The majority of the publications listed below have links leading to an abstract. CALCE Consortia members with a CALCE Member web account can access the full text of articles through these links. Non-members wishing to access the full text, may do so by obtaining a monthly CALCE Articles web account. For more information, please go to the registration page. Other publications include Books, Symposiums, Newsletters and Open Forum.

Listed below are articles and book chapters which have been published by CALCE.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, IEEE Transactions on Components and Packaging Technologies, Accepted, May 2009

Examination of Nickel Underlayer as a Tin Whisker Mitigator , Lyudmyla Panashchenko and Michael Osterman, Electronic Component and Technology Conference, May 2009.

Validation of Reliability Capability Evaluation Model Using a Quantitative Assessment Process, S. Tiku and M. Pecht, International Journal for Quality and Reliability Management, Accepted, 2009.

A meso-scale damage evolution model for cyclic fatigue of viscoplastic materials, L. Ladani, and A. Dasgupta, International Journal of Fatigue, Accepted, 2008.

Tests on the Relationship between the Oxide Thickness of CMOS Chips and Their Resistance to Gamma Radiation, A. Tokuhiro, M. Bertino, H. Dharavat, J. Munson, J. Farmer, M. Pecht, and D. Das.

Reliability Integrated Engineering Using Physics-of-Failure, Weiqiang Wang, Diganta Das, Michael Osterman, and Michael Pecht, Book Chapter for: Encyclopedia of Statistics in Quality and Reliability, John Wiley & Sons, Ltd, Chichester, UK, in Press, 2008.

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance, D. Kwon, M. H. Azarian, M. Pecht, IEEE Trans. on Device and Materials Reliability, Vol. 9, No. 2, Jun. 2009, pp. 296-304.

Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies using RF Impedance Analysis, D. Kwon, M. H. Azarian, M. Pecht, IEEE Electronic Components and Technology Conference, San Diego, CA, pp. 663-667, May 2009.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, Equipment for Electronic Products Manufacturing (Chinese), pp. 1-5, February 2009.

Reliability, Maintainability, and Availability, Michael Pecht, in Handbook of Systems Engineering and Management. Ed. Andrew P. Sage and William B. Rouse. 2nd ed. Wiley-Interscience, New York, NY, pp. 361-95, 2009.

Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Packages in Lead-free and Mixed Assemblies, L. Nie, M. Osterman, and M. Pecht, SMTA Journal, Vol. 22, No. 2, pp. 13-20, 2009.

Precursor Monitoring Approach for Reliability Assessment of Cooling Fans, Hyunseok Oh, Tadahiro Shibutani, and Michael Pecht, Proceedings of Int'ernational Conference of Electronics Packaging, Kyoto, Japan, April 2009.

Improving the Reliability of a Water Dispenser Lever in a Refrigerator Subjected to Repetitive Stresses, Seong-woo Wooa, Dennis L. O’Neal, and Michael Pecht, Engineering Failure Analysis, Vol. 16, No. 5, pp. 1597-1606, July 2009.

Design of a Hinge Kit System in a Kimchi Refrigerator Receiving Repetitive Stresses, Seong-woo Wooa, Dennis L. O’Neal, and Michael Pecht, Engineering Failure Analysis, Vol. 16, No. 5, pp. 1655-1665, July 2009.

Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies, L. Nie, M. Osterman, and M. Pecht, IPC APEX 2009, Las Vegas, NV, March 31-April 2,2009.

Reliability Design and Case Study of a Refrigerator Compressor Subjected to Repetitive Loads, Seong-woo Wooa, Dennis L. O’Neal, and Michael Pecht, International Journal of Refrigeration, Vol. 32, pp. 478-486, 2009.

A Residual Estimation Based Approach for Isolating Faulty Parameters, S. Kumar, E. Dolev, M. Pompetzki, and M. Pecht, IEEE Aerospace Conference, Big Sky, MT, March 7-14, 2009.

Prognostics-Based Product Qualification, M. Pecht and J. Gu, IEEE Aerospace Conference, Big Sky, MT, March 7-14, 2009.

Standards for Tin Whisker Test Methods on Lead-Free Components, Tadahiro Shibutani, Michael Osterman, and Michael Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 32, No. 1, pp. 216-219, March 2009.

Assessing the Reliability of Elastomer Sockets in Temperature Environments, L. D. Lopez, V. Challa, and M. G. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 9, Issue 1, pp. 80-86, March 2009.

Reliability Design and Case Study of a Refrigerator Compressor Subjected to Repetitive Loads, S. Wooa, M. Pecht, and D. O'Neal, International Journal of Refrigeration, Vol. 32, No. 3, pp. 478-486, 2009.

Evaluation of Pure Tin Plated Copper Alloy Substrates for Tin Whiskers, S. Mathew, M. Osterman, M. Pecht, and F. Dunlevey, Circuit World, Vol. 35, No. 1, pp. 3-8, 2009.

A Highly Accurate Method for Assessing Reliability of Redundant Arrays of Inexpensive Disks (RAID), Jon G. Elerath and Michael Pecht, IEEE Transactions on Computers, vol. 58, no. 3, pp. 289-299, March 2009.

Anisotropic Conductive Adhesives for Flip-chip Interconnections, Weiqiang Wang, Y.C. Chan, and Michael Pecht, Journal of Adhesion Science & Technology, Volume 22, Numbers 8-9, pp. 871-892, 2008.

Thick Film Resistor Failures, A. Shrivastava, A. Amin, B. Sood, M. Azarian, M. Pecht, ISTFA 2008, 34th International Symposium for Testing and Failure Analysis, Portland, OR, Nov. 2-6, 2008.

Pressure-induced Tin Whisker Formation, T. Shibutani, Q. Yu, M. Shiratori, M. Pecht, Microelectronics Reliability, Vol. 48, pp. 1033-1039, 2008

Vibration Durability of Mixed Solder Interconnects, Gustavo Plaza, Dr. Michael Osterman, Prof. Michael Pecht, 41st International Symposium on Microelectronics, Providence, RI, Nov. 4-6, 2008.

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages, D. Yang, Y.C. Chan, B.Y. Wu, M. Pecht, Journal of Material Research, Vol. 23, No. 9, pp. 2333-2339, Sep 2008.

Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board laminates R. Sanapala, B. Sood, D. Das, M. Pecht, C.Y. Huang, and M.Y. Tsai, EMAP, 2008.

Health Assessment of Electronic Products using Mahalanobis Distance and Projection Pursuit Analysis, S. Kumar, V. Sotiris, M. Pecht, International Journal of Computer, Information, Systems Science, and Engineering, vol. 2, no. 4, pp. 242 - 250, Fall 2008.

Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections, Matkowski P., Urbanski K., Falat T., Felba J., Zaluk Z., Zwierta R., Dasgupta A., Pecht M., 2nd Electronics Systemintegration Technology Conference, London-Greenwich, 2008, p.1375-1379

Designing Engineering Systems for Sustainability, P. Sandborn and J. Myers, Handbook of Performability Engineering, ed. K. B. Misra, Springer, pp. 81-104, 2008.

Constructing a Product Design for Environment Process, D. P. Fitzgerald, J. W. Herrmann, P. A. Sandborn, L. C. Schmidt, and T. H. Gogoll, Handbook of Performability Engineering, ed. K.B. Misra, Springer, pp. 57-69, 2008.

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies, D. Farley, A. Dasgupta, and J.F.J. Caers, Journal of Adhesion Science and Technology, Vol. 22, pp. 1757-1780, 2008.

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects, J. Haase, D. Farley, P. Iyer, P. Baumgartner, A. Dasgupta, and J. F. J. Caers, Journal of Adhesion Science and Technology, vol. 22, 2008, pp. 1733-1756.

Anisotropic Conductive Adhesives for Flip-chip Interconnections, Weiqiang Wang, Y.C. Chan, and Michael Pecht, in Electrically Conductive Adhesives, R. Gomatam and K. L. Mittal, editors, VSP, Leiden, the Netherlands, 2008.

Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics, Ladani, L., Dasgupta, A., Cardoso, I., and Monlevade, E., IEEE Trans on Electronics Packaging and Manufacturing, Vol 31, No. 1, 2008.

Integrated Measurement Technique for Curing Process-dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating, Y. Wang, B. Han, D. W. Kim, A. Bar-Cohen, and P. Joseph, Experimental Mechanics, Vol. 48, pp. 107-117, 2008.

On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages, A. Goswami and B. Han, IEEE Transactions on Advanced Packaging, Vol. 31, No. 1, pp. 14-21, 2008.

Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem, C. Jang, S. Park, B. Han, and S. Yoon, Journal of Electronic Packaging, Vol. 130, 2008.

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading, S. Yoon, C. Jang and B. Han, Journal of Electronic Packaging, Vol. 130, 024502-1/6 (2008).

Ideal Laminate Theory for Water Transport Analysis of Inorganic/Organic Multilayer Barrier Films, C. Jang, Y. Cho and B. Han,Applied Physics Letters, Vol. 93, 13307 (2008).

A Random Trimming Approach for Obtaining High-Precision Embedded Resistors, P.A.M. Sandborn and P. Sandborn, Proceedings of the Army Science Conference, Orlando, FL, December 2008.

Analytical Model for Thermal Warpage History of Lamintated PBGAs, L. Munday, N. Keller, A. Dasgupta, B-T. Han, Proceedings of ASME IMECE, Paper Number IMECE2008-67345, Nov, 2008, Boston, MA.

Mechanical strength of copper-silicon interfaces in planar metallization power modules, K. Sinha, A. Dasgupta, R. Beaupre, A. Gowda, ASME International Mechanical Engineering Congress & Exposition, Paper Number IMECE2008-67367, Nov, 2008, Boston, MA.

Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, K. Holdermann, G. Cuddalorepatta, and A. Dasgupta, ASME IMECE, Paper Number IMECE2008-67671, Nov 2008, Boston, MA.

Modeling and simulation of shock and drop loading for complex portable electronic systems, F. Askari, M. Al- Bassyiouni, A. Dasgupta, ASME International Mechanical Engineering Congress and Exposition, Paper No. IMECE2008-67749, Nov 2008, Boston, MA.

The Analysis of Return on Investment for PHM Applied to Electronic Systems, Kiri Feldman, Peter Sandborn, and Taoufik Jazouli, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008

Failure Precursors for Insulated Gate Bipolar Transistors, Nishad Patil, Diganta Das, Kai Goebel, and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

IDDQ Trending as a Precursor to Semiconductor Failure , Guangfan Zhang, Diganta Das, Roger Xu, and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

Failure Mechanism Based Prognostics, Sony Mathew, Diganta Das, Roger Rosenberger, and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

Assessing the Operating Environment of IC Sockets in High-End Servers for Prognostics and Health Monitoring, Leoncio Lopez and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

Early Detection of Interconnect Degradation Using RF Impedance and SPRT, Daeil Kwon, Michael H Azarian, and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

Failure Prognostics of Multilayer Ceramic Capacitor in Temperature-Humidity- Bias Conditions, Jie Gu, Michael Azarian, and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

Maxima-SPRT Methodology for Health Monitoring of Contact Resistance in IC Sockets, Leoncio Lopez and Michael Pecht, Proceedings of the 1st International Conference on Prognostics and Health Management, Denver, CO, Oct 6-9, 2008.

Identification of Failure Precursor Parameters for Insulated Gate Bipolar Transistors (IGBTs), N. Patil, D. Das, K. Goebel and M. Pecht, Proceedings of the IEEE Prognostics and Health Management Conference, Denver, CO October 2008.

An Electronic Part Total Ownership Cost Model, P. Sandborn and V. Prabhakar, Proceedings DMSMS Conference, Palm Springs, CA, September 24, 2008.

Advanced Part Obsolescence Forecasting as an Enabler for Strategic Management of DMSMS Problems, P. Sandborn and O. Ahmad, Proceedings DMSMS Conference, Palm Springs, CA, September 24, 2008.

Anomaly Detection in Electronic Products, Abraham Tomy Michael, Sachin Kumar, Sony Mathew and Michael Pecht, 2nd Electronics System-Integration Technology Conference,, Greenwich, London, UK, September 1-4, 2008.

Constraint-Driven Refresh Planning of Systems Subject to Obsolescence, P. Sandborn and R. Nelson III, Proceedings DMSMS Conference, Palm Springs, CA, September 2008.

The Application of Product Platform Design to the Reuse of Electronic Components Subject to Long-Term Supply Chain Disruptions, P. Sandborn, V. Prabhakar, and B. Eriksson Proceedings of the ASME 2008 International Design Engineering Conferences & Computers and Information in Engineering Conference, New York, NY, Aug. 6, 2008.

Sensor System Selection for Prognostics and Health Monitoring, S. Cheng, M. Azarian, and M. Pecht, 2008 ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE 2008), Brooklyn, New York, USA, August 3-6, 2008.

Analyzing the Return on Investment Associated With Prognostics and Health Management of Electronic Products, Kiri Feldman and Peter Sandborn, 2008 ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE 2008), Brooklyn, New York, USA, August 3-6, 2008.

Failure Precursors for Insulated Gate Bipolar Transistors, N. Patil, D. Das, K. Goebel and M. Pecht, 9th International Seminar on Power Semiconductors, Prague, 27-29 August 2008.

Dominant Mechanism for Crack Propagation in Nonplanar Interfaces, K. Sinha, J. Varghese, A. Dasgupta, XXII International Congress of Theoretical and Applied Mechanics, Paper Number 12063, August, 2008, Adelaide, Australia.

Qualification for Product Development, Weiqiang Wang,; Azarian, Michael H.; Pecht, Michael, International Conference on Electronic Packaging Technology and the International Symposium on High Density Packaging (ICEPT-HDP), 28-31 July 2008.

A Hybrid Prognostics Methodology for Electronics Systems, S. Kumar, M. Torres, M.Pecht, and Y. C. Chan - Special Session on Computational Intelligence for Anomaly Detection, Diagnosis, and Prognosis, IEEE World Congress on Computational Intelligence (WCCI 2008), June 1-6, 2008, Hong Kong.

Effect of Solder Joint Degradation on RF Impedance, Kwon, D., Azarian, M., and Pecht, M., 12th IEEE Workshop on Signal Propagation on Interconnect, pp. 1-4 Avignon, France, 12-15 May 2008.

Detection of Solder Joint Degradation Using RF Impedance Analysis, Kwon, D., Azarian, M., and Pecht, M., IEEE Electronic Components and Technology Conference, pp. 606-610, Lake Buena Vista, FL, 27-30 May 2008.

Prognostics of Electronics under Vibration Using Acceleration Sensors, Jie Gu, Donald Barker, and Michael Pecht, Proceeding for 62nd Meeting of the Society for Machinery Failure Prevention Technology (MFPT), pp. 253-263, Virginia Beach, VA, May 2008.

Autonomous Prognostic Monitoring Device, S.Cheng, M. Torres, L. Thomas, and M. Pecht, Proceedings of the 62th Meeting of the Society for Machinery Failure Prevention Technology, pp.505-516 , Virginia Beach, VA, May 2008.

Simultaneous Measurements of Effective Chemical Shrinkage and Modulus Evolution During Polymerization, Y. Wang, B. Han, A. Bar-Cohen and S. Cho, Proceedings of the 2008 58th Electronic Components and Technology Conference, Orlando, FL, May 27-30, 2008

Effect of Primary Creep Behavior on Fatigue Damage Accumulation Rates in Accelerated Thermal Cycling of Sn3.0Ag0.5Cu Pb-Free Interconnects, G. Cuddalorepatta, and A. Dasgupta, Proceedings, EuroSiME Conference, April 2008, Freiburg, Germany.

Trapped on Technology’s Trailing Edge, P. Sandborn, IEEE Spectrum, Vol. 45, No. 4, pp. 42-45, 54, 56-58, April 2008.

Minimizing Life Cycle Cost by Managing Product Dependability via Validation Plan and Warranty Return Cost, A. Kleyner and P. Sandborn, International Journal of Production Economics, Vol. 112, No. 2, pp. 796-807, April 2008.

Mahalanobis Distance and Projection Pursuit Analysis for Health Assessment of Electronic Systems, S. Kumar, V. Sotiris, and M. Pecht, IEEE Aerospace Conferece, Big Sky, Montana, March 2008.

Damage Initiation and Propagation in Voided Joints, Ladani, L. and Dasgupta, A., ASME Journal of Electronic Packaging, Vol 130, Issue 1, 011008, March 2008.

A Random Trimming Approach for Obtaining High-Precision Embedded Resistors, P. Sandborn and P.A. Sandborn, IEEE Trans. on Advanced Packaging, Vol. 31, No. 1, pp. 76-81, February 2008.

Data Analysis Approach for System Reliability, Diagnostics and Prognostics, S. Kumar and M. Pecht, Pan Pacific Microelectronics Symposium, 22 - 24 Jan, 2008, Hawaii.

Prognostics and Health Management Using Physics of Failure, J. Gu and M. Pecht, 54th annual Reliability and Maintainability Symposium (RAMS), Las Vegas, Nevada, Jan. 2008

Commercial Impact of Silicon Carbide - Opportunities and Challenges in Realizing the Full Potential of SiC Power Devices, R. Singh and M. Pecht, IEEE Industrial Electronics Magazine, pp. 19-31, Sept. 2008.

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, APEX 2008, Las Vegas, Nevada, March 30th – April 3rd, 2008.

Failure Analysis and Redesign of A Helix Upper Dispenser, S. Woo and M. Pecht, Engineering Failure Analysis, Vol 15, Issue 6,  Pg 642-653, Sep 2008.

Microstructure and Intermetallics Formation in SnAgCu BGA Components attached with SnPb Solder under Isothermal Aging, A. Choubey, M. Osterman, and M. Pecht. IEEE Transactions on Device and Materials Reliability, Vol 8, Issue 1, pp 160-167, 2008.

Failure Site Isolation on Passive RFID Tags, B. Sood, D. Das, M. Azarian, M. Pecht, B. Bolton, and T. Lin. , Proceedings of the 15th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits July 7-11, Singapore, pp. 337-341, 2008.

Intermetallics Characterization of Lead-free Solder Joints under Isothermal Aging, A. Choubey, H. Yu, M. Osterman, M. Pecht, F. Yun, L., Youghong and X. Ming., Journal of Electronic Materials, Vol. 37, No. 8, pp. 1130-1138, August 2008.

No-fault-found and Intermittent Failures in Electronic Products, Qi. Haiyu., S. Ganesan and M. Pecht, Microelectronics Reliability, Vol. 48, Issue 5, pp. 663-674, May 2008.

Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 8, Issue 1, pp 182-192, March 2008

Effect of Solder Joint Degradation on RF Impedance, D. Kwon, M. Azarian, and M. Pecht, 12th IEEE Workshop on Signal Propagation on Interconnect, Avignon, France, pp. 1-4, 2008.

Detection of Solder Joint Degradation Using RF Impedance Analysis, D. Kwon, M. Azarian, and M. Pecht, IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL, pp. 606-610, 2008.

China's Efforts in Prognostics and Health Management, Shunong Zhang, Rui Kang, Xiaofei He, and Michael G. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 2, June 2008.

Enhanced Reliability Modeling of RAID Storage Systems, Jon G. Elerath and Michael Pecht, Dependable Systems and Networks, pp.175-184 , 2007.

Technology Assessment of Sensor Systems for Prognostics and Health Monitoring, B. Tuchband, S. Cheng, and M. Pecht, IMAPS on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications (MASH), May, 2007.

Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products, H. Qi, N. Vichare, M. Azarian, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, 2007.

Design of Experiments for Board Level Solder Joint Reliability of PBGA Package under Various Manufacturing and Multiple Environmental Loading Conditions, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, 2007.

High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints, H, Qi, Q, Zhan, E. Tinsley, M. Osterman, and M Pecht, IEEE Transactions on COmponents and Packaging Technologies, 2007.

Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design, N. Vichare, P. Rodger, V. Eveloy, and M. Pecht, International Journal of Quality Technology and Quantitative Management, 2007.

