orleans, LA, November 17-22, 2002.

Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts, J. Wu and M. Pecht, Proceedings of the 4th Electronics Packaging Technology Conference, Singapore, pp. 20-24, December 10-12, 2002.

Plastic Ball-Grid-Arrays (PBGA): Are They Ready for Environmentally Harsh Aerospace Applications? R. Guha, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, M. Osterman, H. Qi, J. Kennedy, and J. Veum, 02WAC-149, World Aviation Congress & Display (WAC), Phoenix, AZ, November 5-7, 2002.

Underfilled PBGA Packages and Their Board Level Cycling and Vibration Performance, T. Baumann, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, J. Kennedy, J. Veum, H. Qi, and M. Osterman, SMTA International 2002, Donald Stephens Convention Center, Rosemont, IL, September 24-26, 2002.

Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht, D. Das, and R. Biagini, Proceedings of The 3rd International Conference on Quality and Reliability, pp. 182-192, Australia, August 28-30, 2002.

Airborne Operation of Portable Electronic Devices, L. Lin, J. Xie, O. Ramahi M. Pecht, and B. Donham, IEEE Antenna's and Propagation Magazine, Vol. 44, No. 4, pp. 30-39, August 2002.

The IEEE Standards on Reliability Program and Reliability Prediction Methods for Electronic Equipment, M. Pecht, D. Das, and A. Ramakrishnan, Microelectronics Reliability, Vol. 42, pp. 1259-1266, 2002.

Determining Optimum Redesign Plans for Avionics Considering Electronic Part Obsolescence Forecasts, P. Singh, P. Sandborn, D. Lorenson, and T. Geiser, Proceedings World Aviation Congress (SAE Technical Paper: 2002-1-3012), Phoenix, AZ, November 2002.

Aging Aircraft Usable Life and Wear-out Issues, D. Humphrey, W. Shawlee, P. Sandborn, and D. Lorenson, Proceedings World Aviation Congress (SAE Technical Paper: 2002-1-3013), Phoenix, AZ, November 2002.

Electronic Part Obsolescence Driven Design Refresh Optimization, P. Sandborn and P. Singh, Proceedings FAA/DoD/NASA Aging Aircraft Conference, San Francisco, CA, September 2002.

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects, J. Okura, A. Dasgupta, and J. Caers, Transactions of the ASME, Vol. 124, pp. 184-187, September 2002.

Thermomechanical Durability of High I/O BGA Packages, P. Davuluri, S. Shetty, A. Dasgupta, and S. Young, Transactions of the ASME, Vol. 124, pp. 226-270, September 2002.

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part I: Formulation, P. Sharmal and A. Dasgupta, Transactions of the ASME, Vol. 124, pp. 292-297, September 2002.

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data, P. Sharmal and A. Dasgupta, Transactions of the ASME, Vol. 124, pp. 298-304, September 2002.

Application of the Concurrent Complementary Operators Method to Numerically-Derived Absorbing Boundary Conditions, X. Wu and O. Ramahi, Microwave and Optical Technology Letters, Vol. 32, No. 4, pp. 272-275, February, 2002.

Analysis and Reduction of Electromagnetic Field Leakage through Loaded Apertures, L. Li and O. Ramahi, IEEE Antennas and Propagation Society/URSI International Symposium. San Antonin, TX, June 16-21, 2002.

Calculation and Mitigation of Power Plane Resonance in Printed Circuit Boards (PCB), V. Subramanian and O. Ramahi, In Proceedings IEEE Antennas and Propagation Society/URSI International Symposium, San Antonio, TX, June 16-21, 2002.

Electronic Part Obsolescence Driven Design Refresh Optimization, P. Singh, P. Sandborn, T. Geiser, and D. Lorenson, Proceedings International Conference on Concurrent Engineering, pp. 961-970, Cranfield University, UK, July 2002.

A Detailed Cost Model for Concurrent Use With Hardware/Software Co-Design, D. Ragan, P. Sandborn, and P. Stoaks, Proceedings IEEE Design Automation Conference, pp. 269-274, New Orleans, LA, June 2002.

Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu, Y. Zheng, C. Hillman, and P. McCluskey, presented on Proceedings of the 52nd Electronic Components & Technology Conference, pp. 1226-1231, San Diego CA, 2002.

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints, Y. Zheng, C. Hillman, and P. McCluskey, presented on AESF SUR/FIN 2002 Chicago IL, June 24-27, 2002.

A Review of Reliability Prediction Methods for Electronic Devices, B. Foucher, J. Boullie, B. Meslet, and D. Das, Microelectronics Reliability, Vol. 42, No. 8, pp. 1155-1162, August, 2002.

Characterization of Plastic Encapsulant Materials as a Baseline for Quality Assessment and Reliability Testing, L. Lantz, S. Hwang, and M. Pecht, Microelectronics Reliability, Vol. 42, No. 8, pp. 1163-1170, August, 2002.

Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal, R. Ciocci, J. Wu, and M. Pecht, European Microelectronics Packaging and Interconnection Symposium, Cracow, Poland, pp. 73-80, June 16-18, 2002.

Remaining Life Prediction of Electronic Products Using Life Consumption Monitoring Approach, S. Mishra, M. Pecht, T. Smith, I. McNee, and R. Harris, European Microelectronics Packaging and Interconnection Symposium, Cracow, pp. 136-142, June 16-18, 2002.

The "Trouble Not Identified" Phenomenon in Automotive Electronics, D. Thomas, K. Ayers, and M. Pecht, Microelectronics Reliability, Vol. 42, pp. 641-651, 2002.

Tracking Semiconductor Part Changes Through the Part Supply Chain, S. Murray, M. Boru, M. Pecht, and D. Erhart, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, pp. 230-238, June 2002.

Uprating of a Single Inline Memory Module, N. Pendse, D. Thomas, D. Das, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, pp. 266-269, June 2002.

In-situ Sensors for Product Reliability Monitoring, S. Mishra, M. Pecht, and D. Goodman, Proceedings of SPIE, Vol. 4755, pp. 10-19, 2002.

Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach, K. Cluff and M. Osterman, presented at IPC Printed Circuits Expo 2002, Long Beach Convention Center, Long Beach, CA, March 24-28, 2002.

Simulation Improved Testing of Electronic Hardware, M. Osterman, A. Dasgupta, and L. Tonnelier, 2002 Proceedings of the 48th ATM, ISBN: 1-877862-81-9, Document No. 2011, Published on April 1, 2002.

Lifetime RC Time Delay of On-Chip Copper Interconnect, M. Sun, M. Pecht, and D. Barbe, IEEE Transactions on Semiconductor Manufacturing, Vol. 15, No. 1, pp. 253-259, May 2002.

A Comparison of the Theory of Moisture Diffusion in Plastic Encapsulated Microelectronics with Moisture Sensor Chip and Weight-Gain Measurements, H. Ardebili, C. Hillman, M. Natishan, P. McCluskey, M. Pecht, and D. Peterson, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp. 132-139, March 2002.

Electrical Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu, M. Pecht, and R. Mroczkowski, Journal of Surface Mount Technology, Vol. 14, Issue. 2, pp. 25-29, June 2002. Also presented at Pan Pacific Microelectronics Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002.

The Business, Product Liability and Technical Issues Associated with Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht and R. Biagini, Pan Pacific Microelectronics Symposium, pp. 391-398, Maui, Hawaii, February 5-7, 2002.

Solder Joint Crack Propagation in Plastic and Ceramic Packaged Diodes mounted on Insulated Metal Substrate, N. Sangalli and D. Barker, 2001 Electronic Components and Technology Conference, 2001.

On the Design Parameters of Flip-Chip PBGA Package Assembly for Optimum Solder Ball Reliability, K. Verma, S. Park, and B. Han, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 300-307, 2001.

Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moire Interferometry, Z. Wu, S. Cho, and B. Han, Experimental Techniques, Vol. 25, No. 3, pp. 22-25, 2001.

DMD^TM Package Model Calibration Using Interferometry, M. Variyam and B. Han, TI Technical Journal, pp. 1-9, 2001.