Using Embedded Resistor Emulation and Trimming to Demonstrate Measurement Methods and Associated Engineering Model Development, P. Sandborn and P. Sandborn, International Journal of Engineering Education, 2007.

Semiconductor Manufacturers' Efforts to Improve Trust in the Electronic Part Supply Chain, Chatterjee, K. and Das, D., Components and Packaging Technologies, IEEE Transactions on , vol.30, no.3, pp.547-549, Sept. 2007

Carbon Fiber-Based Grid Array Interconnects, Y. Deng, M. Pecht, J. Swift, and S. Wallace, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, pp. 716-723, Dec, 2007.

Strain Range Fatigue Life Assessment of Lead-free Solder Interconnects Subject to Temperature Cycle Loading, M. Osterman and M. Pecht, Soldering & surface Mount Technology, Vol. 19, No. 2, pp. 12-17, 2007.

Multivariate State Estimation Technique for Remaining Useful Life Prediction of Electronic Products, S. Cheng and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 26-32, Arlington, VA, Nov, 2007.

Health Monitoring of Electronic Products Using Symbolic Time Series Analysis, S. Kumar and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 73-80, Arlington, VA, Nov, 2007.

Support Vector Prognostics Analysis of Electronic Products and Systems, V. Sotiris and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 120-127, Arlington, VA, Nov, 2007.

Uncertainty Assessment of Prognostics of Electronics Subject to Random Vibration, J. Gu, D. Barker, and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp.50-57, Nov. 2007.

Multivariate State Estimation Technique for Remaining Useful Life Prediction of Electronic Products, S. Cheng and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 26-32, Arlington, VA, Nov, 2007.

Health Monitoring of Electronic Products Using Symbolic Time Series Analysis, S. Kumar and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 73-80, Arlington, VA, Nov, 2007.

Support Vector Prognostics Analysis of Electronic Products and Systems, V. Sotiris and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp. 120-127, Arlington, VA, Nov, 2007.

Assessment of China's and India's Science and Technology Literature - Introduction, Background, and Approach Technological Forecasting and Social Change, R. Kostoff, S. Bhattacharya, and M. Pecht, Technological Forecasting and Social Change, Vol. 74, Issue 9, pp. 1519-1538, November 2007.

Chinese science and technology - Structure and infrastructure Technological Forecasting and Social Change, R. Kostoff, M. Briggs, R. Rushenberg, C. Bowles, A. Icenhour, K. Nikodym, R. Barth, and M.l Pecht, Technological Forecasting and Social Change, Vol. 74, Issue 9, pp. 1539-1573, November 2007.

Comparisons of the structure and infrastructure of Chinese and Indian Science and Technology Technological Forecasting and Social Change, R. Kostoff, M. Briggs, R. Rushenberg, C. Bowles, M. Pecht, D. Johnson, S. Bhattacharya, A. Icenhour, K. Nikodym, R. Barth, and S. Dodbele, Technological Forecasting and Social Change, Vol. 74, Issue 9, pp. 1609-1630, November 2007.

Prognostics Implementation of Electronics under Vibration Loading, J. Gu, D. Barker and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 12, pp. 1849-1856, Dec. 2007.

Creep and Stress Relaxation of Hypo-Eutectic Sn3.0Ag0.5Cu Pb-free Alloy: Testing and Modeling, G. Cuddalorepatta and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.

Vibration Durability Assessment of Sn3.0Ag0.5Cu & Sn37Pb SOlders under Harmonic Excitation, Y. Zhou and A. Dasgupta, 2007 ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, November 11-17, 2007.

Uncertainty Assessment of Prognostics of Electronics Subject to Random Vibration, J. Gu, D. Barker, and M. Pecht, AAAI Fall Symposium on Artificial Intelligence for Prognostics, pp.50-57, 2007.

Embedded Remaining Life Prognostics and Diagnostics of Electronics, V. Rouet, A. Delye, N. Vichare, M. Pecht, and B. Foucher, MicroNanoReliability Congress, Berlin, Germany, September 2-5, 2007

Isothermal Aging Effects on Flex Cracking of Multilayer Ceramic Capacitors with Standard and Flexible Terminations, M. Keimasi, M. Azarian, and M. Pecht, Microelectronics Reliability, Vol. 47, pp. 2215-2225, 2007.

Prognostics of Ceramic Capacitor Temperature-Humidity-Bias Reliability Using Mahalanobis Distance Analysis, L. Nie, M. Azarian, M. Keimasi, and M. Pecht, Circuit World, Vol. 33, No.3, pp. 21-28, 2007.

Tin Whiskers: How to Mitigate and Manage the Risks, S. Mathew, M. Osterman, T. Shibutani, Q. Yu and M. Pecht, Proceedings of the International Symposium on High Density Packaging and Microsystem Integration, pp.1-8, Shanghai, China, June 26-28, 2007.

Technology Assessment of Sensor Systems for Prognostics and Health Monitoring, B. Tuchband, S. Cheng, and M. Pecht, IMAPS on Military, Aerospace, Space and Homeland Security: Packaging Issues and Applications (MASH), May, 2007.

New Methods to Predict Reliability of Electronics, J. Gu and M. Pecht, Proceedings of the Seventh International Conference on Reliability, Maintainability and Safety, pp 440-451, 2007.

Prognostics of Ceramic Capacitor Temperature-Humidity-Bias Reliability Using Mahalanobis Distance Analysis, L. Nie, M. Azarian, M. Keimasi, and M. Pecht, Circuit World, Vol. 33, No.3, pp. 21-28, 2007.

The Use of Prognostics in Military Electronic Systems, B. Tuchband and M. Pecht, Proceedings of the 32nd GOMACTech Conference, pp. 157-160, Lake Buena Vista, FL, March 19-22, 2007.

Energetic Material/Systems Prognostics, D. Han, M. Pecht, D. Anand, and R. Kavetsky, 53rd Annual Reliability & Maintainability Symposium (RAMS), Florida, 2007.

Prognostics Implementation Methods for Electronics, J. Gu, N. Vichare, T. Tracy, and M. Pecht, 53rd Annual Reliability & Maintainability Symposium (RAMS), Florida, 2007.

An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics, G. Zhang, C. Kwan, R. Xu, N. Vichare, and M. Pecht, IEEE Aerospce Conference, Big Sky, MT, March 2007.

Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design, N. Vichare, P. Rodger, V. Eveloy, and M. Pecht, International Journal of Quality Technology and Quantitative Management, 2007.

The Effect of Electrostatic Discharge on Electrical Overstress Susceptibility in a Gallium Arsenide MESFET-Based Device, V. Eveloy, Y. Hwang, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol, 7, No. 1, pp. 200-208, March 2007.

Regulations and Market Trends in Lead-free and Halogen-free Electronics, L. Nie and M. Pecht, Circuit World, Vol. 33, NO. 2, pp. 4-9, 2007.

Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications, H. Qi, M. Osterman, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, pp. 242-247, June 2007.

Reliability Assessment on Insertion Mount Assembly under Vibration Conditions, H. Qi, G. Plaza, S. Ganesan, M. Osterman, and M. Pecht, 2007 Electronic Components and Technology Conference, Reno, Nevada, pp. 407-414, May 29-June 1, 2007

Assessment of Thermomechanical Damage of Electronic Parts Due to Solder Dipping as a Postmanufacturing Process, S. Sengupta, D. Das, S. Ganesan, W. Rollins, D. Pinsky, T. Lin and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 30, NO. 2, pp. 128-137, April, 2007.

Using a Reliability Capability Maturity Model to Benchmark Electronics Companies, S. Tiku and M. Pecht, International Journal of Quality & Reliability Management, Vol, 24, No. 5, pp. 547-563, 2007.

Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads, S. Mathew, D. Das, M. Osterman, M. Pecht, R. Ferebee, and J. Clayton, Journal of the IEST, Vol. 50, No. 1, pp 86-97, April 2007.

The Use of Prognostics in Military Electronic Systems, B. Tuchband and M. Pecht, Proceedings of the 32nd GOMACTech Conference, pp. 157-160, Lake Buena Vista, FL, March 19-22, 2007.

Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket, S. Yang, J. Wu, D. Tsai, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 30, NO. 1, pp. 81-85, March 2007.

Assessment of Risk Resulting from Unattached Tin Whisker Bridging, T. Fang, S. Mathew, M. Osterman, and M. Pecht, Circuit World, Vol. 33, No. 1, pp. 5-8, 2007.

Durability of Repaired and Aged Lead-free Electronic Assemblies, A. Choubey, M. Osterman, M. Pecht, and D. Hillman, IPC Printed Circuits Expo, APEX, and Designers Summit, Los Angeles, CA. Feb 18-22, 2007

An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics, G. Zhang, C. Kwan, R. Xu, N. Vichare, and M. Pecht, IEEE Aerospce Conference, Big Sky, MT, March 2007.

Prognostics Implementation Methods for Electronics, J. Gu, N. Vichare, T. Tracy, and Michael Pecht, 53rd Annual Reliability & Maintainability Symposium (RAMS), Florida, 2007.

Solving the Counterfeit Electronics Problem, K. Chatterjee, D. Das, and M. Pecht, Proceedings of Pan Pacific Microelectronics Symposium (SMTA), pp. 294-300, Hawaii, Jan 30-Feb 1, 2007.

The Impact of Electrical Current, Mechanical Bending, and Thermal Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 47, Issue 1, pp. 88-92, January, 2007.

Test Methodology for Durability Estimation of Surface Mount Interconnects under Drop Testing Conditions, J. Varghese and A. Dasgupta, Microelectronics Reliability, Vol. 47, Issue 1, pp. 93-107, January, 2007.

Prognostic Assessment of Aluminum Support Structure on a Printed Circuit Board, S. Mathew, D. Das, M. Osterman, M. Pecht, and R. Ferebee ASME Journal of Electronic Packaging, Vol. 128, Issue 4, pp. 339-345, December 2006.

Vibration Durability Comparison of Sn37Pb vs SnAgCu SOlders, Y. Zhou, E. Scanff, and A. Dasgupta, 2006 ASME International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 5-10, 2006.

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board, S. Mathew, D. Das, M. Osterman, M. Pecht, and R. Ferebee, ASME Journal of Electronic Packaging, Vol. 128, Issue 4, pp. 339-345, December 2006.

Management of Information and Data Used for Failure Assessment of Printed Circuit Board Assembly, M. Ramot, D. Das, and M. Pecht, Proceedings of the IMAPS 2006 Conference, 2006.

A Methodology for Assessing the Remaining Life of Electronic Products, S. Mathew, P. Rodgers, V. Eveloy, N. Vichare, and M. Pecht, International Journal of Performability Engineering, Vol. 2, No. 4, pp. 383-395, October, 2006.

The Effect of Annealing on Tin Whisker Growth, Y. Fukuda, M. Osterman, and M. Pecht, IEEE Transactions on Electronic Packaging Manufacturing, Vol. 29, No. 4, pp. 252-258, October 2006.

Enabling Electronic Prognostics Using Thermal Data, N. Vichare and M. Pecht, Proceedings of the 12th International Workshop on Thermal Investigation of ICs and Systems, Nice, Côte d'Azur, France, 27-29 September 2006.

Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-Plated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests, P. Zhao, M. Pecht, S. Kang, and S. Park, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 4, pp. 818-826, December, 2006.

Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy, Y. Deng, M. Pecht, and K. Rogers, IEEE Transactions on Companents and Packaging Technologies, Vol. 29, No. 4, pp. 804-808, December, 2006.

Uprating of Electronic Parts to Address Obsolescence, M. Pecht and D. Humphrey, Microelectronics International, Vol. 23, No. 2, pp 32-36, 2006.

Impact of Environmental Regulations on Green Electronics Manufacture, R. Ciocci and M. Pecht, Microelectronics International, Vol. 23, No. 2, pp 45-50, 2006.

The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages, T. Lin, M. Pecht, D. Das, and K. Teo, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3, pp. 522- 527, July 2006.

Establishing a Relationship Between Warranty and Reliability, M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 184- 190, July 2006.

Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux, S. Zhan, M. Azarian, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 29, No. 3, pp. 217-233, July 2006.

Forecasting the Cost of Unreliability for Products with Two-Dimensional Warranties, A. Kleyner and P. Sandborn, Proceedings of the European Safety and Reliability Conference (ESREL), Estoril, Portugal, Sept 18-22, 2006.

A Methodology for Assessing the Remaining Life of Electronic Products, S. Mathew, P. Rodgers, V. Eveloy, N. Vichare, and M. Pecht, International Journal of Performability Engineering, Vol. 2, No. 4, pp. 383-395, October, 2006.

Low Temperature Electrical Measurements of Silicon Bipolar Monolithic Microwave Integrated Circuit (MMIC) Amplifiers, M. Keimasi, S. Ganesan, and M. Pecht, Microelectronics Reliability, Vol. 46, pp. 326-334, 2006.

Use of High Temperature Operating Life Data to Mitigate Risks in Long-Duration Space Applications that Deploy Commercial-Grade Plastic Encapsulated Semiconductor Devices, S. Ganesan, M. Pecht, and S. Ling, Microelectronics Reliability, Vol. 46, pp. 360-366, 2006.

The Other Half of the DMSMS Problem - Software Obsolescence, P. Sandborn and G. Plunkett, DMSMS Knowledge Sharing Portal Newsletter, Vol. 4, Issue 4, pp. 3 and 11, June 2006.

Obsolescence Driven Design Refresh Planning for Sustainment-Dominated Systems, P. Singh and P. Sandborn, The Engineering Economist, Vol. 51, No. 2, pp. 115-139, April-June 2006.

Using Reverse Engineering as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling, P. Sandborn, J. Myers, T. Barron, and M. McCarthy, Proceedings of the International Electronics Packaging Education Conference (at the Electronic Components and Technology Conference), May 30, 2006.

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly, Z. Shi and P. Sandborn, Journal of Electronic Testing Theory and Applications (JETTA), Vol. 22, pp. 49-60, 2006.

Contact Resistance and Fretting Corrosion of Lead-free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, pp. 402-410, June, 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, ITHERM Conference, San Deigo, CA, May 30, 2006.

Investigation of the Size and Spatial Distribution of Fillers in Mold Compounds after Device Packaging, Y. Huang, D. Bigio, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 2, pp. 364-370, June, 2006.

Statistical Analysis of Tin Whisker Growth, T. Fang, M. Osterman, and M. Pecht, Microelectronics Reliability, Vol. 46, Issues 5-6, pp. 846-849, May-June, 2006.

A Strain Range Based Model for Life Assessment of Pb-free SAC Solder Interconnects , M. Osterman, A. Dasgupta, B. Han, 56th Electronic Component and Technology Conference, pp. 884 - 890, May 30-June 2, 2006

Learning from the Migration to Lead-free Solder, R. Ciocci and M. Pecht, Soldering & Surface Mount Technology, Vol. 18, No. 3, 2006.

Methods for Binning and Density Estimation of Load Parameters for Prognostics and Health Management, Vichare N., Rodgers P., and Pecht, M., International Journal of Performability Engineering, Vol. 2, No. 2, pp. 149-161, April 2006.

Methods for Binning and Density Estimation of Load Parameters for Prognostics and Health Management, Vichare N., Rodgers P., and Pecht, M., International Journal of Performability Engineering, Vol. 2, No. 2, April 2006.

Prognostics and Health Management of Electronics, N. Vichare and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 1, March 2006.

Prognostics and Health Management of Electronics , N. Vichare and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 1, pp. 222-229, March 2006.

A Variant of Conductive Filament Formation Failures in PWBs with 3 and 4 mil Spacings, K. Rogers and M. Pecht, Circuit World, Vol. 32, No. 3, pp. 11-18, 2006.

Assessing Tin Whisker Risk in Electronic Products, T. Fang, S. Mathew, M. Osterman, and M. Pecht, SMT Magazine, PennWell, Vol. 20, No.5, pp 24-25, May 2006.

Tin Whisker Risk Assessment, T. Fang, M. Osterman, S. Mathew, and M. Pecht, Circuit World, Vol. 32, No. 3, pp 25-29, May. 2006.

Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells - Experimental Approach, G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman, Capacitor and Resistor Technology Symposium, Orlando, FL, pp. 15-25, April 3-6, 2006.

Lead-Free Assemblies in High Temperature Applications, A. Choubey, J. Wu, S. Ganesan, and M. Pecht, Proceeding of IMAPS International Conference on High Temperature Electronics (HITECH 2006), pp. 384-389, May 2006.

Effect of Aging on Pull Strength of SnPb, SnAgCu and Mixed Solder Joints in Peripheral Surface Mount Components, A. Choubey, D. Menschow, S. Ganesan, and M. Pecht, Journal of SMTA, Vol. 19, Issue 2, pp. 33-37, April 2006.

Moisture Induced Degradation of Multilayer Ceramic Capacitors, D. Donahoe, M. echt, I. Lloyd, and S. Ganesan, Microelectronics Reliability, Vol. 46, pp. 400-408, 2006.

Comparison of Flex Cracking of Multilayer Ceramic Capacitors Assembled with Lead-Free and Eutectic Tin-Lead Solders, M. Azarian, M. Keimasi, and M. Pecht, Capacitor and Resistor Technology Symposium, Orlando FL, pp. 15-25, April 3-6, 2006.

Non-Destructive Techniques for Detection of Defects in Multilayer Ceramic Capacitors, M. Azarian, M. Keimasi, and M. Pecht, Components for Military and Space Electronics Conference, pp. 125-130, Los Angeles, CA, February 6-9, 2006.

Implementation of Six Sigma Quality System in Celestica with Practical Examples, L. Ladani, D. Das, J. Cartwright, R. Yenkner, and J. Razmi, Int. J. Six Sigma and Competitive Advantage, Vol. 2, No. 1, pp. 69-88, 2006.

Open Trace Defects in FR4 Printed Circuit Boards, S. Ganesan and M. Pecht, Circuit World, Vol. 32, No. 1, pp. 3-7, 2006.

Electronic Device Encapsulation Using Red Phosphorus Flame Retardants, M. Pecht and Y. Deng, Microelectronics Reliability, Vol. 46, Issue 1, pp. 53-62, January 2006.

Failures in Semiconductor Device Encapsulated with Red Phosphorus Flame Retardant, Y. Deng and M. Pecht, 11th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition, pp. 399-404, January 17-19, 2006. 

Solder Joint Defects of PBGs after Lead-free Assembly Ganesan S., Kim G., Wu J., Pecht M., Lee R., Lo J., Fu Y., Li Y., Xu M., Felba J., 15th European Microelectronics and Packaging Conference & Exhibition, Brugge 2005 p. 63-68.

A novel test data-acquisition system for vibration testing of printed circuit board assemblies Urbanski K., Falat T., Felba J., Ganesan S., Pecht M., 15th European Microelectronics and Packaging Conference & Exhibition, Brugge 2005. p. 178-183

Vibration test utilization in the study of reliability of connections in microelectronics, Matkowski P., Haiyu Q.,2005 International Students and Young Scientists Workshop Photonics and Microelectronics, Dresden 2005, p.61-64

Application of a moving-window neural network to the modeling of a fullscale anaerobic filter process, M.Lee, J.Joung,D. Lee, J. Park, S. Woo, Ind. Eng. Chem. Res., 44, 3973. 2005.

Process Monitoring Approach Using Fast Moving Window PCA, X. Wang, U. Kruger, G.W Irwin, Industrial & Engineering Chemistry Research 44(15), 5691-5702, 2005.

Vibration Tests Utilization in the Study of Reliability of Connections in Microelectronics, P. Matkowski and H. Qi, 2005 International Students and Young Scientists Workshop "Photonics and Microsystems", pp. 61-64, July 7-8, 2005

Using Cut-Out Features for Efficient Printed Circuit Board Testing and Failure Analysis, J. Wu and S. Ganesan, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 1, pp. 166-168, March 2005.

Guidelines for Drop Testing of Portable Electronic Products Using a Bottom-Up Approach, J. Varghese, J. Okura, K. Ojala, and A. Dasgupta, Proceedings of the JEDEX Semiconductor Conference, 2005.

Drop Testing of Printed Wiring Assemblies, J. Varghese and A. Dasgupta, Proceedings of the IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR), 2005.

Characterization of Non-Conductive Adhesives, D. Farley, A. Dasgupta, and J. Caers, Proceedings of ASME InterPACK, July 17-22, 2005.

Characterizing Non-Conductive Adhesives using Finite Element Analysis: Residual Stress Determination,D. Farley, A. Dasgupta, and J. Caers, Proceedings of SEM Annual Conference and Exposition, June 7-9, 2005.

Cyclic Mechanical Durability Of Sn3.0Ag0.5Cu Pb-Free Solder Alloy, G. Cuddalorepatta and A. Dasgupta, ASME International Mechanical Engineering Congress and RD&D Expo, Orlando, FL, November 5-11, 2005.

Effects of Re-Finishing of Terminations by Solder-Dipping on Plastic Quad Flatpack Electronic Parts, S. Sengupta, D. Das, S. Ganesan, and M. Pecht, EPTC Annual Conference, Singapore, December 2005.

Risk Factors in Oil and Gas Well Electronics Compared to Other Electronic Industries, S. Tiku, A. Veneruso, R. Etchells, and M. Pecht, Oil & Gas Science and Technology - Rev. IFP, Vol. 60 (2005), No. 4, pp. 721-730, Institut Français du Pètrole, 2005.

The Story Behind the Red Phosphorus Mold Compound Device Failures, Y. Deng and M. Pecht, 2005 International Symposium on Electronics Materials and Packaging (EMAP2005), pp. 1-5, Tokyo, Japan, December 11-14, 2005.

Lead-free Assembly Defects in Plastic Ball Grid Array Packages, S. Ganesan, G. Kim, J. Wu, M. Pecht, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 219-223, Wroclaw, Poland, October 23-26, 2005.

Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability, H. Qi, S. Ganesan, J. Wu, M. Pecht, P. Matkowski, and J. Felba, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp. 140-144, Wroclaw, Poland, October 23-26, 2005.

Identification and Utilization of Failure Mechanisms to Enhance FMEA and FMECA, S. Ganesan, V. Eveloy, D. Das, and M. Pecht, Proceedings of the IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR), Austin, Texas, October 2-5, 2005.

Characterization of Non-Conductive Adhesives, D. Farley, A. Dasgupta, J. Caers, and W. Hua, Proceedings of 6th International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and micro-systems, April 17-20, 2005.

Environment and Usage Monitoring of Electronic Products for Health Assessment and Product Design, N. Vichare, P. Rodgers, V. Eveloy, and M. Pecht, IEEE Workshop on Accelerated Stress Testing and Reliability (ASTR), Austin, TX, USA, October 2-5, 2005.

Beyond Tools: A Design for Environment Process, D.P. Fitzgerald, J.W. Herrmann, P.A. Sandborn, L.C. Schmidt, and T.H. Gogoll, International Journal of Performability Engineering, Vol. 1, No. 2, pp. 105-120, October 2005.

A Tin Whisker Risk Assessment Algorithm, T. Fang, M. Osterman, and M. Pecht, 38th International Symposium on Microelectronics, Reliability I, Issues in Packaging, pp. 61-65, Philadelphia, PA, September 25-29, 2005.

Non-invasive Electrocardiogram and Blood Pressure Monitors for Cardiovascular Disease, Y. Liu, V. Eveloy, and M. Pecht, 38th International Symposium on Microelectronics, Sensor and MEMS Packaging, pp. 66-74, Philadelphia, PA, September 25-29, 2005.

Carbon Fiber Electrical Interconnects, Y. Deng, J. Wu, and M. Pecht, 38th International Symposium on Microelectronics, Emerging Technologies, pp. 169-176, Philadelphia, PA, September 25-29, 2005.

Reliability Issues of No-Clean Flux Technology with Lead-Free Solder Alloy for High Density Printed Circuit Boards, S. Zhan, M. Azarian, and M. Pecht, 38th International Symposium on Microelectronics, pp. 367-375, Philadelphia, PA, September 25-29, 2005.

Electrochemical Migration of Land Grid Array Sockets under Highly Accelerated Stress Conditions, S. Yang, J. Wu, and M. Pecht, The Fifty-First IEEE Holm Conference on Electrical Contacts, pp. 238-244, September 2005.

Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted PQFP Components in Free Convection, V. Eveloy, P. Rodgers and M. Hashmi, Transactions of the ASME, Journal of Electronic Packaging, Vol. 127, No. 3, pp. 245-254, September 2005.

Prediction of Electronic Component-Board Transient Conjugate Heat Transfer, V. Eveloy and P. Rodgers, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, pp. 817-829, December 2005.

Distribution of a Minor Solid Constituent in a Transfer Molded e-Pad Leadframe Package, Y. Huang, S. Zhan, D. Bigio, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 3, pp. 549-554, September 2005.

A Warranty Forecasting Model Based on Piecewise Statistical Distributions and Stochastic Simulation, A. Kleyner and P. Sandborn, Reliability Engineering and System Safety, Vol. 88, No. 3, pp. 207-214, June 2005.

Environmental Qualification Testing Assessment and Failure Analysis of Embedded Resistors, L.J. Salzano II, C. Wilkinson, and P. Sandborn, IEEE Transactions on Advanced Packaging, Vol. 28, No. 3, pp. 503-520, 2005.

Tin Whiskers: What's the Risk?, Y. Fukuda and M. Osterman, Lead Free Electronics, PennWell,June 2005.

Mixed Flowing Gas Studies of Creep Corrosion on Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-Plated Leadframes, P. Zhao, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 5, No. 2, pp. 268-276, June 2005.

Key Concerns in the Assembly of Lead-Free Electronics, V. Eveloy, Y. Fukuda, S. Ganesan, J. Wu, and M. Pecht, Proceedings IMAPS Taiwan 2005 International Technical Symposium, pp. 167-183, June 2005.

New Aging Mechanism in Multilayer Ceramic Capacitators, D. Dohahoe and M. Pecht, Advanced Packaging, June 2005.

The Evaluation of Copper Migration During the Die Attach Curing and Second Wire Bonding Process, T. Lin, M. Pecht, D. Das, J. Pan, and W. Zhu, IEEE Transactions on Components and Packaging Technologies, Vol. 28, Issue. 2, pp. 337-344, June 2005.

Effect of Stress Relaxation on Board Level Reliability of Sn Based Pb-Free Solders, S. Yoon, Z. Chen, M. Osterman, B. Han, and A. Dasgupta, 55th ECTC, pp. 1210-1214, June 2005.

An Assessment of Embedded Resistor Trimming and Rework, P. Sandborn, IEEE Transactions on Electronics Packaging Manufacturing., Vol. 28, No. 2, pp. 176- 186, April 2005.

A Data Mining Based Approach to Electronic Part Obsolescence Forecasting, P. Sandborn, F. Mauro, and R. Knox, Proceedings DMSMS Conference, Nashville, TN, April 2005.

Heart Sound Measurement and Analysis in Cardiovascular Disease Assessment, V. Eveloy, Y. Liu, and M. Pecht, Proceedings of the SMTA Medical Electronics Symposium, Minneapolis, MN, April 25-27, 2005.

Chinese Intellectual Property and Contractual Challenges, Y. Liu, P. Campbell, D. Das, and M. Pecht, International Conference on Electronics Packaging (ICEP), pp. 241-246, Japan, April 13-15, 2005.

Extending the Limits of Air-Cooling in Microelectronic Equipment, P. Rodgers, V. Eveloy, and M. Pecht, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 695-702, EuroSimE, April 2005.

Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance, J. Subramanian, P. Rodgers, J. Newson, T. Rude, Z. He, E. Besnoin, T.P. Weihs, V. Eveloy, and M. Pecht, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 681-686, EuroSimE, April 2005.

Development of Predictive Modeling Scheme for Flip-Chip on Fine Pitch Flex Substrate, C. Jang, S. Han, Y. Kim, and H. Kim, S. Yoon, S. Cho, C. Han, and B. Han, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 566-574, EuroSimE, April 2005.

Hybrid Experimental and Computational Approach for Rate Dependent Mechanical Properties Using Indentation Techniques, J. Varghese, G. Radig, D. Herkommer, and A. Dasgupta 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 510-514, EuroSimE, April 2005.

Characterization of Non-Conductive Adhesives, D. Farley, A. Dasgupta, J. Caers, and W. Hua, 6th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 471-477, EuroSimE, April 2005.

Assessment of Long-term Reliability in Lead-free Assemblies, S. Ganesan, J. Wu, and M. Pecht, International Conference on Asian Green Electronics, Session 3, pp. 140-155, Shanghai, China, March 15-18, 2005.

An Investigation into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature, P. Rodgers, V. Eveloy, and M. Hashmi, Transactions of the ASME, Journal of Electronic Packaging, Vol. 127, Issue 1, pp. 67-75, March 2005.

Limits of Air-Cooling: Status and Challenges, P. Rodgers, V. Eveloy, and M. Pecht, IEEE Twenty First Annual - Semiconductor Thermal Measurement and Management Symposium, pp. 116-124, March 15-17, 2005.

A Decision Support Model for Determining the Applicability of Prognostic Health Management (PHM) Approaches to Electronic Systems, P. Sandborn, Proc. Reliability and Maintainability Symposium, pp. 422-427, January 24-27, 2005.

A Decision Support Model for Determining the Applicability of Prognostic Health Management (PHM) Approaches to Electronic Systems, P. Sandborn, Proceedings Reliability and Maintainability Symposium, pp. 422-427, January 24-27, 2005.

Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronic Systems, P. Singh and P. Sandborn, Proceedings Reliability and Maintainability Symposium, pp. 349-354, January 24-27, 2005.

In Situ Temperature Measurement of a Notebook Computer - A Case Study in Health and Usage Monitoring of Electronics, N. Vichare, P. Rodgers, V. Eveloy, and M. Pecht IEEE Transactions on Device and Materials Reliability, Vol. 4., No. 4, pp. 658-663, December 2004.

Prognostics and Health Management for Improved Dispatchability of Integrated Modular Avionics Equipped Aircraft, C. Wilkinson,23rd Digital Avionics Systems Conference (DASC), Salt Lake City, UT, October 2004.

Application of Health Monitoring to Product Take-back Decisions, N. Vichare, P. Rodgers, M. Azarian, and M. Pecht, Proceedings of the Joint International Congress and Exhibition - Electronics Goes Green 2004, pp. 945-951, Berlin, Germany, September 6-8 2004.

Failure Analysis and Virtual Qualification of PBGA Under Multiple Environmental Loadings, H. Qi, C. Wilkinison, M. Osterman, and M. Pecht, Electronic Components and Technology Conference, Proceedings. 54th, Vol, 1. No. 1-4, pp. 413-420, June 2004.

Electromagnetic Interference (EMI) Reduction from Printed Circuit Boards (PCB) Using Electromagnetic Bandgap Structures, S. Shahparnia, O. Ramahi, IEEE Transactions on Electromagnetic Compatibility, Vol. 46, Issue 4, pp. 580-587, November 2004.

Virtual Qualification of a Plastic Encapsulated DC-DC Converter, K. Ghosh, B. Willner, and P. McCluskey, 2004 IEEE 35th Annual Power Electronics Specialists Conference, Vol. 4, pp. 2578-2582, 2004.

Contact Resistance and Fretting Corrosion of Lead-Free Alloy Coated Electrical Contacts, J. Wu and M. Pecht, Proceedings of 2004 International IEEE Conference on Asian Green Electronics, pp. 127-125, 2004.

The Impact of Lead-Free Legislation Exemptions on the Electronics Industry, M. Pecht, Y. Fukuda and S. Rajagopal, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 4, pp. 221-232, October 2004.

Understanding and Validating Practical EMI/EMC Antennas Using Numerical Codes, S. Shahparnia, M. Kermani, O. Ramahi, International Symposium on Electromagnetic Compatibility, Vol. 2, pp. 691-696, August 9-13, 2004.

Electromagnetic Noise Mitigation in High-Speed Printed Circuit Boards and Packaging Using Electromagnetic Band Gap Structures, S. Shahparnia, B. Mohajer-Iravani, and O. Ramahi, Proceedings Electronic Components and Technology, Vol. 2, pp. 1831-1836, June 1-4, 2004.

Miniaturized Electromagnetic Bandgap Structures for Ultra-Wide Band Switching Noise Mitigation in High-Speed Printed Circuit Boards and Packages, S. Shahparnia, O. Ramahi, IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 211-214, October. 25-27, 2004.

An Efficient Optimization Method for the Reconstruction of Multiple Profiles, F. Seydou, T. Seppanen, and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 209-212, June 20-25, 2004.

Concurrent Complementary Operators Method for the Absorption of Evanescent Waves in Frequency-Domain Finite Element Simulations [Waveguides], X. Wu, O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 387-390, June 20-25, 2004.

Complementary Operators Method for ADI-FDTD Open-Region Simulations, M. Kermani, O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 587-590, June 20-25, 2004.

Instable ADI-FDTD Open-Region Simulation, M. Kermani, X. Wu, and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 595-598, June 20-25, 2004.

Coupled Stability Analysis for the Open-Region Finite-Difference Time-Domain Simulations, X. Wu and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 599-602, June 20-25, 2004.

A Multipole Expansions Method for Acoustic Wave Propagation in Vocal Tract, F. Seydou, T. Seppanen, and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 1, pp. 631-634, June 20-25, 2004.

Near-Field Scanning Microwave Microscopy for Detection of Subsurface Biological Anomalies, X. Wu and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 3, pp. 2444-2447, June 20-25, 2004.

Simple and Accurate Circuit Models for High-Impedance Surfaces Embedded in Printed Circuit Boards, S. Shahparnia and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 3565-3568, June 20-25, 2004.

High-impedance Surfaces Embedded in Printed Circuit Boards: Design Considerations and Novel Applications, S. Shahparnia and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 3569 - 3572, June 20-25, 2004.

Electromagnetic Band-Gap Structures for Multiband Mitigation of Resonant Modes in Parallel-Plate Waveguides, T. Kamgaing and O. Ramahi, IEEE Antennas and Propagation Society Symposiums, Vol. 4, pp. 3577-3580, June 20-25, 2004.

Computation of Green's Function for Finite-Size Photonic Crystals by Boundary Element Method, F. Seydou, O. Ramahi, R. Duraiswami, and T. Seppdnen, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 4320 - 4323, June 20-25, 2004.

A Closed form Solution of the Helmholtz Equation for a Class of Chaotic Resonators, F. Seydou and O. Ramahi, IEEE Antennas and Propagation Society Symposium, Vol. 4, pp. 4440 - 4443, June 20-25, 2004.

Life Consumption Monitoring for Electronics Prognostics, S. Mishra, S. Ganesan, M. Pecht and J. Xie, Proceedings of the IEEE Aerospace Conference, Vol. 5, pp. 3455 - 3467, March 6-13, 2004.

Simultaneous Switching Noise Mitigation in PCB Using Cascaded High-Impedance Surfaces, S. Shahparnia and O. Ramahi, Electronic Letters, Vol. 40 Issue 2, pp. 98-100, January 22, 2004.

Reliability of Pressure-Sensitive Adhesive Tapes for Heat Sink Attachment in Air-Cooled Electronic Assemblies, V. Eveloy, P. Rodgers, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 4, No. 4, pp. 650-657, December 2004.

In Situ Temperature Measurement of a Notebook Computer - A Case Study in Health and Usage Monitoring of Electronics, N. Vichare, P. Rodgers, V. Eveloy, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 4, No. 4, pp. 658-663, December 2004.

Application of Numerical Analysis to the Optimisation of Electronic Component Reliability Screening and Assembly Processes, V. Eveloy, P. Rodgers, and M. Hashmi, Journal of Materials Processing Technology, Vol. 155-156, pp. 1788-1796, 2004.

Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Electronic Systems, P. Sandborn and P. Singh, Proceedings of the International Society of Logistics (SOLE) International Conference and Exhibition, Norfolk, VA, September 2004.

Avionics Architecture Approach to the Sustainable Utilization of Commercial Technology, C. Wilkinson, IEEE Aerospace and Electronic Systems Magazine, Vol. 19, No. 10, pp. 7-10, October 2004.

Prognostics and Health Management for Improved Dispatchability of Integrated Modular Avionics Equipped Aircraft, C. Wilkinson, 23rd Digital Avionics Systems Conference (DASC), Salt Lake City, UT, October 2004.

Effect of Heat Treatment on Tin Whisker Growth, Y. Fukuda, T. Fang, M. Pecht, and M. Osterman, Proceedings of the International SMTA Conference, pp. 717-723, Chicago, September 26-30, 2004.

Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages, E. Stellrecht, B. Han, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 3, pp. 499-506, September 2004.

Fill Pattern and Particle Distribution of Underfill Material, Y. Hang, D. Bigio and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol.27, No. 3, pp. 493-498, September 2004.

Application of Health Monitoring to Product Take-Back Decisions, N. Vichare, P. Rodgers, M. Azarian, and M. Pecht, Proceedings of the Joint International Congress and Exhibition - Electronics Goes Green 2004, pp. 945-951, Berlin, Germany, September 6-8, 2004.

Why Gold Flash Can Be Detrimental to Long-Term Reliability, J. Xie, M. Sun, M. Pecht, and D. Barbe, ASME Journal of Electronic Packaging, Vol. 126, Issue 1, pp. 37-40, March 2004.

Prognostics and Health Management for Avionics, Wilkinson, C., Humphrey, D., Vermeire, B., and Houston, J., IEEE Aerospace Conference, Big Sky, MT, Mar. 2004.

Life Consumption Monitoring for Electronics Prognostics, S. Mishra, S. Ganesan, M. Pecht and J. Xie, Proceedings of the IEEE Aerospace Conference, Vol. 5, pp. 3455 - 3467. March 6-13, 2004.

Application of In-Situ Health Monitoring and Prognostic Sensors, J. Xie and M. Pecht 9th Pan Pacific Microelectronics Symposium Exhibits and Conference, Kahuku, Oahu, Hawaii, 10-12 February 2004.

The Concurrent Complementary Operators Method Applied to Two-Dimensional Time-Harmonic Radiation and Scattering Problems, V. Chebolu, X. Wu, and O. Ramahi, IEEE Transactions Antennas Propagation, Vol. 53, No. 2, pp. 408-415, February 2004.

Simulation Model Development for Solder Joint Reliability for High Performance FBGA Assemblies, H. Qi, M. Osterman, M. Lee, K. Lee, O. Seyong, and T. Schmidt, 2004 IEEE 20th Annual Semiconductor Thermal Measurement and Management, pp. 300-307, March 9-11, 2004.

Accelerated Testing and Finite Element Analysis of PBGA Under Multiple Environmental Loadings, H. Qi, A. Ganesan, M. Osterman, and M. Pecht, 2004 International Conference, IEEE Business of Electronic Product Reliability and Liability, pp. 99-106, April 27-30, 2004.

Application of Low-Reynolds Number Turbulent Flow Models to the Prediction of Electronic Component Heat Transfer, P. Rodgers, and V. Eveloy, Proceedings of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, pp. 495-583, 2004.

CFD Prediction of Electronic Component Operational Temperature on PCBs, P. Rodgers and V. Eveloy, Electronics Cooling, Vol. 10, No. 2, pp. 22-28, May 2004.

Design Challenges for High-Performance Heat Sinks used in Microelectronic Equipment: Evolution and Future Requirements, P. Rodgers, and V. Eveloy, Proceedings of the Fifth International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 527-529, 2004.

Contact Discontinuity Modeling of Electromechanical Switches, J. Xie and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 2, pp. 210-216, March 2004.

Numerical Prediction of Electronic Component Operational Temperature: A Perspective, V. Eveloy, P. Rodgers, and M. Hashmi, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 2, pp. 269-282, June 2004.