Modeling of Effects of Geometry and Temperature Cycle on Viscoplastic Deformation and Durability of FCOC Solder Joints, Q. Zhang, Y. Joshi, A. Dasgupta, and R.Pal, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 9-13, 2001.

Failures in Electronic Assemblies and Devices, M. Pecht, P. McCluskey, and J. Evans, Product Integrity and Reliability in Design, Chapter 8, Spring, 2001.

Failure Analysis of Electronic Assemblies and Devices, M. Pecht and P. McCluskey, Product Integrity and Reliability in Design, Chapter 13, Spring, 2001.

Microthermomechanical Analysis of Lead-Free Sn3.9Ag0.6Cu Alloys; Part I: Viscoplastic Constitutive Properties; and Part II: Cyclic Durability Properties, P. Haswell, A. Dasgupta, and A. Paper, MRS Proceedings, N2.1, Vol. 682E, MRS Spring Symposium on Microelectronics and Microsystems Packaging; Editors: Boudreaux, Dauskardt, Last, and McCluskey, Chicago IL, 2001.

The NEMI Roadmap Perspective on Integrated Passives, J. Dougherty, J. Galvagni, L. Marcanti, P. Sandborn, R. Charbonneau, and R. Sheffield, Proceedings of the European Microelectronics and Packaging Conference & Exhibition, May 2001.

Engineered Reliability for Intelligent Well Systems, A. Veneruso, A. Kosmala, R. Bhavsar, J. Bernard, and M. Pecht, OTC 1301, Offshore Technology Conference, Houston, TX, April 30 - May 3, 2001.

A New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of Electronic Systems Assembly, T. Trichy, P. Sandborn, and S. Sahasrabudhe, Proceedings of the International Test Conference, pp. 1108-1117, Baltimore MD, November 2001.

Lead-free Solder Replacement: Beyond the Material Substitution, R. Ciocci, Environmentally Conscious Manufacturing II, Vol. 4569, pp. 100-108, Newton, USA, 28-29, October 2001.

IC Component Sockets: Applications and Challenges, W. Liu, M. Pecht, and R. Martens, International Microelectronics And Packaging Society, First Issue, pp. 61-67, 2001.

Using PEEC and FDTD to Solve the Challenge Delay Line Problem, B. Archambeault, A. Roden, and O. Ramahi, IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, August 13-17, 2001.

Full-Wave Analysis of Delay Lines, O. Ramahi and B. Archambeault, 14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland, February 20-22, 2001.

Phased-Array Radar for Breast Cancer Detection, O. Ramahi, T. Thakker, S. Trabelsi, and R. Russell, IEEE Antennas and Propagation Society International Symposium, Boston, MA, July 8-13, 2001.

Prediction of Shielding Degradation Arising from Variation in Contact Impedance of Inter-metallic Junctions, L. Li and O. Ramahi, IEEE Antennas and Propagation Society International Symposium, Boston MA, July 8-13, 2001.

Complementary Operators and Associated Issues of Instability, O. Ramahi, In Proceedings International Conference on Electromagnetics in Advanced Applications (ICEAA01), Torino, Italy, September 10-14, 2001.

Towards a Numerically-Comprehensive Theory for the Complementary Operators Method, O. Ramahi, URSI International Symposium on Electromagnetic Theory, Victoria, Canada, May 13-17, 2001.

Manufacturer Assessment Procedure and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and R. Uppalapati, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October 2001.

Part Assessment Guidelines and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and D. Humphrey, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 339-350, October 2001.

Rapid Reliability Assessment of ULSI Electronics, P. McCluskey, Proceedings of the 18th International VLSI Multilevel Interconnection, Santa Clara CA, November 28-29, 2001.

Evaluating the Performance and Reliability of Embedded Computer Systems for Use in Industrial and Automotive Temperature Ranges, C. O'Connor, K. Nathan, and P. McCluskey, Intel Developer Network News, Vol. 1, pp. 62-65, 2001.

Microsystem Packaging for High Temperature and Harsh Environments, L. Chen and P. McCluskey, MST (Microsystems) News, pp. 41-42, September 2001.

Junction Temperature Considerations in Evaluating Electronic Parts for Use Outside Manufacturers-Specified Temperature Ranges, L. Condra, D. Das, N. Pendse, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 721-728, December 2001.