Electronic Part Obsolescence Driven Product Redesign Planning, P. Singh, P. Sandborn, T. Geiser and D. Lorenson, International Journal of Advanced Manufacturing Systems, Vol. 7, No. 1, pp. 23-32, 2004.

Thermal Assessment of Glass-Metal Composition Plasma Display Panels Using Design of Experiments, M. Lee, M. Pecht, W. Lee, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 1, pp. 210-216, March 2004.

Identification of Missing or Insufficient Electrolyte Constituents in Failed Aluminium Electrolytic Capacitors, C. Hillman and N. Helmold, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Has the Electronics Industry Missed the Boat on Pb-Free Failures in Ceramic Capacitors with Pb-Free Solder Interconnects, N. Blattau and C. Hillman, IPC/JEDEC 5th International Lead Free Conference on Electronic Components and Assemblies, San Jose, CA, March 18-19, 2004.

Lead Free Solder and Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, and C. Hillman, 2004 Proceedings - 24th Capacitor and Resistor Technology Symposium, San Antonio, Texas, March 29 - April 1, 2004.

Questions Concerning the Migration to Lead-Free Solder, R. Ciocci, and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 34-40, 2004.

Assessing Lead-Free Intellectual Property, P. Casey and M. Pecht, Circuit World, Vol. 30, No. 2, pp. 46-51, 2004.

Failure Mechanisms in Electronic Products at High Altitudes, N. Blattau and C. Hillman, 2004 Proceedings - 8th Annual Commercialization of Military & Space Electronics Conference, Los Angeles, CA, February 9 - 12, 2004.

Minimization of Life Cycle Costs Through Optimization of the Validation Program - A Test Sample Size and Warranty Cost Approach, A. Kleyner, P. Sandborn, and J. Boyle, Reliability and Maintainability Symposium, Los Angeles, CA, January 2004.

Load Characterization during Transportation, A. Ramakrishnan and M. Pecht, Microelectronics Reliability, Vol. 44, No. 2, pp. 333-338, January 2004.

Indium Soldering for a MOEMS Based Safety and Arming Device, M. Deeds and P. Sandborn, the 9th Pan Pacific Microelectronics Symposium Exhibits & Conference, Kahuku, Oahu, Hawaii, February 2004.

Applications of In-Situ Health Monitoring and Prognostic Sensors, J. Xie and M. Pecht, the 9th Pan Pacific Microelectronics Symposium Exhibits & Conference, Kahuku, Oahu, Hawaii, 10-12 February, 2004.

Electrochemical Migration on HASL Plated FR-4 Printed Circuit Boards, E. Bumiller, M. Pecht and C. Hillman, Proceedings of 2004 SMTA Pan Pacific Microelectronics Symposium, Oahu, HI, pp. 201-205, February 11, 2004; Journal of Surface Mount Technology, Vol. 17, Issue 2, pp. 37-41, April-June 2004.

The Temperature Ratings of Electronic Parts, R. Mishra, M. Keimasi, and D. Das, Electronics Cooling, Vol. 10, No. 1, pp. 20-29, February 2004.

Load Characterization during Transportation, A. Ramakrishnan and M. Pecht, Microelectronics Reliability, Vol. 44, No. 2, pp. 333-338, February 2004.

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Methods for Predicting the Remaining Life of Electronic Assemblies with Carbon Nanotubes and an Optical Transduction Technique, P. Casey, S. Ganesan, M. Pecht and D. Anand, Proceeding of IMECE' 03 - 2003 ASME International Mechanical Engineering Congress, Washington, D.C. November 15-21, 2003.

Computer Aided Reliability Assessment, J. Wu, M. Pecht and J. Wang, Proceedings of the Fifth International Conference on Electronic Packaging Technology (ICEPT2003), pp. 36-39, October 28-30, 2003.

A Life Consumption Monitoring Methodology for Electronic Systems, Ramakrishnan, A. and Pecht, M., IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 625-634, September 2003.

A Simple Finite-Difference Frequency-Domain (FDFD) Algorithm for Analysis of Switching Noise in Printed Circuit Boards and Packages, M. Ramahi, V. Subramanian, and B. Archambeault, IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, pp. 191-198, May 2003.

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms, Z. Shi and P. Sandborn, Proceedings Test Conference, Vol. 1, pp. 937-946, September 30 - October 2, 2003.

Strain Evaluation of Epoxy-Cured Fiber-Optic Connectors, K. Broadwater, D. Barker, P. Mead, J. Kolasinski, and J. Watkins, Journal of Lightwave Technology, Vol. 21, No. 7, pp. 1668-1675, July 2003.

Design Guidelines for Avoiding Flex Cracking in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Global SMT and Packaging, Vol. 3, No. 1, pp. 18-21, January/February 2003.

Hygroscopic Swelling of Encapsulated Microcircuits - Part I, B. Han, E. Stellrecht, and M. Pecht, Advanced Packaging, pp. 31-35, June 2003.

Reliability Capability Assessment Methodology, S. Tiku and M. Pecht, Proceedings of IMAPS Brazil 2003, the International Technical Symposium on Packaging, Assembling and Testing & Exhibition, Campinas - SP, Brazil, August 6-8, 2003.

Organizational Reliability Capability, S. Tiku, M. Pecht, and J. Strutt, Proceedings of Canadian Reliability and Maintainability Symposium, Ottawa, Canada, October 16-17, 2003.

Evaluation of Selected Japanese Lead-Free Consumer Electronics, Y. Fukuda, P. Casey, and M. Pecht, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 4, pp. 305-312, October 2003.

Thermomechanical Analysis of Gold-Based SiC Die-Attach Assembly, K. Meyyappan, P. McCluskey, and L. Chen, Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 152-158, December 2003.

Reliability Prediction Modeling of Semiconductor Light Emitting Device, J. Xie and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 4, pp. 218-222, December 2003.

An Investigation of the Contact Resistance of a Commercial Elastomer Interconnect Under Thermal and Mechanical Stresses, W. Liu, M. Lee, and M. Pecht, IEEE Transactions on Device and Materials Reliability, Vol. 3, No. 2, pp. 39-43, June 2003.

Determining the Lifetime of Silver-Filled Isotropic Conductive Adhesive (ICA) / Solder Plated Interconnections, N. Helmold, P. Iyer, and C. Hillman, Proceedings of the IMAPS Advanced Technology Workshop on Optoelectronics Device Packaging and Materials, Bethlehem, PA, October 2003.

Optimum Technology Insertion into Systems Based on the Assessment of Viability, P. Sandborn, T. Herald, J. Houston, and P. Singh, IEEE Transaction on Components and Packaging Technologies, Vol. 26, No. 4, pp. 734-738, December 2003.

Application of 3D Measurement System with CCD Camera in Microelectronics, M. Lee, M. Pecht J. Tyson, and I. CMD, Advanced Packaging, pp. 33-34, November 2003.

Methods for Predicting the Remaining Life of Electronic Assemblies with Carbon Nanotubes and an Optical Transduction Technique, P. Casey, S. Ganesan, M. Pecht and D. Anand, Proceeding of IMECE' 03 - 2003 ASME International Mechanical Engineering Congress, Washington D.C., November 15-21, 2003.

Characterization of Anisotropic Conductive Adhesives, P. Iyer, P. Baumgaertner, D. Farley, and A. Dasgupta, Proceedings of ASME IMECE 2003 - 2003 ASME International Mechanical Engineering Congress and RD&D Expo, Washington, D.C., November 15-21, 2003.

Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms, Z. Shi and P. Sandborn, Proceedings of the International Test Conference, October 2003.

Performance of Plated Additive Resistors, M. Wood, D. Fritz, D. Sawoska, F. Durso, L. Salzano, and P. Sandborn, Proceedings Taiwan Printed Circuit Association Meeting, October 2003.

Cost and Production Analysis for Substrates with Embedded Passives, P. Sandborn, B. Etienne, J. W. Herrmann, and M. M. Chincholkar, Circuit World, Vol. 30, No. 1, pp. 25-30, 2003.

Modeling Test, Diagnosis, and Rework Operations and Optimizing Their Location in General Manufacturing Processes, Z. Shi and P. Sandborn, ASME 8^th Design for Manufacturing Conference, Chicago, IL, September 2003.

Manufacturing and Reliability of Pb-Free and Mixed System Assemblies (SnPb/Pb-Free) in Avionics Environments, D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, and A. Dasgupta, The SMTA International Annual Conference, Chicago, IL, September 21-25, 2003.

Environmental Aging and De-Adhesion of Siloxane-Polyimide-Epoxy Adhesive, S. Murray, C. Hillman and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 524-531, September 2003.

Lead-Free Soldering in the Japanese Electronics Industry, Y. Fukuda, M. Pecht, K. Fukuda and S. Fukuda, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 616-624, September 2003.

A Life Consumption Monitoring Methodology for Electronic Systems, A. Ramakrishnan and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 625-634, September 2003.

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders, Q. Zhang, A. Dasgupta and P. Haswell, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Auditing the Reliability Capability of Electronics Manufactures, S. Tiku and M. Pecht, Advances in Electronic Packaging, v 1, Advances in Electronic Packaging 2003: Volume 1, pp. 947-953, 2003
(Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.)

A Review of the Economics of Embedded Passives, P. Sandborn, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Surface Finish Effects on High-Speed Interconnects, X. Wu, M. Ramahi, G. Brist, and D. Cullen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Compact Modeling of Unshrouded Plate Fin Heat Sinks, S. Narasimhan and A. Bar-Cohen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Pool Boiling of Water and FC-72 on Copper and Graphite Foams, S. Moghaddam, M. Ohadi and J. Qi, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices, G. Solbrekken, K. Yazawaand, and A. Bar-Cohen, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability, E. Stellrecht, B. Han, and M. Pecht, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Advanced Micro Shear Testing for Solder Alloy Using Direct Local Measurement, S. Kwon, Y. Lee, and B. Han, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Wire Flexure Fatigue Model for Asymmetric Bond Height, K. Meyyappan, P. Hansen and P. McCluskey, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, July 6-11, 2003.

Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging, R. Swaminathan, H. Bhaskaran, P. Sandborn, G. Subramanian, M. Deeds, and K. Cochran, IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, pp. 141-151, May 2003.

Failures in Base Metal Electrode (BME) Capacitors, D. Donahoe, C. Hillman and M. Pecht, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 129-133, Scottsdale, AZ, March 31 - April 3, 2003.

Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, and C. Hillman, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 155-162, Scottsdale, AZ, March 31 - April 3, 2003.

The Economics of Embedded Passives, P. Sandborn, in Integrated Passive Component Technology, Wiley- IEEE Press, 2003.

The NEMI Roadmap: Integrated Passives Technology and Economics, J. Dougherty, J. Galvagni, L. Marcanti, R. Sheffield, P. Sandborn, and R. Ulrich, Proceedings of the Capacitor and Resistor Technology Symposium (CARTS), Scottsdale, AZ, April 2003.

Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging, H. Ardebili, E. Wong, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 206-214, March 2003.

Ion Transport in Encapsulants Used in Microcircuit Packaging, L. Lantz II and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 199-205, March 2003.

Failure Analysis of Electrostatic Discharge and Electrical Overstress Failures of GaAs MMIC, Y. Hwang, M. Lee and M. Pecht, IMAPS Advanced Technology Conference on 3-D Packaging, pp. 1-5, Baltimore, MD, March 11-13, 2003.

Fill Pattern of Underfill and Particle Distribution, Y. Huang, D. Bigio and M. Pecht, Society of Plastics Engineers Annual Technical Conference, pp. 1289-1293, Nashville, TN, May 4-8, 2003.

Investigation of Packaging Properties as a Function of Filler Microstructures, Y. Huang, D. Bigio, and M. Pecht, Society of Plastics Engineers Annual Technical Conference, pp. 1320-1324, Nashville, TN, May 4-8, 2003.

Test Tailoring Methodology for Impact Testing of Portable Electronic Products, J. Varghese and A. Dasgupta, IMAC-XXI Conference on Structural Dynamics, Kissimmee, Florida, February 3-6, 2003.

Carbon Nanotubes and an Optical Method for Life Consumption Monitoring of Electronic Assemblies, P. Casey, D. Anand, and M. Pecht, Proceedings of the 8th Annual Pan Pacific Microelectronics Symposium, Maui, HI, pp. 225-234, February 18-20, 2003.

Field Failure Due to Creep Corrosion on Components with Palladium Pre-plated Leadframes, P. Zhao and M. Pecht, Microelectronics Reliability, Vol. 43, No. 5, pp. 775-778, 2003.

Isothermal Mechanical Creep and Fatigue of Pb-free Solders, Q. Zhang, P. Haswel,l and A. Dasgupta, International Brazing &Soldering Conference, San Diego, CA, February 16-19, 2003.

Diffusion and Absorption of Corrosive Gases in Electronic Encapsulants, C. Hillman, B. Castillo, and M. Pecht, Microelectronics Reliability, Vol. 43, pp. 635-643, April, 2003.

Optical Measurement of Flip-Chip Package Warpage and Its Effect on Thermal Interfaces, B. Han, Electronics Cooling, Vol. 9, No. 1, pp. 10-14, February 2003.

Remaining Life Assessment of Aging Electronics in Avionic Applications, R. Valentin, M. Osterman, and B. Newman, The Annual Reliability and Maintainability, 2003 Proceedings, pp. 313-318, Tampa Florida, January 27-30, 2003.

A Novel Power Plane with Integrated Simultaneous Switching Noise Mitigation Capability Using High Impedance Surface, T. Kamgaing and O. Ramahi, IEEE Microwave and Wireless Components Letters, Vol. 13, No. 1, pp. 21-23, January 2003.

Characterization of Some Commercial Thermally-Cured Potting Materials, I. Baylakoglu, C. Hillman, and M. Pecht, Proceedings of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong, January 13-14, 2003.

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In-situ Sensors for Product Reliability Monitoring, Mishra, S. and Pecht, M., Proceedings of SPIE, Vol. 4755, pp. 10-19, 2002.

Average Elastic Fields and Scale-Dependent Overall Properties of Heterogeneous Micropolar Materials Containing Spherical and Cylindrical Inhomogeneities, P. Sharma and A. Dasgupta, Physical Review B, Vol. 66, No. 22, 22410, December, 2002.

Aging Aircraft Usable Life and Wear-out Issues, D., Humphrey, W. Shawlee, P. Sandborn, D. Lorenson, , Proc. World Aviation Congress (SAE Technical Paper: 2002-1-3013), , Phoenix, AZ, November 2002.

Recommendations for Future Avionics Hardware Development, C. Wilkinson, M. Pecht, J. Wasson, and L. Condra, Proceedings of the World Aviation Congress, Phoenix, AZ, November 2002.

The Technical, Social and Legal Outlook for Lead-Free Solders, P. Casey and M. Pecht, IEEE International Symposium on Electronic Material and Packaging, pp. 483-492, Kaohsiung, Taiwan, December, 2002.

Challenges for Adopting Pb-Free Interconnects for "Green" Electronics, P. Casey and M. Pecht, IPC/JEDEC International Conference on Lead-Free Electronic Components and Assemblies, pp. 21-32, Taipei, Taiwan, December 10-12, 2002.

Thermal Characteristics of Glass-Metal Composition Plasma Display Panels, M. Lee and M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 25, No. 4, pp. 488-494, 2002.

Remaining Life Assessment of Shuttle Remote Manipulator System End Effector, V. Shetty, D. Das, M. Pecht, D. Hiemstra, and S. Martin, Proceedings of the 22nd Space Simulation Conference, Ellicott City, MD, October 21-23, 2002.

Remaining Life Prediction of Electronic Products Using Life Consumption Monitoring Approach, S. Mishra, M. Pecht, T. Smith, I. McNee, and R. Harris, Proceedings of the European Microelectronics Packaging and Interconnection Symposium, pp. 136-142, Cracow, June 16-18, 2002.

Concurrent Complementary Operators for Mesh Truncation in Frequency-Domain Simulations, O. Ramahi, IEEE Microwave and Wireless Components Letters, Vol. 12, No. 3, pp. 99-101, March 2002.

Observing Real-Time Thermal Deformations in Electronic Packaging, S. Cho, S. Cho and B. Han, Experimental Techniques, Vol. 26, No. 3, pp. 25-29, May/June 2002.

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly under Accelerated Thermal Cycling Condition, B. Han, S. Cho, and J. Joo, Journal of Electronic Packaging, Transaction of the ASME, August 2002.

Effect of Underfill on Flip-Chip Solder Bumps: An Experimental Study By Microscopic Moire Interferometry, S. Cho and B. Han, The International Journal of Microcircuits and Electronic Packaging, Vol. 24, No. 3, pp. 217-239, 2002.

Virtual Life Assessment of Electronic Hardware Used in the Advanced Amphibious Assault Vehicle (AAAV), R. Valentin, J. Cunningham, M. Osterman, A. Dasgupta, M. Pecht, and D. Tsagos, Proceedings of the 2002 Winter Simulation Conference, Vol. 1, pp. 948-953, San Diego, California, December 8-11, 2002.

Stress Relaxation in Plastic Molding Compounds, M. Lee, M. Pecht, X. Huang, and R. Lee, IEEE International Symposium on Electronic Material and Packaging, pp. 1-6, Kaohsiung, Taiwan, December, 2002.

Design Guidelines for Avoiding Flex Cracking in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Proceedings of the National Electronic Packaging and Production Conference (NEPCON -West), CA version pp. 318-326, San Jose, CA, December 2002.

Isothermal Mechanical Fatigue of Pb-free Solders: Damage Propagation Rate & Time to Failure, Q. Zhang, P. Haswell, A. Dasgupta, and M. Osterman, 34th International SAMPE Technical Conference, Baltimore, MD, November 4-7, 2002.

Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys, Q. Zhang, P. Haswell, and A. Dasgupta, Proceedings ASME IMECE 2002, New Orleans, LA, November 17-22, 2002.

Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts, J. Wu and M. Pecht, Proceedings of the 4th Electronics Packaging Technology Conference, Singapore, pp. 20-24, December 10-12, 2002.

Plastic Ball-Grid-Arrays (PBGA): Are They Ready for Environmentally Harsh Aerospace Applications? R. Guha, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, M. Osterman, H. Qi, J. Kennedy, and J. Veum, 02WAC-149, World Aviation Congress & Display (WAC), Phoenix, AZ, November 5-7, 2002.

Underfilled PBGA Packages and Their Board Level Cycling and Vibration Performance, T. Baumann, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, J. Kennedy, J. Veum, H. Qi, and M. Osterman, SMTA International 2002, Donald Stephens Convention Center, Rosemont, IL, September 24-26, 2002.

Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht, D. Das, and R. Biagini, Proceedings of The 3rd International Conference on Quality and Reliability, pp. 182-192, Australia, August 28-30, 2002.

Airborne Operation of Portable Electronic Devices, L. Lin, J. Xie, O. Ramahi M. Pecht, and B. Donham, IEEE Antenna's and Propagation Magazine, Vol. 44, No. 4, pp. 30-39, August 2002.

The IEEE Standards on Reliability Program and Reliability Prediction Methods for Electronic Equipment, M. Pecht, D. Das, and A. Ramakrishnan, Microelectronics Reliability, Vol. 42, pp. 1259-1266, 2002.

Determining Optimum Redesign Plans for Avionics Considering Electronic Part Obsolescence Forecasts, P. Singh, P. Sandborn, D. Lorenson, and T. Geiser, Proceedings World Aviation Congress (SAE Technical Paper: 2002-1-3012), Phoenix, AZ, November 2002.

Aging Aircraft Usable Life and Wear-out Issues, D. Humphrey, W. Shawlee, P. Sandborn, and D. Lorenson, Proceedings World Aviation Congress (SAE Technical Paper: 2002-1-3013), Phoenix, AZ, November 2002.

Electronic Part Obsolescence Driven Design Refresh Optimization, P. Sandborn and P. Singh, Proceedings FAA/DoD/NASA Aging Aircraft Conference, San Francisco, CA, September 2002.

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects, J. Okura, A. Dasgupta, and J. Caers, Transactions of the ASME, Vol. 124, pp. 184-187, September 2002.

Thermomechanical Durability of High I/O BGA Packages, P. Davuluri, S. Shetty, A. Dasgupta, and S. Young, Transactions of the ASME, Vol. 124, pp. 226-270, September 2002.

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part I: Formulation, P. Sharmal and A. Dasgupta, Transactions of the ASME, Vol. 124, pp. 292-297, September 2002.

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data, P. Sharmal and A. Dasgupta, Transactions of the ASME, Vol. 124, pp. 298-304, September 2002.

Application of the Concurrent Complementary Operators Method to Numerically-Derived Absorbing Boundary Conditions, X. Wu and O. Ramahi, Microwave and Optical Technology Letters, Vol. 32, No. 4, pp. 272-275, February, 2002.

Analysis and Reduction of Electromagnetic Field Leakage through Loaded Apertures, L. Li and O. Ramahi, IEEE Antennas and Propagation Society/URSI International Symposium. San Antonin, TX, June 16-21, 2002.

Calculation and Mitigation of Power Plane Resonance in Printed Circuit Boards (PCB), V. Subramanian and O. Ramahi, In Proceedings IEEE Antennas and Propagation Society/URSI International Symposium, San Antonio, TX, June 16-21, 2002.

Electronic Part Obsolescence Driven Design Refresh Optimization, P. Singh, P. Sandborn, T. Geiser, and D. Lorenson, Proceedings International Conference on Concurrent Engineering, pp. 961-970, Cranfield University, UK, July 2002.

A Detailed Cost Model for Concurrent Use With Hardware/Software Co-Design, D. Ragan, P. Sandborn, and P. Stoaks, Proceedings IEEE Design Automation Conference, pp. 269-274, New Orleans, LA, June 2002.

Intermetallic Growth on PWBs Soldered with Sn3.8Ag0.7Cu, Y. Zheng, C. Hillman, and P. McCluskey, presented on Proceedings of the 52nd Electronic Components & Technology Conference, pp. 1226-1231, San Diego CA, 2002.

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints, Y. Zheng, C. Hillman, and P. McCluskey, presented on AESF SUR/FIN 2002 Chicago IL, June 24-27, 2002.

A Review of Reliability Prediction Methods for Electronic Devices, B. Foucher, J. Boullie, B. Meslet, and D. Das, Microelectronics Reliability, Vol. 42, No. 8, pp. 1155-1162, August, 2002.

Characterization of Plastic Encapsulant Materials as a Baseline for Quality Assessment and Reliability Testing, L. Lantz, S. Hwang, and M. Pecht, Microelectronics Reliability, Vol. 42, No. 8, pp. 1163-1170, August, 2002.

Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal, R. Ciocci, J. Wu, and M. Pecht, European Microelectronics Packaging and Interconnection Symposium, Cracow, Poland, pp. 73-80, June 16-18, 2002.

Remaining Life Prediction of Electronic Products Using Life Consumption Monitoring Approach, S. Mishra, M. Pecht, T. Smith, I. McNee, and R. Harris, European Microelectronics Packaging and Interconnection Symposium, Cracow, pp. 136-142, June 16-18, 2002.

The "Trouble Not Identified" Phenomenon in Automotive Electronics, D. Thomas, K. Ayers, and M. Pecht, Microelectronics Reliability, Vol. 42, pp. 641-651, 2002.

Tracking Semiconductor Part Changes Through the Part Supply Chain, S. Murray, M. Boru, M. Pecht, and D. Erhart, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, pp. 230-238, June 2002.

Uprating of a Single Inline Memory Module, N. Pendse, D. Thomas, D. Das, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, pp. 266-269, June 2002.

In-situ Sensors for Product Reliability Monitoring, S. Mishra, M. Pecht, and D. Goodman, Proceedings of SPIE, Vol. 4755, pp. 10-19, 2002.

Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach, K. Cluff and M. Osterman, presented at IPC Printed Circuits Expo 2002, Long Beach Convention Center, Long Beach, CA, March 24-28, 2002.

Simulation Improved Testing of Electronic Hardware, M. Osterman, A. Dasgupta, and L. Tonnelier, 2002 Proceedings of the 48th ATM, ISBN: 1-877862-81-9, Document No. 2011, Published on April 1, 2002.

Lifetime RC Time Delay of On-Chip Copper Interconnect, M. Sun, M. Pecht, and D. Barbe, IEEE Transactions on Semiconductor Manufacturing, Vol. 15, No. 1, pp. 253-259, May 2002.

A Comparison of the Theory of Moisture Diffusion in Plastic Encapsulated Microelectronics with Moisture Sensor Chip and Weight-Gain Measurements, H. Ardebili, C. Hillman, M. Natishan, P. McCluskey, M. Pecht, and D. Peterson, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp. 132-139, March 2002.

Electrical Characterization of Lead-Free Solder Separable Contact Interfaces, J. Wu, M. Pecht, and R. Mroczkowski, Journal of Surface Mount Technology, Vol. 14, Issue. 2, pp. 25-29, June 2002. Also presented at Pan Pacific Microelectronics Symposium, pp. 125-130, Maui, Hawaii, February 5-7, 2002.

The Business, Product Liability and Technical Issues Associated with Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht and R. Biagini, Pan Pacific Microelectronics Symposium, pp. 391-398, Maui, Hawaii, February 5-7, 2002.

Solder Joint Crack Propagation in Plastic and Ceramic Packaged Diodes mounted on Insulated Metal Substrate, N. Sangalli and D. Barker, 2001 Electronic Components and Technology Conference, 2001.

On the Design Parameters of Flip-Chip PBGA Package Assembly for Optimum Solder Ball Reliability, K. Verma, S. Park, and B. Han, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 300-307, 2001.

Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moire Interferometry, Z. Wu, S. Cho, and B. Han, Experimental Techniques, Vol. 25, No. 3, pp. 22-25, 2001.

DMD^TM Package Model Calibration Using Interferometry, M. Variyam and B. Han, TI Technical Journal, pp. 1-9, 2001.

Modeling of Effects of Geometry and Temperature Cycle on Viscoplastic Deformation and Durability of FCOC Solder Joints, Q. Zhang, Y. Joshi, A. Dasgupta, and R.Pal, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 9-13, 2001.

Failures in Electronic Assemblies and Devices, M. Pecht, P. McCluskey, and J. Evans, In Product Integrity and Reliability in Design, Chapter 8, Springer Verlag, London, UK, 2001.

Failure Analysis of Electronic Assemblies and Devices, M. Pecht and P. McCluskey, In Product Integrity and Reliability in Design, Chapter 13, Springer Verlag, London, UK, 2001.

Microthermomechanical Analysis of Lead-Free Sn3.9Ag0.6Cu Alloys; Part I: Viscoplastic Constitutive Properties; and Part II: Cyclic Durability Properties, P. Haswell, A. Dasgupta, and A. Paper, MRS Proceedings, N2.1, Vol. 682E, MRS Spring Symposium on Microelectronics and Microsystems Packaging; Editors: Boudreaux, Dauskardt, Last, and McCluskey, Chicago IL, 2001.

The NEMI Roadmap Perspective on Integrated Passives, J. Dougherty, J. Galvagni, L. Marcanti, P. Sandborn, R. Charbonneau, and R. Sheffield, Proceedings of the European Microelectronics and Packaging Conference & Exhibition, May 2001.

Engineered Reliability for Intelligent Well Systems, A. Veneruso, A. Kosmala, R. Bhavsar, J. Bernard, and M. Pecht, OTC 1301, Offshore Technology Conference, Houston, TX, April 30 - May 3, 2001.

A New Test/Diagnosis/Rework Model for Use in Technical Cost Modeling of Electronic Systems Assembly, T. Trichy, P. Sandborn, and S. Sahasrabudhe, Proceedings of the International Test Conference, pp. 1108-1117, Baltimore MD, November 2001.

Lead-free Solder Replacement: Beyond the Material Substitution, R. Ciocci, Environmentally Conscious Manufacturing II, Vol. 4569, pp. 100-108, Newton, USA, 28-29, October 2001.

IC Component Sockets: Applications and Challenges, W. Liu, M. Pecht, and R. Martens, International Microelectronics And Packaging Society, First Issue, pp. 61-67, 2001.

Using PEEC and FDTD to Solve the Challenge Delay Line Problem, B. Archambeault, A. Roden, and O. Ramahi, IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, August 13-17, 2001.

Full-Wave Analysis of Delay Lines, O. Ramahi and B. Archambeault, 14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland, February 20-22, 2001.

Phased-Array Radar for Breast Cancer Detection, O. Ramahi, T. Thakker, S. Trabelsi, and R. Russell, IEEE Antennas and Propagation Society International Symposium, Boston, MA, July 8-13, 2001.

Prediction of Shielding Degradation Arising from Variation in Contact Impedance of Inter-metallic Junctions, L. Li and O. Ramahi, IEEE Antennas and Propagation Society International Symposium, Boston MA, July 8-13, 2001.

Complementary Operators and Associated Issues of Instability, O. Ramahi, In Proceedings International Conference on Electromagnetics in Advanced Applications (ICEAA01), Torino, Italy, September 10-14, 2001.

Towards a Numerically-Comprehensive Theory for the Complementary Operators Method, O. Ramahi, URSI International Symposium on Electromagnetic Theory, Victoria, Canada, May 13-17, 2001.

Manufacturer Assessment Procedure and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and R. Uppalapati, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October 2001.

Part Assessment Guidelines and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and D. Humphrey, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 339-350, October 2001.

Rapid Reliability Assessment of ULSI Electronics, P. McCluskey, Proceedings of the 18th International VLSI Multilevel Interconnection, Santa Clara CA, November 28-29, 2001.

Evaluating the Performance and Reliability of Embedded Computer Systems for Use in Industrial and Automotive Temperature Ranges, C. O'Connor, K. Nathan, and P. McCluskey, Intel Developer Network News, Vol. 1, pp. 62-65, 2001.

Microsystem Packaging for High Temperature and Harsh Environments, L. Chen and P. McCluskey, MST (Microsystems) News, pp. 41-42, September 2001.

Junction Temperature Considerations in Evaluating Electronic Parts for Use Outside Manufacturers-Specified Temperature Ranges, L. Condra, D. Das, N. Pendse, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 721-728, December 2001.

Parameter Recharacterization: A Method of Thermal Uprating, D. Das, N. Pendse, C. Wilkinson, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 729-737, December 2001.

Process Capability and Product Reliability, B. Ramakrishnan, P. Sandborn, and M. Pecht, Microelectronics Reliability, Vol. 41, No. 12, pp. 2067-2070, December 2001.

Using Yielded Cost as a Metric for Modeling Manufacturing Processes, D. Becker and P. Sandborn, Proceedings ASME 6th Design for Manufacturing Conference, Pittsburgh PA, September 2001.

Fundamental Reliability Issues Associated with A Commercial Particle-in-Elastomer Interconnection System, W. Liu, M. Pecht and J. Xie, IEEE Transactions on Components and Packaging Technologies, Volume 24, No. 3, pp. 520-525, September, 2001.

Reliability Engineering in the 21st Century - A Focus on Predicting the Reliability of Electronic Products and Systems, M. Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1, pp. 1-19, Dalian, China, August 28-31, 2001.

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending, S. Shetty, V. Lehtinen, A. Dasgupta, and V. Halkola and T. Reinikainen, Journal of Electronic Packaging, Vol. 123, Issue 3, pp. 302-308, September 2001.

Hollow Fibers can Accelerate Conductive Filament Formation, M. Pecht, K. Rogers, and C. Hillman, ASM International Practical Failure Analysis, pp. 57-60, Vol. 1, Issue 4, August 2001.

Application-Specific Economic Analysis of Integral Passives, P. A. Sandborn, B. Etienne, and G. Subramanian, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 203-213, July 2001.

On the Use of Yielded Cost in Modeling Electronic Assembly Processes, D. Becker and P. Sandborn, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 195-202, July 2001.

Lead-free Solder and the Consumer Electronics Market, R. Ciocci, Proceedings of 2001 Green Engineering Conference, July 29-31, 2001, Roanoke, VA.

Mechanical Design Parameters for Enhanced Solder Ball Reliability of Flip-Chip PBGA Package Assembly, K. Verma, S. Park, and B. Han, Proceedings of IPACK'01, July 8-13, 2001, Kauai, Hawaii, USA.

Real-Time Moire Interferometry for Deformation Analysis under Accelerated Thermal Cycling Condition, S. Cho, J. Joo, and B. Han, Proceedings of IPACK'01, Kauai, Hawaii, July 8-13, 2001.

Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moire Interferometry, B. Han, Z. Wu, and S. Cho, Experimental Techniques, Vol. 25, No. 3, pp. 22-25, 2001.

High Performance Packaging Materials for Improved Thermal Management of Power Electronics, K. Moores and Y. Joshi, Future Circuits International, Issue No. 7, pp. 45-49, 2001.

Thermal Characterization of a Liquid Cooled AlSiC Base Plate with Integral Pin Fins K. Moores, Y. Joshi, and G. Schiroky, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 213-219, 2001.

A Demonstration of Virtual Qualification for the Design of Electronic Hardware, J. Cunningham, R. Valentin, C. Hillman, A. Dasgupta, and M. Osterman, ESTECH 2001, IEST, Phoenix, AZ, April 2001.

Carrier-Level Packaging and Reliability of a MEMS-Based Safety and Arming Device, M. Deeds, K. Cochran, R. Swaminathan, and P. Sandborn, Proceedings MRS Spring Meeting, April 2001.

Lifecycle Forecasting of ASICs, Z. Huang, P. Sandborn, M. Pecht, and R. Solomon, Future Circuits International, Issue 7, pp. 101-107, Technology Publishing Ltd, London, UK, 2001.

Progress on Internet-Based Educational Material Development for Electronic Products and Systems Cost Analysis, P. Sandborn and C. Murphy, Proceedings of the Electronic Components and Technology Conference (ECTC), pp. 1261-1266, Lake Buena Vista, FL, June 1, 2001.

A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics, P. McCluskey, Proceedings of the Electronic Component and Technology Conference (ECTC), pp. 397-400, Lake Buena Vista, FL, May 30, 2001.

Application-Specific Economic Analysis of Integral Passives in Printed Circuit Boards, B. Etienne and P. A. Sandborn, Proceedings of the IMAPS Advanced Packaging Materials Processes, Properties and Interfaces Symposium, Braselton GA, pp. 399-404, March 2001.

An Investigation of the Mechanical Behavior of Conductive Elastomer Interconnects, J. Xie, M. Pecht, D. DeDonato, and A. Hassanzadeh, Microelectronics Reliability, Vol. 41, No. 1, pp. 281-286, 2001.

Fatigue and Intermetallic Formation in Lead Free Solder Die Attach, P. McCluskey, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai HI, July 9-13, 2001.

Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling, A. Dasgupta, P. Sharma, and K. Upadhyayula, International Journal of Damage Mechanics, Vol. 10, pp. 101-132, April 2001.

We STILL have a headache with Arrhenius, M. Osterman, Electronics Cooling, Vol. 7, No. 1, pp 53-54, February 2001.

An Evaluation of Built-In Test, M. Pecht, M. Dube, M. Natishan, R. Williams, J. Banner, and I. Knowles, IEEE Transactions on Aerospace and Electronic Systems, Vol. 37, No. 1, pp. 266-272, January 2001.

Evaluation of Built-In Test, M. Pecht, M. Dube, M. Natishan, and I. Knowles, IEEE Transactions on Aerospace and Electronic Systems, Vol. 37, No. 1, pp. 266-272, January 2001.

Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.

Deciphering the DELUGE of DATA - Understanding Electronic Part Data Sheets for Parts Selection and Management, D. Das, N. Pendse, M., L. Condra and C. Wilkinson, Circuit & Devices, pp. 26-34, Septermber 2000.

Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures, E. Yu and Y.. Joshi, IEEE Transactions on components and Packaging Technologies, Vol. 23, No. 1, March 2000.

Assessing the Operating Reliability of Land Grid Array Elastomer Sockets, J. Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassenzadeh, and D. Dedonato, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 171-176, March 2000.

Moire Interferometry for Engineering Mechanics: Current Practices and Future Developments, B. Han, D. post, and P. Ifju, Journal of Electronic Packaging, Transaction of the ASME, Vol. 122, No. 3, pp. 294-300, 2000.

Parameter Re-characterization Case Study: Electrical Performance Comparison of the Military and Commercial Versions of a TI Octal Buffer, N. Pendse and M. Pecht, Future Circuits International, Vol. 6, pp. 63-67, Technology Publishing Ltd, London, UK, 2000.

Risk Assessment, Mitigation and Management - The Key Focus of Competitive Electronic Products Development in the 21st Century, M. Pecht, D. Das, and L. Yang, Proceedings of the SEMICON Korea Technical Symposium 2000, Seoul, Korea, pp. 217-224, February 16, 2000.

Effect of Condensor Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon, Y. Lang, Y. Joshi, and W. Nakayama, Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems, pp. 304-311, Banff, Alberta, Canada, October 15-20, 2000.

Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies, J. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. Caers and T. Reinikainen, Microelectronics Reliability, Vol. 40, No. 7, pp. 1173-1180, July 2000.

Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, C. Ramaswamy, Y. Joshi and W. Nakayama, IEEE transctions on Components and Packaging Technologies, Vol. 23, No.1,pp. 61-69, March 2000.

Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, Avionics Handbook, pp. 22-1 to 22-21, CRC Press, Boca Raton, Florida, December 2000.

Thermal Management of High Temperature Pulsed Electronics Using Phase Change Materials, S. Gurrum, Y. Joshi and J. Kim, 34th National Heat Transfer Conference Pittsburgh, NHTC 2000-12197, Pennsylvania, August 20-22, 2000.

Method for Assessing Remaining Life in Electronic Assemblies, P. McCluskey, J. Kweon, J. Kim and H. Jeon, Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306, 2000.

Reliable Use of Commercial Technology in High Temperature Environments, P. McCluskey, K. Mensah, C. O'Connor and A. Gallo, Microelectronics Reliability, Vol. 40, No. 8-10, pp. 1671-1678, August - October 2000.

Single Chamber Compact Thermosyphons with Micro-Fabricated Components, S. Murthy, Y. Joshi and W. Nakayama, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (I-Therm), Las Vegas NV, May 2000.

Electronic Part Life Cycle Concepts and Obsolescence Forecasting, R. Solomon, P. Sandborn and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 707-717, December 2000.

Development and Activities of the IEEE Reliability Standards Group, M. Pecht and A. Ramakrishnan, Journal of the Reliability Engineering Association of Japan, Vol. 22, No. 8, pp. 699-706, November 2000.

Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, The Modern Microwave and RF Handbook, pp. 3-102 to 3-121, CRC Press, Boca Raton, Florida, 2000.

Kinetic Model for Noble Plated Electrical Contact Behavior, M. Sun, M. Pecht and R. Martens, Scripta Materialia, Vol. 42, pp. 1-8, January 2000.

Effectiveness of Conformal Coatings on a PBGA Subjected to Unbiased High Humidity, High Temperature Tests, K. Zhang and M. Pecht, Microelectronics International, Vol. 17, No. 3, pp. 16-20, 2000.

Accelerated Testing of Microelectronics: Review, Pitfalls and New Developments, A. Katz, M. Pecht and E. Suhir, Proceeding of the IMAPS International Symposium on Microelectronics and Packaging, Tel Aviv, Israel, pp. 31-42, June 15, 2000.

Semiconductor Companies in China, W. Liu, M. Pecht and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 148-154, September 2000.

A Comparison with Taiwan, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 135-136, September 2000.

Newer Fabs in China, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 156-162, September 2000.

Trends in China's Semiconductor Industry, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 134-144, September 2000.

Virtual Prototyping Printed Circuit Boards, P. Sandborn, The Board Authority, Vol. 2, No. 4, pp. 6-10, December 2000.