Parameter Recharacterization: A Method of Thermal Uprating, D. Das, N. Pendse, C. Wilkinson, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 729-737, December 2001.

Process Capability and Product Reliability, B. Ramakrishnan, P. Sandborn, and M. Pecht, Microelectronics Reliability, Vol. 41, No. 12, pp. 2067-2070, December 2001.

Using Yielded Cost as a Metric for Modeling Manufacturing Processes, D. Becker and P. Sandborn, Proceedings ASME 6th Design for Manufacturing Conference, Pittsburgh PA, September 2001.

Fundamental Reliability Issues Associated with A Commercial Particle-in-Elastomer Interconnection System, W. Liu, M. Pecht and J. Xie, IEEE Transactions on Components and Packaging Technologies, Volume 24, No. 3, pp. 520-525, September, 2001.

Reliability Engineering in the 21st Century - A Focus on Predicting the Reliability of Electronic Products and Systems, M. Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1, pp. 1-19, Dalian, China, August 28-31, 2001.

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending, S. Shetty, V. Lehtinen, A. Dasgupta, and V. Halkola and T. Reinikainen, Journal of Electronic Packaging, Vol. 123, Issue 3, pp. 302-308, September 2001.

Hollow Fibers can Accelerate Conductive Filament Formation, M. Pecht, K. Rogers, and C. Hillman, ASM International Practical Failure Analysis, pp. 57-60, Vol. 1, Issue 4, August 2001.

Application-Specific Economic Analysis of Integral Passives, P. A. Sandborn, B. Etienne, and G. Subramanian, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 203-213, July 2001.

On the Use of Yielded Cost in Modeling Electronic Assembly Processes, D. Becker and P. Sandborn, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 195-202, July 2001.

Lead-free Solder and the Consumer Electronics Market, R. Ciocci, Proceedings of 2001 Green Engineering Conference, July 29-31, 2001, Roanoke, VA.

Mechanical Design Parameters for Enhanced Solder Ball Reliability of Flip-Chip PBGA Package Assembly, K. Verma, S. Park, and B. Han, Proceedings of IPACK'01, July 8-13, 2001, Kauai, Hawaii, USA.

Real-Time Moire Interferometry for Deformation Analysis under Accelerated Thermal Cycling Condition, S. Cho, J. Joo, and B. Han, Proceedings of IPACK'01, Kauai, Hawaii, July 8-13, 2001.

Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moire Interferometry, B. Han, Z. Wu, and S. Cho, Experimental Techniques, Vol. 25, No. 3, pp. 22-25, 2001.

High Performance Packaging Materials for Improved Thermal Management of Power Electronics, K. Moores and Y. Joshi, Future Circuits International, Issue No. 7, pp. 45-49, 2001.

Thermal Characterization of a Liquid Cooled AlSiC Base Plate with Integral Pin Fins K. Moores, Y. Joshi, and G. Schiroky, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 213-219, 2001.

A Demonstration of Virtual Qualification for the Design of Electronic Hardware, J. Cunningham, R. Valentin, C. Hillman, A. Dasgupta, and M. Osterman, ESTECH 2001, IEST, Phoenix, AZ, April 2001.

Carrier-Level Packaging and Reliability of a MEMS-Based Safety and Arming Device, M. Deeds, K. Cochran, R. Swaminathan, and P. Sandborn, Proceedings MRS Spring Meeting, April 2001.

Lifecycle Forecasting of ASICs, Z. Huang, P. Sandborn, M. Pecht, and R. Solomon, Future Circuits International, Issue 7, pp. 101-107, Technology Publishing Ltd, London, UK, 2001.

Progress on Internet-Based Educational Material Development for Electronic Products and Systems Cost Analysis, P. Sandborn and C. Murphy, Proceedings of the Electronic Components and Technology Conference (ECTC), pp. 1261-1266, Lake Buena Vista, FL, June 1, 2001.

A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics, P. McCluskey, Proceedings of the Electronic Component and Technology Conference (ECTC), pp. 397-400, Lake Buena Vista, FL, May 30, 2001.