An Investigation of the Electrical Contact Resistance of Corroded Pore Sites on Gold Plated Surfaces, R. Martens and M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 23, Issue 3, pp. 561-567, August 2000.

New Course Development in Products and Systems Cost Analysis, P. Sandborn, D. T. Allen, and C. F. Murphy, Proceedings Electronic Components and Technology Conference, pp. 1021-1026, May 2000.

Packaging of a MEMS Based Safety and Arming Device, M. Deeds, K. Cochran, P. Sandborn and R. Swaminathan, ITHERM 2000 Proceedings, Vol. 1, pp. 107-112, May 2000.

Test and Evaluation of Chip-to-Chip Attachment of MEMS Devices, P. Sandborn, R. Swaminathan, G. Subramanian, M. Deeds, and K. Cochran, ITHERM 2000 Proceedings, Vol. 1, pp. 133-140, May 2000.

Contact Variation and Shielding Performance of Electromagnetic Shielding Gaskets, J. Xie, M. Pecht, and D. Barbe, Proceedings of the 33rd Annual Connector and Interconnection Technology Symposium and Trade Show, Orlando FL, pp. 61-70, October 23-25, 2000.

An Avionics Guide to Uprating of Electronic Parts, D. Humphrey, L. Condra, N. Pends, D. Das, C. Wilkinson and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 595-599, September, 2000.

Chinese Electronics Industry in the Year 2000, C. Lee, M. Pecht, and Y. Chen, IMAPS Taiwan Technical Symposium 2000, Session 4, pp. 289-302, 2000.

Understanding Electronic Part Data Sheets for Parts Selection and Management, D. Das, N. Pends, M. Pecht, L. Condra, and C. Wilkinson, IEEE Circuits and Devices, Vol. 16, No. 5, pp. 26-34, September 2000.

Effects and Interactions of Design Parameters for Gold-Plated Electric Contacts, R. Martens and M. Pecht, Journal of Materials Science: Materials in Electronics , Vol. 11, pp. 209-218, May 2000.

Equipment Supplier Intervention Techniques, C. A. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, Future EMS International, No. 3, pp. 97-100, 2000.

Numerical and Experimental Thermal Characterization of a Liquid Cooled AlSiC Power Electronics Base Plate with Integral Pin Fins, K. Moores, Y. Joshi, and G. Schiroky, ITHERM 2000 Proceedings, Vol. 2. pp. 385-390, May 2000.

Effect of Corrosion on the Transfer Impedance of Zinc-Coated Steel Enclosures, J. Xie, M. Pecht, D. Barbe, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Electromagnetic Compatibility, Vol. 42, No. 1, pp. 71-76, February 2000.

Electronic Products and Systems Research and Education for the 21st Century, Y. Joshi and P. Sandborn, Future Circuits International, Vol. 6, pp. 88-91, 2000.

Corrosion of a Zinc-coated Steel Enclosure at the Contact Interfaces of Gasket Joints, J. Xie, M. Pecht, S. Das, J. Nuebel, and B. Zand, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 136-142, March 2000.

Assessing the Operating Reliability of LGA Elastomer Sockets, J. Xie, C. Hillman, P. Sandborn, M. Pecht, A. Hassanzadeh, and D. DeDonato, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 171-176, March 2000.

The Electronic Part Life Cycle, M. Pecht and D. Das, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 190-193, March 2000.

Failure Assessment Software for Circuit Card Assemblies, M. Osterman and T. Stadterman, Annual Proceedings of Reliability and Maintainability Symposium, pp. 269-276, January 18-21, 1999.

Performance Assessment of Thermoelectric Coolers for Use in High Temperature Electronics Applications, K. Moores, Y. Joshi, and G. Miller, Proceeding of the 18th International Conference on Thermoelectrics, Baltimore, MD, August 1999.

Moisture Ingress into Organic Laminates, M. Pecht, H. Ardebilib, A. Shukla, J. Hagge, and D. Jennings, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 1, pp. 104-110, March 1999.

An Interactive Multistage e-inequality Constraint Method for Multiple Objectives Decision Making, N. Palli, S. Azarm, P. McCluskey, and R. Sundararajan, Microelectronics International, 16/1, 6-7, 1999. Journal of Mechanical Design, Vol. 120, pp. 678-686, December 1998.

Integrated Thermal Analysis of an Automotive Electronic System, S. Murthy, Y. Joshi, V. Adams, and K. Ramakrishna, Proceedings of InterPACk'99, Vol. 1, pp. 979-986, June 1999.

Editorial: Life Cycle and Environmental Mismatches in Electronics for Critical Applications, P. McCluskey, Microelectronics International, Vol. 16, No. 1, pp. 6-7 1999.

New Findings in the Occurrence of False-Healing in Plastic Encapsulated Microcircuits using Scanning Acoustic Microscopy, T. Moore, Y, Ranade, and M. Pecht, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 2, pp. 266-269, June 1999.

An Investigation on the Mechanical Behavior of Elastomer Interconnects, J. Xie, M. Pecht, D. DeDonato, and A. Hassanzadeh, the 32nd International Symposium on Microelectronics, Chicago, IL, pp. 58-63, October 1999.

A Quantitative Assessment of Thermal Interface Materials, I. Bordelon, J. Xie, Y. Joshi, and C. Latham, Future Circuits International, Issue 5, pp. 75-78, 1999.

A Comparative Assessment of Gold Plating Thickness Required for Stationary Electrical Contacts, M. Sun, M. Pecht, and M. Natishan, Microelectionics Journal, Vol. 30, pp. 217-222, 1999.

A Statistical Mechanical Model of Electrical Carbon Fiber Contacts, J. Xie, M. Pecht, A. Dasgupta, J. Swift, and S. Wallace, Transactions of the ASME the Journal of Electronic Packaging, Vol. 121, pp. 286-290, December 1999.

A Comparison of Routing Estimation Methods for Microelectronic Modules, P. Sandborn and P. Spletter, Microelectronics International, pp. 36-41, December 1999.

Delamination Study of Chip-to-Chip Bonding for a LIGA Based Safety and Arming System, G. Subramanian, M. Deeds, K. Cochran, R. Raghavan, and P. Sandborn, Proceedings SPIE Symposium on Micromachining and Microfabrication, pp. 112-119, Sept. 1999.

A Multi-scale Conjugte Thermal Modeling Approach for Air Cooled Electronic Enclosures, L. Tang and Y. Joshi, Proceedings of InterPACk'99, Vol. 1, pp. 295-304, June 1999.

A Model for Optimizing the Assembly and Disassembly of Electronic Systems, P. A. Sandborn and C. F. Murphy, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22. No. 2, pp. 105-108, April 1999.

Reliability and Performance of Advanced PWB Assemblies, M. Osterman, High Performance Printed Circuit Boards, Chapter 9, ISBN: 0-07-026713-8, 1999.

Physics-of-Failure Assessment of a Cruise Control Module, K. Kimseng, M. Hoit, N. Tiwari, and M. Pecht, Microelectronics Reliability, Vol. 39, pp. 1423-1444, February 1999.

A Prescriptive Production-Distribution Approach for Decision Making in New Product Design C. Whicomb, N. Palli, and S. Azarm, IEEE Transactions on Systems, Man, and Cybernetics, Part C, Vol. 29, No. 3, pp. 336-348, 1999.

A Risk-Informed Methodology for Parts Selection and Management, M. Jackson, P. Sandborn, M. Pecht, C. Hemens-Davis, and P. Audette, Quality and Reliability Engineering International, Vol. 15, pp. 261-271, September 1999.

Conductive Filament Formation: A Potential Reliability Issue in Laminated Printed Circuit Cards with Hollow Fibers, M. Pecht, C. Hillman, K. Rogers, and D. Jennings, IEEE/CPMT, Vol. 22. No. 1, pp. 60-67, January 1999.

Conductive Filament Formation Failure in a Printed Circuit Board, K. Rogers, C. Hillman, M. Pecht, and S. Nachbor, Circuit World, Vol. 25 (3), pp. 6-8, 1999.

Thermal Control of Horizontally Mounted Heat Sources using Phase Change Materials, D. Pal and Y. Joshi, Proceedings of InterPACk'99, Vol. 2, pp. 1625-1630, June 1999.

Do You Know That Your Laminates May Contain Hollow Fibers? K. Rogers, P. Driessche, C. Hillman, and M. Pecht, Printed Circuit Fabrication, Vol. 22, No. 4, pp. 34-38, April 1999.

Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown, T. Dishongh, M. Dube, M. Pecht, and J. Wyler, ASME Journal of Electronic Packaging, Vol. 121, No. 2, pp. 126-127, June 1999.

Lifetime Resistance Model of Bare Metal Electrical Contacts, M. Sun, M. Pecht, M. Natishan, and R. Martens, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B (Advanced Packaging), Vol. 22, No. 1, February 1999.

Moisture Sensitivity Characterization of Build-up Ball Grid Array Substrates, M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 22, No. 3, pp. 515-523, August 1999.

Nano-to-Millimeter Scale Integrated Systems, H. Last, M. Deeds, D. Garvick, R. Kavetsky, P. Sandborn, E. Magrab, and S. Gupta, IEEE Transactions on Components and Packaging Technologies, Vol. 22, No. 2, pp. 338-343, June 1999.

Part Manufacturer Assessment Process, M. Jackson, A. Mathur, M. Pecht, and R. Kendall, Quality and Reliability Engineering International, Vol. 15, pp. 457-468, 1999.

Solder Failure Mechanisms in Single-Sided Insertion-Mount Printed Wiring Boards, C. Hillman, K. Rogers, A. Dasgupta, M. Pecht, R. Dusek, and B. Lorence, Circuit World, Vol. 25, (3), pp. 28-38, 1999.

The Limiting Strength Properties of Nanocrystalline Materials, R. W. Armstrong, and G. D. Hughes, Advanced Materials for the 21^stCentury, pp. 409-420, 1999.

The Small Appliance and Computer Industry: Do They Forget Reliability Lessons? A. Katz, IEEE Transactions on reliability, Vol. 48, No. 1, March 1999.

Tipping the Scales in Your Favor when Uprating, R. Biagini, M. Rowland, M. Jackson, and M. Pecht, IEEE Circuits & Devices Magazine, Vol. 15, Issue 4, pp. 15-23, July 1999.

Terminology on Use of Electronic Parts Outside the Manufacturer's Specified Temperature Ranges, L. Condra, R. Hoad, D. Humphrey, T. Brennom, J. Fink, J. Heebink, C. Wilkinson, D. Marlborough, D. Das, N. Pendsé, and M. Pecht, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 3, pp. 355-356, September 1999.

Trends in Component Reliability and Testing, Y. Zhang, D. Das, A. Katz, M. Pecht, and O. Hallberg, Semiconductor International, pp. 101-106, September 1999.

Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads, C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Journal of Enhanced Heat Transfer, Vol. 6, No. 2-4, pp. 279-288, 1999.

Use of thermal analysis information in avionics equipment development, D. Das, Electronics Cooling, Vol. 5, No. 3, September 1999.

Fundamental Overview of Accelerated-Testing Analytic Models, H. Caruso and A. Dasgupta, 1998 Proceedings Annual Reliability and Maintainability Symposium, pp. 389-393, 1988.

Decision Support System for High Temperature Electronics, P. McCluskey, M. Osterman, R. Jain, N. Tiwari, R. Grzybowski, T. Lin, and J. Benoit, Fourth International High Temperature Electronics Conference, pp. 176-180, June 14-18, 1998.

The Effect of Metal Vias on the Mechanical Properties of Cofired Ceramics: Three Dimensional Considerations, K. Hines and D. Barker, Proceedings of International Symposium on Microelectronics, Vol. 3582, pp. 491-496, San Diego, CA, Nov. 1-4, 1998.

Passive Thermal Control of Electronic Equipment, Y. Joshi, Applied Computational Fluid Dynamics, Chapter 8, Marcel Dekker, Inc. 1998.

A Case Study of IC Storage Failures in Taipei Trains, Y. Zhang, M, Pecht, and L. Lantz, Microelectronics Reliability, Vol. 38, No. 12, pp. 1811-1816, December 1998.

Low Temperature Delamination of Plastic Encapsulated Microcircuits, P. McCluskey, F. Lilie, O. Beysser, and A. Gallo, Microelectronics Reliability, Vol. 38, pp. 1829-1834.

High Temperature Performance of Polymer Film Capacitors, R. Grzybowski and P. Mccluskey, International Journal of Microelecronic Packaging, Vol. 1, pp. 153-158, 1998.

Application of Block-Implicit Multigrid Approach to Heat transfer Problems Involving Discrete Heating, L. Tang and Y. Joshi, ASME International Mechanical Engineering Congress and Exposition, Anaheim, CA., November 16-17, 1998.

A Critique of the Reliability Analysis Center's Failure Rate Model for Plastic Encapsulated Microcircuits, N. Sinnadurai, A. Shukla, and M. Pecht, IEEE Transactions on Reliability, Vol. 47, No. 2, pp. 110-113, June 1998.

Characterization of a Non-woven Randomly Dispersed Short Fiber Laminate, M. Pecht, K. Rogers, and A. Fowler, Circuit World, 24/3, pp. 34-37, 1998.

Cyanate Ester Die Attach Material for Radiation Hardened Electronic Packages, T. Shah, S. Danziger, K. Moores, and Y. Joshi, IEEE Adhesives in Electronics Symposium, Binghamton, N.Y. September 1998.

Characterizing the Thermal Performance of a Flow Through Electronic Module (SEM-E Format) Using a Porous Media Model, L. Tang, K. Moores, C. Ramaswamy, and Y. Joshi, Proceedings of the IEEE SEMITHERM XIV Symposium, pp. 68-77, San Diego, CA March 1998.

Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Proceedings of I-Therm VI, pp. 349-355, Seattle, WA, 1998.

Design-of-Experiment Methods for Computational Parametric Studies in Electronic Packaging, A. Dasgupta, M. G. Pecht, and B. Mathieu, Finite Elements in Analysis and Design, Vol. 30, pp. 125-146, 1998.

The Effect of Corrosion on Shielding Effectiveness of a Zinc-Coated Steel Enclosure, S. Das, J. Neubel, B. Zand, D. Hockanson, J. Xie, and M. Pecht, the 1998 IEEE International Symposium on Electromagnetic Compatibility, pp. 1041-1046, Denver CO, August 1998.

Electronic Packaging: Cross-Discipline is the Only Discipline, M. Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21, No. 1, March 1998.

Getting the Quality and Reliability Terminology Straight S. Lee, A. Katz, and C. Hillman, IEEE Transactions on IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, Vol. 21, No. 3, pp. 521-523, September 1998.

Guidelines for Physics-of-Failure Based Accelerated Stress Testing, K. Upadhyayula and A. Dasgupta, Annual Reliability and Maintainability Symposium, Anaheim, California, January 19-22, 1998.

Impact of Preconditioning Voltage Bias and Temperature on Reliability of Plastic Encapsulated Microcircuits, P. Sharma, K. Upadhyayula, L. Lantz, and M. Pecht, Microelectronics Reliability, Vol. 38, No. 4, pp. 581-584, 1998.

Impact of Underfill Filler Particles on Reliability of Flip Chip Interconnects, K. Darbha, J Okura, and A. Dasgupta, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol. 21, No. 2, June 1998.

Implementation of DFE in the Electronics Industry Using Simple Metrics for Cost, Quality, and Environmental Merit, C. Murphy, C. Mizuki, and P. Sandborn, Proceedings IEEE International Symposium on Electronics and the Environment, May 1998.

In-Situ Temperature Measurements of PQFPs During Infrared Reflow, M. Dube, T. Dishongh, K. Beatty, and M. Pecht, Circuit World, Vol. 24, No. 4, pp. 29-32, August 1998.

Integrating Environmental Inventory Analysis with Detailed Printed Circuit Board Fabrication Cost Modeling, P. Sandborn, Proceedings 19th AxESP/EPA Pollution Prevention & Control Conference, pp. 177-183, Jan. 1998.

An Investigation of 'Cannot Duplicate' Failure, R. Williams, J. Banner, I. Knowles, M. Natishan, and M. Pecht, Quality and Reliability Engineering International;, Vol. 14, pp. 331-337, 1998.

Korea's Focus on Market Dominance, M. Pecht, J. Bernstein, D. Searls and M. Peckerar, Semiconductor International, pp. 118-122, January 1998.

Low Temperature Delamination of Plastic Encapsulated Microelectronics, P. McCluskey, F. Lilie, O. Beysser, and A. Gallo, Proceedings of the 1998 International Acoustic Microimaging Symposium- IAMIS '98, Anaheim, CA, Feb. 26-27, 1998.

Material-Centric Modeling of PWB Fabrication: An Economic and Environmental Comparison of Conventional and Photovia Board Fabrication Processes, P. Sandborn and C. Murphy, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 21, No. 1, pp. 97-110, April 1998.

A Multi-Disciplinary Sophomore Course in Electronics Packaging, J. Morris and P. McCluskey, Proceedings of the IEEE 48^th Electronic Components & Technology Conference, Seattle, Washington, May 25-28, 1998.

Packaging of Electronics for High Temperature Environments, P. McCluskey, D. Das, J. Jordan, L. Condra, T. Torri, J. Fink, and R. Grztbowski, International Journal of Microcircuits and Electronics Packaging, Vol. 20, No. 3, 1998.

Packaging of Power Electronics for High Temperature Applications, P. McCluskey, D. Das, J. Jordan, L. Condra, R. Gryzbowski, T. Torri, and J. Fink, Advanced Microelectronics, Vol. 25, No. 1, pp. 19-24, Jan/Feb 1998.

Packaging Tradeoff Analysis: Predicting Cost and Performance During System Design, P. Sandborn and M. Vertal, IEEE Design & Test of Computers, July-September 1998.

Passive Thermal Control of Electronic Equipment, Y .Joshi, Applied Computation Fluid Dynamics, V. Garg, Ed., Marcel Dekker, Chapter 8, pp. 301-333, 1998.

Performing Design Tradeoffs for Advanced Printed Wiring Boards, P. Sandborn, CircuiTree, Spring 1998.

Performance of a Compact Two-Chamber Two-Phase Thermosyphon: Effect of Evaporator Inclination, Liquid Fill Volume and Contact Resistance, C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Proceedings of the International Heat Transfer Conference, Kyongju, South Korea, 1998.

Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions, P. McCluskey, E. Hakim, J. Fink, A. Fowler, and M. Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 352-360, June 1998.

The Realism of FAA Reliability-Safety Requirements and Alternatives, M. Pecht, J. Boullie, E. Hakim, A. Jain, M. Jackson, I. Knowles, R. Shroeder, A. Strange, and J. Wyler, IEEE AES Systems Magazine, pp. 16-20, February 1998.

Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions, P. McCluskey, E. Hakim, J. Fink, A. Fowler, and M. Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 352-359, June 1998.

Reliability Concerns in High Temperature Electronic Systems, P. McCluskey, R. Grzybowski, L. Condra, D. Das, J. Fink, J. Jordan, and T. Torri, 1998 Engineering Foundation Conference on High Temperature Electronic Materials, Devices and Sensors, San Diego, CA, February 22-27, 1998.

The Role of Physical Implementation in Virtual Prototyping of Electronic Systems, M. Lindell, P. Stoaks, D. Carey, and P. Sandborn, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 21, No. 4, pp. 610-616, December 1998.

Thermal Management of an Avionics Module Using Solid-Liquid Phase Change Materials (PCMs), D. Pal and Y. Joshi, AIAA Journal of Thermophysics and Heat Transfer, Vol. 12, pp. 256-262, 1998.

Why a New Parts Selection and Management Program? B. Foucher, R. Kennedy, N. Kelkar, Y. Ranade, A. Govind, W. Blake, A. Mathur, and R. Solomon, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21, No. 2, pp. 375-378, June 1998.

CAD/E Requirements and Usage for Reliability Assessment of Electronic Products, M. Osterman, T. Stadterman, and R. Wheeler, Advances in Electronic Packaging, EEP-Vol. 19-1, pp. 927-938, 1997.

"Smart" Electronic Systems for Condition-Based Health Management, N. Kelkar, A. Dasgupta, M. Pecht, I. Knowles, M. Hawley, and D. Jennings, Quality and Reliability Engineering International, Vol. 13, pp. 3-7, 1997.

In Situ Study of Solder Paste Behavior during Reflow Using the Hot-Stage Environmental Scanning Electron Microscope, M. Natishan, J. Powell, and K. Beatty, Journal of Electronics Manufacturing, Vol. 7, No. 1, pp. 29-40, March 1997.

Electronic Packaging and Reliability Research and Education for the 21^st Century: the University of Maryland CALCE EPSC Program, Y. Joshi and M. Pecht, Proceedings of the 47th ECTC, San Jose, CA, 1997 ECTC Conference, pp. 585-588, 1997.

A National Course on Thermal Design of Electronic Products: Recent Experiences and a Proposal, Y. Joshi, A. Bar-Cohen, and S. Bhavnani, Proceedings of the 47th ECTC, San Jose, CA, 1997 ECTC Conference, pp. 579-584, 1997.

Accelerated Vibration Life Testing of Electronic Assemblies, T. Stadterman, W. Connon, and D. Barker, Proceedings of Institute of Environmental Sciences, pp. 233-238, 1997.

Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Packages, D. Pal and Y. Joshi, Thermal Management of Electronic Systems II, pp. 227-242, Kluwer Academic Publishers, Leuven, Belgium, 1997.

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study, D. Pal and Y. Joshi, Journal of Electronic Packaging, Transactions of ASME, Vol. 119, pp. 40-50, 1997.

Applications of Wavelets for Cost Effective Vibrational Response Analysis of Electronic Circuit Card Assemblies, P. Dujari, K. Upadhyayula, A. Dasgupta, and B. Balachandran, Experimental/Numerical Mechanics in Electronic Packaging Proceedings, Society of Experimental Mechanics, Bellevue, Washington, June 2-4, 1997.

An Assessment of the Qualified Manufacturer List (QML), M. Pecht, J. Fink, E. Hakim, and J. Wyler, IEEE Aerospace and Electronic Systems, Vol. 12, No. 7, pp. 39-43, July 1997.

Cost Analysis Helpful in Design Planning, P. Sandborn, Electronic Engineering Times, pp. 96, April 14, 1997.

Criteria for the Assessment of Reliability Models, M. Pecht, A. Shukla, N. Kelkar, and J. Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, Vol- 20, No. 3, pp. 229-234, August, 1997.

Electronic Components Obsolescence, L. Condra, A. Anissipour, D. Mayfield, and M. Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 20, No. 3, pp. 368-371, 1997.

Design Assessment of a Pressure Contact Connector System, R. Martens, M. Osterman, and D. Haislet, Circuit World, April 1997.

Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die, C. Murphy, M. Abadir, and P. Sandborn, Journal of Electronic Testing (JETTA), pp. 151-166, 1997.

Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuit, M. Pecht, Y. Ranade, and J. Pecht, Circuit World, Vol. 23, No. 4, pp. 11-15, 1997.

Effects of Orthotropic Thermal Conductivity of Substrates in Natural Convention Cooling of Discrete Heat Sources, E. Yu and Y. Joshi, Numerical Heat Transfer, Vol. 32, pp. 575-593, 1997.

Enabling Early Design for Manufacturability via the Web, P. Sandborn, Duratech Conference, Los Angles, CA, July 1997

An Environmental and Economic Comparison of Additive and Subtractive Approaches for Printed Wiring Board Fabrication, C. Murphy, P. Sandborn, and J. Lott, Proceedings of the IEEE International Symposium on Electronics and the Environment, May 1997.

Evaluating the Cost Impact of Design-for-Environment Decisions Early in the Product Design Cycle, P. Sandborn and C. Murphy, Proceedings of the IPC Works, Washington D.C., pp. S03-9-1 to S03-9-7, October 1997

Experimental Determination of the Shear Modules of Complaint Adhesives Using Single Lap Shear Tests, L. Roy, D. Barker, and H. Tomey, Experimental/Numerical Mechanics in Electronic Packaging, Society of Experimental Mechanics, Vol. 1, pp. 93-101, 1997.

Finite Element Modeling Issues in Thermomechanical Stress Analysis of Surface Mount Interconnects, A. Dasgupta, K. Darbha, P. Haswell, P. Sharma, S. Sealing, and K. Upadhyayula, Presented at the Symposium on Application of FEM and BEM to Electronic Packaging at the 1997 ASME/ASCE/SES Joint Conference, July 1997.

Flat Panel Displays- What is Going on in East Asia Outside Japan, M. Pecht and C. Lee, Circuit World, Vol. 24, No. 1, pp. 20-27, November 1997.

Heat Transfer from Micro-Finned Surfaces to Flow of Fluorinate Coolant in Reduced-Size Channels, H. Mizunuma, M. Behnia, and W. Nakayama, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol. 20, No. 2, pp. 138-145, June 1997.

Hollow Fibers in PCB, MCM-L and PBGA Laminates May Induce Reliability Degradation, A. Shukla, M. Pecht, J. Jordan, K. Rogers, and D. Jennings, Circuit World, Vol. 23, No. 2, pp. 5-6, 1997.

Hollow Fibers in Woven Laminates, A. Shukla, T. Dishongh, M. Pecht, and D. Jennings, Printed Circuit Fabrication, Vol. 20, No. 1, pp. 30-32, January 1997.

How Burn-In Can Reduce Quality and Reliability, J. Jordan, M. Pecht, and J. Fink, The International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 1, pp. 36-40, First Quarter, 1997.

An Incremental Damage Superposition Approach for Interconnect Reliability Under Combined Accelerated Stresses, K. Upadhyayula, and A. Dasgupta, ASME International Mechanical Engineering Congress & Exposition, Dallas, November 16-21, 1997.

In-Situ Measurements of Surface Mount IC Package Deformations During Reflow Soldering, M. Pecht and A. Govind, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part C, Vol. 20, No. 3, pp. 207-212, July 1997.

Integrated Thermal Analysis of Indirect Air-Cooled Electronic Chassis , L. Tang and Y. Joshi, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol. 20, No. 2, pp. 103-110, June 1997.

Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems, V. Adams, D. Blackburn, Y. Joshi, and D. Berning. Presented at the Thirteenth IEEE Semi-Therm Symposium - Part A, Vol. 20, No. 4, pp. 420-431, December 1997.

Kinetic Modeling of Corrosion Film on Unloaded Precious Metal Plated Contacts, M. Sun, S. Javadpour, R. Martens, and M. Pecht, Proceeding of 30^th International Connector & Interconnection Technology Symposium 1997, USA, pp. 227-244, 1997.

Life Prediction Models in Electronic Packaging using Finite Element Analysis and Design of Experiments, S. Sidharth and D. Barker, Experimental/Numerical Mechanics in Electronic Packaging, Society for Experimental Mechanics, Vol. 1, pp. 126-135, 1997.

Liquid Cooling of Electronic Equipment: Where does it Offer Viable Solutions?, W. Nakayama, Advances in Electronic Packaging, ASME, Vol. 2, pp. 2045-2052, 1997.

Manufacturability of Lead-Free Solders, T. Dishongh, C. Tu, and K. Beatty, Second Workshop on Temperature Power Electronics for Vehicles, Adelphi, MD, April 1997.

Material-Centric Process Flow Modeling of PWB Fabrication and Waste Disposal, P. A. Sandborn, J. W. Lott, and C. F. Murphy, Proceedings of IPC Printed Circuits Exposition, pp. S10-4-1 to S10-4-12, March 1997.

Maximizing Yield and Reliability in Surface Mount Manufacturing - Thermal Adhesive Application, J. Powell, E. Beatty, A. Dasgupta, and M. Natishan, Future Circuits International, 1997.

Miscellaneous Modeling Issues in Thermomechanical Stress Analysis of Surface Mount Interconnects, A. Dasgupta, D. Darbha, P. Dujari, P. Haswell, S. Ling, P. Sharma, S. Sealing, and K. Upadhyayula, INTERpack'97, ASME International, Intersociety Electronic and Photonic Packaging Conference, June 1997.

Modeling the Impact of Packaging During High-Level System Design: The Integration of Physical Partitioning into Virtual Prototyping, P. Stoaks and P. Sandborn, Proceedings of the High-Level Electronic Design Conference, San Jose, CA, pp. 197-204, October 1997.

A New Educational Program in Electronic Packaging and Reliability (EPAR), Y. Joshi, D. Barker, and M. Ojalvo, Journal of Engineering Education, Vol. 86, pp. 183-187, April 1997.

A Non-Linear Multi-Domain Thermomechanical Stress Analysis Method for Surface Mount Solder Joints- Part II: Viscoplastic Analysis, S. Ling and A. Dasgupta, ASME Journal of Electronic Packaging, Vol. 119, No. 3, pp. 177-182, September 1997.

Packaging of Electronics for High Temperature Applications, P. McCluskey, D. Das, J. Jordan, R. Grzybowski, J. Fink, L. Condra, and T. Torri, International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3, 3rd Quarter, 1997.

Packaging Geometry Considerations in Thermal Compact Modeling Strategies, V. Adams, D. Blackburn, and Y. Joshi, Eurotherm Seminar, No. 58, Thermal Management of Electronic Systems, Nantes, France, pp. 136-144, September 1997.

Performing Design Tradeoffs for Advanced PWBs, P. Sandborn, IPC National Conference on Organic High Density Interconnect Structures, Santa Clara, CA, pp. 131-149, Nov. 1997.

Perspectives to Understand Risks in the Electronic Industry, A. Dasgupta, E. Magrab, D. Anand, K. Eisinger, J. McLeish M. Torres, P. Lall, and T. Dishongh, IEEE Transaction on Components Packaging and Manufacturing Technology - Part A, Vol. 20, No. 4, pp. 542-547, December 1997.

Plastic-Encapsulated Microcircuits (PEMs): Long-Term Dormancy Studies, E. Hakim, J. Fink, S. Tam, P. McCluskey, and M. Pecht, Circuit World, Vol. 23, No. 4, pp. 26-29, 1997.

Popcorning in PBGA Packages During IR Reflow Soldering P. McCluskey, R. Munamarty, and M. Pecht, Microelectronics International, pp. 20-23, January 1997.

Procedure for Evaluation of Thermal Management Requirement in a Laser Diode Structure, R. Kamath and P. Mead, Microelectronic Reliability, Vol. 37, No. 12, pp. 1817-1823, 1997.

Pushing the Limit, P. McCluskey and M. Pecht, Advanced Packaging, pp. 36-39, January 1997.

Reducing Time-to-Market Using Virtual Qualification, P. McCluskey, M. Pecht and S. Azarm, Proceedings, Institute of Environmental Sciences, pp. 148-152, 1997.

Reliability Assessment of a Plastic Encapsulated RF Switching Device, R. Mahajan and M. Pecht, Microelectronics Reliability, Vol. 38, pp. 1607-1610, December 1997.

"Smart" Electronic Systems for Condition-Based Health Management, N. Kelkar, A. Dasgupta, M. Pecht, I. Knowles, M. Hawley, and D. Jennings, Quality and Reliability Engineering International, Vol. 13, pp. 3-7, 1997.

Stress Analysis of Surface-Mount Interconnects Under Vibrational Loading, K. Darbha, S. Ling, and A. Dasgupta, ASME Journal of Electronic Packaging, September 1997.

System-Level Impact of Early Packaging Decisions, C. Palesko and P. Sandborn, Proceedings of INTERpack, June 1997.

Temperature as a Reliability Factor, M. Pecht, P. Lall, and E. Hakim, Thermal Management of Electronic System II, Kluwer Academic Publishers, Belgium, pp. 27-41, 1997.

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects Without Underfill, K. Darbha, J. Okura, A. Dasgupta, and M. Caers, ASME Winter Annual Conference: 9th Symposium on Mechanics of Surface Mount Assemblies, November 1997.

Thermomechanical Stress Analysis of BGA Interconnects Using the MDRR Technique, S. Ling and A. Dasgupta, Advanced Electronic Packaging, pp. 1109, 1997.

Uprating Electronic Components for Use Outside Their Temperature Specification Limits, M. Wright, D. Humphrey, and P. McCluskey, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 20, No. 2, pp. 252-256, June 1997.

Characterizing the Commercial Avionics Thermal Environment for Field Reliability Assessment, K. Cluff, D. Barker, D. Robbins, and T. Edwards Proceedings-Institute of Environmental Sciences, pp. 50-57, 1996.

An integrated surface mount virtual factory based on mechanistic process simulations Part I - Overall Approach, Y .Joshi et al., ASME Winter Annual Meeting Conference, Atlanta, Georgia, Nov. 17-22, 1996.

An integrated surface mount virtual factory based on mechanistic process simulations Part II - Examples of Virtual Factory Models for Surface Mount Manufacturing, Y .Joshi et al., ASME Winter Annual Meeting Conference, Atlanta, Georgia, Nov. 17-22, 1996.

Accelerated Life Test Development for Combined Stresses, K. Upadhyayula and A. Dasgupta, VIII International Congress on Experimental/Numerical Mechanics in Electronic Packaging, Sponsored by Society of Experimental Mechanics, Nashville, TN, pp. 35-36, June 10-13, 1996.

Accelerated Testing of CCAs Under Combined Temperature-Vibration Loading, K. Upadhyayula and A. Dasgupta, Workshop on Accelerated Stress Testing, Sponsored by IEEE Components, Packaging, and Manufacturing Technology Society, Ottawa, Canada. October 17-18, 1996.

A Comparison of Routing Estimation Methods for Microelectronic Modules, P. Sandborn and P. Spletter, Proceedings of the International Electronic Packaging Conference, pp. 651-663, Sept-Oct, 1996.

Air Cooling of a Component Mounted on a Vertical Substrate in a Vented Enclosure by Combined Conduction, Natural Convection and Radiation, E. Yu and Y. Joshi, Presented at the ASME International Mechanical Engineering Congress and Exhibition, Atlanta, GA, November 1996.

Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation, E. Yu and Y. Joshi, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, Atlanta, GA, HTD-Vol. 333, pp. 323-330, Nov. 1996.

Application of Phase Change Materials for Passive Thermal Control of Plastic Quad Flat Packages: A Computational Study, D. Pal and Y. Joshi, Numerical Heat Transfer - Part A, Vol. 30, pp. 19-34, 1996.

Characterizing the Commercial Avionics Thermal Environment for Field Reliability Assessment, K. Cluff, D. Barker, D. Robbins and T. Edwards, Proceedings-Institute of Environmental Sciences, pp. 50-57, 1996.

Comparison Between Repetitive and Electrodynamic Vibration Test Machines for Accelerated Stress Application, P. Dujari, A. Dasgupta, and B. Balachandran, Workshop on Accelerated Stress Testing, Sponsored by IEEE Components, Packaging, and Manufacturing Technology Society, Ottawa, Canada, October 17-18, 1996.

Conjugate Heat Transfer from a Single Surface-Mounted Block of Forced Convective Air Flow in a Channel, W. Nakayama and S. Park, ASME Journal of Heat Transfer, Vol. 118, pp. 301-309, 1996.

Cost and Environmental Metrics for a High Density Laminate Technology, C. Murphy and P. Sandborn, Proceedings of the Sixteenth International Electronics Manufacturing Technology Symposium (IEMT), Austin, TX, Oct. 1996.

A Crack-Qualification Procedure for SMDs, R. Gannamani and R. Munamarty, SMT, pp. 52-53, April 1996.

The Effect of Wipe on Corroded Nickel Contacts, R. Martens and M. Pecht, Conference on Electrical Contacts. Joint with the 18th International Conference on Electrical Contacts, pp. 342-351, New York, NY, 1996.

Elastic, Plastic and Cracking Indentation Behavior of Silicon Crystals, R. Armstrong, A. Ruff, and H. Shin, Materials Science and Engineering,  Elsevier, A209, pp. 91-96, 1996.

Electronic Assemblies, M. Pecht, D. Burkus and S. Bhagath, Handbook of Manufacturing Engineering, Marcel Dekker, Chapter 22, pp. 1027-1092, New York, NY, 1996.

Electronic Hardware Reliability, M. Pecht and I.M. Bordelon, The Electronics Handbook, CRC Press, Boca Raton, FL, pp. 2160-2170, 1996.

The Emergence of "Physical Synthesis" - Optimization of a System's Physical Implementation During Design Planning, P. Sandborn, C. Palesko, D. Gullickson, and K. Drake, Proceedings ACM/SIGDA Physical Design Workshop, pp. 228-233, 1996.

An Experimental Study of Popcorning in Plastic Encapsulated Microcircuits, R. Gannamani and M. Pecht, IEEE Transactions on CPMT - Part A, Vol. 19, No. 2, pp. 194-201, June 1996.

Forced Convection Air Cooling of a Commercial Electronic Chassis: An Experimental and Computational Case Study, C. Argento, Y. Joshi, and M. Osterman, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 19, No.2, pp. 248-257, June 1996.

Framework for an Objective and Process Based Reliability Program Standard, A. Malhotra, A. Strange, L. Condra, I. Knowles, T. Stadterman, J. Boivin, A. Walton, and M. Jackson, Communications in RMSL, pp. 25-30, January 1996.

Heat Transfer from an Array of Strips to Fluorinert Coolant in Mixed Impinging-Jet/Channel-Flow Configuration, W. Nakayama, M. Behnia, H. Mishima, and H. Sun, ASME Journal of Electronic Packaging, Vol. 118, pp. 31-36, 1996.

Heat Transfer from Grooved Surfaces to Flow of Fluorinert Coolant in Reduced-Size Channels, H. Mizunuma, M. Behnia, and W. Nakayama, ITHERM '96, Orlando, FL, pp. 274-283, May 29 - June 1, 1996.

How Burn-in Can Reduce Quality and Reliability, J. Jordan and M. Pecht, Proceedings-Institute of Environmental Sciences, pp. 16-19, 1996.

An Integrated Surface-Mount Virtual-Factory Based on Mechanistic Process Simulations: Part I - Overall Approach, K. Darbha, A. Poddar, C. Ramaswamy, C. Sealing, L. Tang, K. Upadhayayula, A. Dasgupta, and Y. Joshi. ASME International Mechanical Engineering Congress and Exhibition, Atlanta, GA, November 1996.

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure, L. Tang and Y. Joshi. Proceedings of the National Heat Transfer Conference Vol. 329, pp. 211-217, Aug. 1996.

Issues Affecting Early Affordable Access to Leading Electronics Technologies by the US Military and Government, M. Pecht, Circuit World, Vol. 22, No. 2, pp. 7-15, 1996.

Integrated Thermal Analysis of Indirect Air-Cooled Electronic Chassis, L. Tang and Y. Josh, I-Therm '96, Proceedings of the 5th Intersociety Conference on Thermal Phenomena in Electronic Systems, pp. 217-225, Orlando, FL, May 1996.

Life Cycle Approach to Design and Manufacturing Simulation of Multi-Chip Modules, M. Pecht and P. Lall, International Journal of Modelling and Simulation, Vol. 16, No. 4, pp. 173-183, 1996.

Life Test Development for Combined Stresses, K. Upadhyayula and A. Dasgupta, VIII International Congress on Experimental/Numerical Mechanics in Electronic Packaging, Sponsored by Society of Experimental Mechanics, Nashville, TN, pp. 35-36, June 10-13, 1996.

Linking System Design to Manufacturing, P. Sandborn, Printed Circuit Fabrication, Vol. 20, No. 3, pp. 32-37, March 1997.  Also in the Proceeding IPC National Conference on Solutions for Ultra High Density PWBs, Los Angeles, CA, October 1996.

Natural Convection From a Horizontal Printed Circuit Board in an Enclosure, S. Vikram and Y. Joshi, Proceedings of the 9th International Symposium on Transport Phenomena in Thermal Engineering, Singapore, Vol. 1, pp. 486-491, June 25-28, 1996.