Application-Specific Economic Analysis of Integral Passives in Printed Circuit Boards, B. Etienne and P. A. Sandborn, Proceedings of the IMAPS Advanced Packaging Materials Processes, Properties and Interfaces Symposium, Braselton GA, pp. 399-404, March 2001.

An Investigation of the Mechanical Behavior of Conductive Elastomer Interconnects, J. Xie, M. Pecht, D. DeDonato, and A. Hassanzadeh, Microelectronics Reliability, Vol. 41, No. 1, pp. 281-286, 2001.

Fatigue and Intermetallic Formation in Lead Free Solder Die Attach, P. McCluskey, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai HI, July 9-13, 2001.

Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling, A. Dasgupta, P. Sharma, and K. Upadhyayula, International Journal of Damage Mechanics, Vol. 10, pp. 101-132, April 2001.

We STILL have a headache with Arrhenius, M. Osterman, Electronics Cooling, Vol. 7, No. 1, pp 53-54, February 2001.

An Evaluation of Built-In Test, M. Pecht, M. Dube, M. Natishan, R. Williams, J. Banner, and I. Knowles, IEEE Transactions on Aerospace and Electronic Systems, Vol. 37, No. 1, pp. 266-272, January 2001.

Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.

Deciphering the DELUGE of DATA - Understanding Electronic Part Data Sheets for Parts Selection and Management, D. Das, N. Pendse, M., L. Condra and C. Wilkinson, Circuit & Devices, pp. 26-34, Septermber 2000.

Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures, E. Yu and Y.. Joshi, IEEE Transactions on components and Packaging Technologies, Vol. 23, No. 1, March 2000.

Assessing the Operating Reliability of Land Grid Array Elastomer Sockets, J. Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassenzadeh, and D. Dedonato, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 171-176, March 2000.

Moire Interferometry for Engineering Mechanics: Current Practices and Future Developments, B. Han, D. post, and P. Ifju, Journal of Electronic Packaging, Transaction of the ASME, Vol. 122, No. 3, pp. 294-300, 2000.

Parameter Re-characterization Case Study: Electrical Performance Comparison of the Military and Commercial Versions of a TI Octal Buffer, N. Pendse and M. Pecht, Future Circuits International, Vol. 6, pp. 63-67, Technology Publishing Ltd, London, UK, 2000.

Risk Assessment, Mitigation and Management - The Key Focus of Competitive Electronic Products Development in the 21st Century, M. Pecht, D. Das, and L. Yang, Proceedings of the SEMICON Korea Technical Symposium 2000, Seoul, Korea, pp. 217-224, February 16, 2000.

Effect of Condensor Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon, Y. Lang, Y. Joshi, and W. Nakayama, Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems, pp. 304-311, Banff, Alberta, Canada, October 15-20, 2000.

Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies, J. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. Caers and T. Reinikainen, Microelectronics Reliability, Vol. 40, No. 7, pp. 1173-1180, July 2000.

Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, C. Ramaswamy, Y. Joshi and W. Nakayama, IEEE transctions on Components and Packaging Technologies, Vol. 23, No.1,pp. 61-69, March 2000.

Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, Avionics Handbook, pp. 22-1 to 22-21, CRC Press, Boca Raton, Florida, December 2000.

Thermal Management of High Temperature Pulsed Electronics Using Phase Change Materials, S. Gurrum, Y. Joshi and J. Kim, 34th National Heat Transfer Conference Pittsburgh, NHTC 2000-12197, Pennsylvania, August 20-22, 2000.

Method for Assessing Remaining Life in Electronic Assemblies, P. McCluskey, J. Kweon, J. Kim and H. Jeon, Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306, 2000.

Reliable Use of Commercial Technology in High Temperature Environments, P. McCluskey, K. Mensah, C. O'Connor and A. Gallo, Microelectronics Reliability, Vol. 40, No. 8-10, pp. 1671-1678, August - October 2000.

Single Chamber Compact Thermosyphons with Micro-Fabricated Components, S. Murthy, Y. Joshi and W. Nakayama, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (I-Therm), Las Vegas NV, May 2000.

Electronic Part Life Cycle Concepts and Obsolescence Forecasting, R. Solomon, P. Sandborn and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 707-717, December 2000.

Development and Activities of the IEEE Reliability Standards Group, M. Pecht and A. Ramakrishnan, Journal of the Reliability Engineering Association of Japan, Vol. 22, No. 8, pp. 699-706, November 2000.

Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, The Modern Microwave and RF Handbook, pp. 3-102 to 3-121, CRC Press, Boca Raton, Florida, 2000.

Kinetic Model for Noble Plated Electrical Contact Behavior, M. Sun, M. Pecht and R. Martens, Scripta Materialia, Vol. 42, pp. 1-8, January 2000.

Effectiveness of Conformal Coatings on a PBGA Subjected to Unbiased High Humidity, High Temperature Tests, K. Zhang and M. Pecht, Microelectronics International, Vol. 17, No. 3, pp. 16-20, 2000.

Accelerated Testing of Microelectronics: Review, Pitfalls and New Developments, A. Katz, M. Pecht and E. Suhir, Proceeding of the IMAPS International Symposium on Microelectronics and Packaging, Tel Aviv, Israel, pp. 31-42, June 15, 2000.

Semiconductor Companies in China, W. Liu, M. Pecht and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 148-154, September 2000.

A Comparison with Taiwan, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 135-136, September 2000.

Newer Fabs in China, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 156-162, September 2000.

Trends in China's Semiconductor Industry, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 134-144, September 2000.

Virtual Prototyping Printed Circuit Boards, P. Sandborn, The Board Authority, Vol. 2, No. 4, pp. 6-10, December 2000.

An Investigation of the Electrical Contact Resistance of Corroded Pore Sites on Gold Plated Surfaces, R. Martens and M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 23, Issue 3, pp. 561-567, August 2000.

New Course Development in Products and Systems Cost Analysis, P. Sandborn, D. T. Allen, and C. F. Murphy, Proceedings Electronic Components and Technology Conference, pp. 1021-1026, May 2000.

Packaging of a MEMS Based Safety and Arming Device, M. Deeds, K. Cochran, P. Sandborn and R. Swaminathan, ITHERM 2000 Proceedings, Vol. 1, pp. 107-112, May 2000.

Test and Evaluation of Chip-to-Chip Attachment of MEMS Devices, P. Sandborn, R. Swaminathan, G. Subramanian, M. Deeds, and K. Cochran, ITHERM 2000 Proceedings, Vol. 1, pp. 133-140, May 2000.

Contact Variation and Shielding Performance of Electromagnetic Shielding Gaskets, J. Xie, M. Pecht, and D. Barbe, Proceedings of the 33rd Annual Connector and Interconnection Technology Symposium and Trade Show, Orlando FL, pp. 61-70, October 23-25, 2000.

An Avionics Guide to Uprating of Electronic Parts, D. Humphrey, L. Condra, N. Pends, D. Das, C. Wilkinson and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 595-599, September, 2000.

Chinese Electronics Industry in the Year 2000, C. Lee, M. Pecht, and Y. Chen, IMAPS Taiwan Technical Symposium 2000, Session 4, pp. 289-302, 2000.

Understanding Electronic Part Data Sheets for Parts Selection and Management, D. Das, N. Pends, M. Pecht, L. Condra, and C. Wilkinson, IEEE Circuits and Devices, Vol. 16, No. 5, pp. 26-34, September 2000.

Effects and Interactions of Design Parameters for Gold-Plated Electric Contacts, R. Martens and M. Pecht, Journal of Materials Science: Materials in Electronics , Vol. 11, pp. 209-218, May 2000.

Equipment Supplier Intervention Techniques, C. A. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, Future EMS International, No. 3, pp. 97-100, 2000.

Numerical and Experimental Thermal Characterization of a Liquid Cooled AlSiC Power Electronics Base Plate with Integral Pin Fins, K. Moores, Y. Joshi, and G. Schiroky, ITHERM 2000 Proceedings, Vol. 2. pp. 385-390, May 2000.

Effect of Corrosion on the Transfer Impedance of Zinc-Coated Steel Enclosures, J. Xie, M. Pecht, D. Barbe, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 1, pp. 71-76, February 2000.

Electronic Products and Systems Research and Education for the 21st Century, Y. Joshi and P. Sandborn, Future Circuits International, Vol. 6, pp. 88-91, 2000.

Corrosion of a Zinc-coated Steel Enclosure at the Contact Interfaces of Gasket Joints, J. Xie, M. Pecht, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 136-142, March 2000.

Assessing the Operating Reliability of LGA Elastomer Sockets, J. Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassanzadeh, and D. DeDonato, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 171-176, March 2000.

The Electronic Part Life Cycle, M. Pecht and D. Das, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 190-193, March 2000.

Failure Assessment Software for Circuit Card Assemblies, M. Osterman and T. Stadterman, Annual Proceedings of Reliability and Maintainability Symposium, pp. 269-276, January 18-21, 1999.

Performance Assessment of Thermoelectric Coolers for Use in High Temperature Electronics Applications, K. Moores, Y. Joshi, and G. Miller, Proceeding of the 18th International Conference on Thermoelectrics, Baltimore, MD, August 1999.

Moisture Ingress into Organic Laminates, M. Pecht, H. Ardebilib, A. Shukla, J. Hagge, and D. Jennings, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 1, pp. 104-110, March 1999.

An Interactive Multistage e-inequality Constraint Method for Multiple Objectives Decision Making, N. Palli, S. Azarm, P. McCluskey, and R. Sundararajan, Microelectronics International, 16/1, 6-7, 1999. Journal of Mechanical Design, Vol. 120, pp. 678-686, December 1998.

Integrated Thermal Analysis of an Automotive Electronic System, S. Murthy, Y. Joshi, V. Adams, and K. Ramakrishna, Proceedings of InterPACk'99, Vol. 1, pp. 979-986, June 1999.

Editorial: Life Cycle and Environmental Mismatches in Electronics for Critical Applications, P. McCluskey, Microelectronics International, Vol. 16, No. 1, pp. 6-7 1999.

New Findings in the Occurrence of False-Healing in Plastic Encapsulated Microcircuits using Scanning Acoustic Microscopy, T. Moore, Y, Ranade, and M. Pecht, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 2, pp. 266-269, June 1999.

An Investigation on the Mechanical Behavior of Elastomer Interconnects, J. Xie, M. Pecht, D. DeDonato, and A. Hassanzadeh, the 32nd International Symposium on Microelectronics, Chicago, IL, pp. 58-63, October 1999.

A Quantitative Assessment of Thermal Interface Materials, I. Bordelon, J. Xie, Y. Joshi, and C. Latham, Future Circuits International, Issue 5, pp. 75-78, 1999.

A Comparative Assessment of Gold Plating Thickness Required for Stationary Electrical Contacts, M. Sun, M. Pecht, and M. Natishan, Microelectionics Journal, Vol. 30, pp. 217-222, 1999.

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts, J. Xie, M. Pecht, A. Dasgupta, J. Swift, and S. Wallace, Transactions of the ASME the Journal of Electronic Packaging, Vol. 121, pp. 286-290, December 1999.

A Comparison of Routing Estimation Methods for Microelectronic Modules, P. Sandborn and P. Spletter, Microelectronics International, pp. 36-41, December 1999.

Delamination Study of Chip-to-Chip Bonding for a LIGA Based Safety and Arming System, G. Subramanian, M. Deeds, K. Cochran, R. Raghavan, and P. Sandborn, Proceedings SPIE Symposium on Micromachining and Microfabrication, pp. 112-119, Sept. 1999.

A Multi-scale Conjugte Thermal Modeling Approach for Air Cooled Electronic Enclosures, L. Tang and Y. Joshi, Proceedings of InterPACk'99, Vol. 1, pp. 295-304, June 1999.

A Model for Optimizing the Assembly and Disassembly of Electronic Systems, P. A. Sandborn and C. F. Murphy, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22. No. 2, pp. 105-108, April 1999.

Reliability and Performance of Advanced PWB Assemblies, M. Osterman, High Performance Printed Circuit Boards, Chapter 9, ISBN: 0-07-026713-8, 1999.