A Nonlinear Multi-Domain Stress Analysis Method for Surface-Mount Solder Joints, S. Ling and A. Dasgupta, Journal of Electronic Packaging, Vol. 118, No. 2, pp. 72-79, June 1996.

Optimizing the Design of High-Density Systems, P. Sandborn, Electronic Packaging & Production, pp. 53-60, September 1996.

Optimum Processing Prevents PQFP Popcorning, P. Yalamanchili, R. Gannamani, R. Munamarty, P. McCluskey and A. Christou, Surface Mount Technology: Supplemental Guide to Soldering, pp. 9, January 1996.

Packaging Reliability for High Temperature Electronics: A Materials Focus, P. McCluskey, L. Condra, T. Torri and J. Fink, Microelectronics International, No. 41, pp. 23-26, September 1996.

Design for Environment - A Survey of Current Practices and Tools C. Mizuki, P. A. Sandborn, and G. Pitts, G., Proceedings of IEEE International Symposium on Electronics and the Environment, pp. 1-6, May 1996.

Performing Design for Environment Concurrent with Interdisciplinary Tradeoff Analysis of Electronic Systems, P. Sandborn and G. McFall, Proceedings of IEEE International Symposium on Electronics and the Environment, pp. 167-172, May 1996.

Phenomenological Reliability Modeling of Plastic Encapsulated Microcircuits, N. Kelkar, A. Fowler, M. Pecht, and M. Cooper, ISHM International Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 1, pp. 3-13, 1996.

Physics-of-Failure Methodology for Thermal Cycling of Solder Joints, T. Rothman, A. Dasgupta and P. Tsai, VIII International Congress on Experimental/Numerical Mechanics in Electronic Packaging, Sponsored by Society of Experimental Mechanics, Nashville, TN, pp. 76-77, June 10-13, 1996.

Plastic Encapsulated Microelectronics, M. Pecht, Engineering Magazine, pp. 22-23, September, 1996.

Plastic Encapsulated Microcircuit Reliability & Cost-Effectiveness Study, D. Emerson, E. Hakim, and A. Govind, IEEE Transactions on Reliability, Vol. 45, No. 1, pp. 19-22, March 1996.

Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages, R. Munamarty, P. McCluskey, M. Pecht, and L. Yip, Soldering & Surface Mount Technology, No. 22, pp. 46-50, February, 1996.

Popcorning in PBGA Packages During IR Reflow Soldering, Microelectronics International, No. 42, pp. 20-23, 1996.

Popcorning in Plastic Ball Grid Arrays During IR Reflow Soldering, P. McCluskey, R. Munamarty, and M. Pecht, Proceedings of the International Acoustic Micro Imaging Symposium, San Diego, CA, pp. 46-50, Jan. 1996.

Prospects for Taiwan's Electronic Components Industry, M. Pecht, and C. Lee, Solid State Technology, pp. 11-14, November 1996.

Reliability Assessments of Fielded Plastic and Hermetically Packaged Microelectronics, B. Johnson, and V. Verma, IEEE Transactions on Reliability, Vol. 45, No. 1, pp. 23-26, March 1996.

Reliability of Surface Mount Capacitors Subjected to Wave Soldering, T. Panchwagh and P. McCluskey, International Journal of Microelectronics Packaging, Vol. 2, No. 1, February 1996.

The Role of Heat Transfer Analysis in Avionics Equipment Development, D. Das and M. Pecht, ASME Proceedings of the 32nd National Heat Transfer Conference, Vol. 7, HTD-Vol. 329, pp. 197-209, August. 1996.

Smart Electronic Systems for Condition-Based Health Management, N. Kelkar, A. Dasgupta, M. Pecht, I. Knowles, M. Hawley, and D. Jennings Proceedings of 9th International Congress and Exhibition on Condition Monitoring and Diagnostic Engineering Management (COMADEM), Sheffield, UK, pp. 591-601, July 1996.

Software for Reliability Assessment of Electronic Components, Circuit Cards and Equipment, P. McCluskey, M. Pecht, and M. Osterman, Proceedings of the Second International Symposium on Electronic Packaging Technology, Shanghai, China, pp. 472-483, December 9-12, 1996.

Temperature Cycling of Gold to Gold Pressure Contact Connector System, R. Martens, M. Osterman, and D. Haislet, 1996 Annual Connector and Interconnection Technology Symposium, Boston, MA, pp. 409-420, September. 16-18, 1996.

Thermal Management of Electronic Equipment: Research Needs in the Mid 1900s and Beyond, W. Nakayama, ASME Applied Mechanics Reviews, Vol. 49, No. 10, Part 2, pp. 5167-5174, October 1996.

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components Peripheral Leaded Components, S. Sidharth and D. Barker, ASME Journal of Electronic Packaging, Vol. 118, pp. 224-249, December 1996.

Why the Traditional Reliability Prediction Models Do Not Work - Is There an Alternative?, M. Pecht, Electronics Cooling, Vol. 2, pp. 10-12, January 1996.

Accelerated Stress Testing of Surface Mount Solder Joints: A Case Study, T. Rothman, A. Dasgupta, and M. Binder, 41st Annual Conference, Institute of Environmental Sciences, Anaheim, CA, May 1995.

Addressing Defect-Related Reliability and Screening Levels Through Physics of Failure Analysis, R. Bauernschub and P. Lall, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 635-645, March 26-30, 1995.

Advisors Can Ease Physical Design, P. Sandborn, Electrical Engineering Times, June 12, 1995.

Application of Line Modified-Asymmetric Crystal Topography for Qualitative and Quantitative Evaluation of Integrated Circuits, K. Green, W. Beard, X. Zhang, and R. Armstrong, Advanced in X-Ray Analysis, Vol. 38, 1995.

Application of Phase Change Materials for Passive Thermal Control of Plastic Quad Flat Packages (PQFP): A Computational Study, D. Pal and Y. Joshi. Proceedings of Semi-Therm 1995, San Jose, CA, pp. 65-71, February 1995.

Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package, D. Pal and Y. Joshi, Eurotherm Seminar No. 45, Thermal Management of Electronic Systems, Leuven, Belgium, September 1995.

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study, D. Pal and Y. Joshi, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 1307-1315, March 26-30, 1995.

An Approach to Simplify Thermal Modeling of Natural Convection Cooled Electronic Equipment, V. Maudgal and Y. Joshi, Proceedings of 45th Electronic Components & Technology Conference, Las Vegas, NV, May 1995.

The Aries Project for Rule-Based-Design Knowledge Acquisition, K. Richter, C. Grewe, A. Hashmi, D. Hoffman, R. Johnson, and D. Ott, Institute for Defense Analyses, IDA Paper P-3074, June 1995.

Beyond the Qualified Manufacturer List (QML), E. Hakim, C. Rust, and W. Olsson, Proceedings Annual Reliability and Maintainability Symposium, Washington DC, pp. 362-369, January 16-19, 1995.

Characterization of Functional Relationship Between Temperature and Microelectronic Reliability, P. Lall, M. Pecht, and E. Hakim, Microelectronics and Reliability, Vol. 35(3), pp. 377-402, March 1995.

Computations of Solid/Liquid Phase Change in a Three-Dimensional Enclosure by a Uniformly Dissipating Heat Source, D. Pal and Y. Joshi, ASME National Heat Transfer Conference, Portland, OR, August 1995.

Computations for a Three-by-three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity, D. Mukutmoni, Y. Joshi, and M. Kelleher, Journal of Electronic Packaging Transactions of the ASME, Vol. 117, pp. 294-300, December 1995.

Consideration of Component Failure Mechanisms in the Reliability Assessment of Electronic Equipment Addressing the Constant Failure Rate Assumption, D. Mortin, J. Krolewski, and M. Cushing, 1995 Proceedings Annual Reliability and Maintainability Symposium, 1995.

Control of Popcorning by Using Optimized Process Conditions, P. McCluskey, 1995 Advanced Technology Acquisition, Qualification & Reliability Workshop, August 1995.

Does the Cooling of Electronics Increase Reliability?, A. Dasgupta and M. Pecht, Proceedings of Thermal Stresses '95 Conference, No. 231, 1995.

The Effect of Manufacturing and Design Process Variabilities on the Fatigue Life of the High Density Interconnect Vias, A. Ogunjimi, S. MacGregor, M. Pecht, and J. Evans, Journal of Electronics Manufacturing, Vol. 5, No. 2, pp. 111-119, June 1995.

Elastic/Plastic Effects During Very Low-load Hardness Testing of Copper, R. Armstrong, H. Shin, and A. Ruff, Acta metall.mater., Vol. 43, No. 3, pp. 1037-1043, 1995.

Electrochemical Migration in Multichip Modules, B. Rudra, M. Li, M. Pecht, and D. Jennings, Circuit World, Vol. 22, No. 1, pp. 67-70, 1995.

Electronic Box-level Reliability Assessment Using Computer Modeling and Simulation, D. Barker, A. Chiang, J. Krolewski, and M. Cushing, Proceedings Annual Reliability & Maintainability Symposium, 1995, pp. 49-53, January 1995.

Electronic Packaging, M. Pecht and P. McCluskey, CALCE EPRC.

Electronic Packaging and Reliability Research at the University of Maryland, M. Ojalvo, International Journal of Microelectronic Packaging, Vol. 1, pp. 35-42, 1995.

Environmental Scanning Electron Microscope, M. Li, K. Rogers, and C. Rust, Advanced Materials & Processes, pp. 24-25, July 1995.

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages, J. Li and M. Pecht, Journal of Electronic Packaging Transactions of ASME, Vol. 117, pp. 225-229, September 1995.

Experimental and Numerical Studies on Three-Dimensional GTA Weldpool Convection: Non-Axis Symmetric Effects, Y. Joshi, P. Dutta, P.E. Schupp, and D. Espinosa, 1995 ASME Winter Annual Meeting, San Francisco, CA, November 1995.

Exploratory Research on Non-Thermal Damage due to Electronics from Fires and Fire-Suppression Agents, F. Mowrer, and M. Pecht, 1995 Proceedings Annual Reliability and Maintainability Symposium, pp. 1-6, January 1995.

Foundational Issues Concerning the Analysis of Censored Data, R. Barlow and P. Tsai, Lifetime Data Analysis, Vol. 1, No. 1, pp. 27-34, 1995.

Framework for a Dual-Use Standard for Reliability Program, I. Knowles, A. Malhotra, R. Munamarty, and T. Stadterman, Proceedings of 1995 Annual Reliability & Maintainability Symposium, pp. 481-493, January 1995. Proceedings of 1995 Annual Reliability & Maintainability Symposium, pp. 144-151, January 1995.

A Generalized Multi-Domain Approach for Thermo-Mechanical Stresses in J-Lead Solder Joints: Elastic Analysis, S. Ling and A. Dasgupta, ASME Interpack'95, Maui, HI, May 1995.

Heat Transfer Engineering in Systems Integration: Outlook for a Closer Coupling of Thermal and Electrical Designs of Computers, W. Nakayama, IEEE Transfer Components, Packaging, and Manufacturing Technology - Part A, Vol. 18, No. 4, pp. 818-826, 1995.

Impact of Packaging Technology on System Partitioning:  A Case Study, P. Dekhordi, K. Ramamurthi, D. Bouldin, H. Davidson, and P. Sandborn, Proceedings of the IEEE Multichip Module Conference, Santa Cruz, CA, February. 1995.

An Integrated Design Environment for Printed Wiring Boards, M. Rosman and M. Osterman, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 149-157, March 26-30, 1995.

A Layer-Wise Analysis for Free Vibration of Thick Composite Cylindrical Shells, K. Huang and A. Dasgupta, Journal of Sound and Vibration, Vol. 186, No. 2, pp. 207-222, 1995.

Long Term Storage Reliability of Plastic Encapsulated Microcircuits, A. Fowler, P. McCluskey, and K. Rogers, Proceedings of 1995 Advanced Technology, Acquisition, Qualification, and Reliability Workshop, Newport Beach, CA, pp. 269-278, August 1995.

Magnetostrictive Constitutive Properties: What is Available and What is Needed, K. Kannan and A. Dasgupta, ASME Summer Meeting, Los Angeles, CA, June 1995.

Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part II - Creep Model and Life Calculation, V. Gupta, D. Barker, and A. Dasgupta, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 1043-1057, March 26-30, 1995.

Multichip Modules, Design, Fabrication, and Testing, P. Sandborn and M. Abadir, chapter in Multichip Module Design, J. J. Licari editor, McGraw-Hill, Inc., pp. 21-78, 1995.

A Multi-Domain Stress Analysis Method for Surface-Mount Solder Joint, S. Ling and A. Dasgupta, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 991-1000, March 26-30, 1995.

Natural Convection from an Array of Electronic Packages Mounted on a Horizontal Board in a Narrow Aspect Ratio Enclosure, V. Adams, Y. Joshi, and D. Blackburn, Second ISHMT-ASME Heat and Mass Transfer Conference, Surathkal, India, December. 1995.

A New Graduate Program in Electronic Packaging and Reliability (EPAR), Y. Joshi and D. Barker, Eleventh Biennial University/Government/Industry Microelectronics Symposium, Austin, TX, May 1995.

Nonlinear Finite Element Analysis Results for Magnetostrictive Smart Structures, K. Kannan and A. Dasgupta, Second Workshop on Smart Structures and Materials, Sponsored by ARO, UMCP, September 5-7, 1995.

A Non-Linear Multi-field Stress Analysis Model for Solder Joint Interconnect, S. Ling and A. Dasgupta, ASME International Mechanical Engineering Congress, San Francisco, CA, November. 1995.

A Numerical Study of Three Dimensional Laminar Natural Convection in a Vented Enclosure, E. Yu and Y. Joshi, ASME National Heat Transfer Conference, Portland, OR, August 1995.

Optimum Processing Prevents PQFP Popcorning, P. Yalamanchili, R. Gannamani, R. Munamurty, P. McCluskey, and A. Christou, Surface Mount Technology, May 1995.

The Physics of Conductive Filament Formation in MCM-L Substrates, M. Li, M. Pecht, and L. Wang, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 517-527, March 26-30, 1995.

Physics-of-Failure: An Approach to Reliable Product Development, M. Pecht and A. Dasgupta, Journal of the Institute of Environmental Sciences, Vol. 38, pp. 30-34, September/October 1995 also in 1995 International Integrated Reliability Workshop Final Report, Lake Tahoe, CA, pp. 1-4, October 22-25, 1995.

A Physics-of-Failure Design Philosophy Applied to Flip-Chip Bonds, C. Pusarla, A. Dasgupta, M. Pecht, and A. Christou, Microelectronics International, No. 36, pp. 6-12, January 1995.

Popcorning in Full and Perimeter Array PBGA Packages During IR Reflow, P. McCluskey, Area Array Packaging Conference, Berlin, Germany, November 1995.

Popcorning in Plastic Ball Grid Arrays During IR Reflow Soldering, P. McCluskey, R. Munamarty, and M. Pecht, IAMIS'95, San Diego, CA, January 27, 1995.

Qualifying Plastic Encapsulated Microcircuits Against Popcorning, R. Gannamani, R. Munamarty and P. McCluskey, Proceedings of 1995 Advanced Technology, Acquisition, Qualification, and Reliability Workshop, Newport Beach, CA, pp. 185-194, August 1995.

Relative Humidity Cycle Testing on GE-HDI, M. Li, X. Wu, M. Pecht, K. Paik, and E. Bernard, International Journal of Microelectronic Packaging, Vol. 1, pp. 13-34, 1995.

Reliability Issues in Micro Integrated Smart Material Systems, A. Dasgupta, SPIE Conference, Williamsburg, VA, 1995.

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors, G. Ganguly and A. Dasgupta, Journal of Electronic Packaging Transactions of the ASME, Vol. 117, pp. 147-152, December. 1995.

A Reliability Study of Fuzz Button Interconnects, D. Harris and M. Pecht, Circuit World, Vol. 21, No. 2, pp. 12-18, 1995.

Response of Adaptive Structures with Embedded Mini-Actuators, A. Alghamdi and A. Dasgupta, Second Workshop on Smart Structures and Materials, Sponsored by ARO, UMCP, September 5-7, 1995.

Simulation of the Influence of Manufacturing Quality on Reliability of Vias, A. Dasgupta and V. Ramappan, Journal of Electronic Packaging Transactions of the ASME, Vol. 117, pp. 141-146, December 1995.

Software Environment for Reliability Assessment of Advanced Interconnect Technologies, J. Evans, A. Prabhu, and A. Dasgupta, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 317-324, March 26-30, 1995.

Software as a Method of Technology Transfer, M. Osterman, D. Morton, P. Jackson, M. Rosman, and D. Hoffman, Proceedings of the University Government Industry Microelectronics Symposium, Austin, TX, pp. 6-11, May 16-17, 1995.

The State/Industry/University Cooperative Research Center Experience, C. Rust and M. Ojalvo, Technology Transfer Society Proceedings, pp. 48-53, July 16-19, 1995.

Success Factors in the Japanese, Malaysian and Taiwanese Electronic Industry, M. Pecht, CicuiTree, March 1995.

Temperature as a Reliability Factor, M. Pecht, P. Lall, and E. Hakim, Eurotherm Seminar No. 45 : Thermal Management of Electronic Systems , pp. 36.1-36.22, 1995.

Test-Time Compression for Qualification Testing of Electronic Systems: A Case Study, J. Hu, A. Dasgupta, and T. Rothman, Proceedings of the Annual Reliability & Maintainability Symposium, pp. 246-252, January 1995.

A Thermo-Mechanical Fatigue Analysis of High Density Interconnect Vias, A. Prabhu, D. Barker, M. Pecht, J. Evans, W. Grieg, E. Bernard, and E. Smith, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 187-216, March 26-30, 1995.

To Cut or Not to Cut: A Thermomechanical Stress Analysis of Polyimide Thin-Film on Ceramic Structures, M. Pecht, X. Wu, K. Paik, and S. Bhandarkar, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B, Vol. 18, No. 1, pp. 150-153, February 1995.

Tradeoff Analysis and Partitioning in Multiple Board/MCM Systems, P. Sandborn and A. Parikh, Proceedings of the International Conference and Exposition on Multichip Modules, pp. 401-406, April 1995.

Transferring Electronic Packaging Research Results, M. Ojalvo and C. Rust, Research Transformed into Practice, edited by J. Colville and M. Amde, ASCE Press, New York, pp. 1-13, 1995.

The Transition from Statistical-Field Failure Based Models to Physics-of-Failure Based Models for Reliability Assessment of Electronic Packages, T. Stadterman, M. Cushing, B. Hum, A. Malhotra, and M. Pecht, Proceedings of the INTERpack'95, Lahaina, Maui, HI, pp. 619- 625, March 26-30, 1995.

Tutorial - Electrical Overstress and Electrostatic Discharge, C. Diaz, S. Kang, and C. Duvvery, Modeling of Electrical Overstress in Intergrated Circuits.

Understanding and Solving the Real Reliability Assurance Problems, M. Pecht, F. Nash, and J. Lory, Proceedings of the Annual Reliability & Maintainability Symposium, pp. 159-161, January 1995.

A PoF Approach to Addressing Defect-related Reliability, R. Bauernschub and P. Lall, IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 38-49, 1994.

Analyzing Multichip Module Testing Strategies, M. Abadir, A. Parikh, P. Sandborn, K. Drake, and L. Bal, IEEE Design & Test of Computers, Vol. 11, No. 1, pp. 40-52, Spring 1994.

Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates, B. Rudra, M. Pecht, and D. Jennings, IEEE Transactions on Components, Packaging and Manufacturing Techniques - Part B, Vol. 17, No. 3, pp. 269-276, August 1994.

Characterization of Polyimides Used in GE-HDI Density Interconnects, M. Pecht and X. Wu, 7th International SAMPE Electronics Conference, pp. 432-445, June 20-23, 1994.

Characterization of Polyimides Used in High Density Interconnects, M. Pecht and X. Wu, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, Vol. 17, No. 4, pp. 632-639, December 1994.

A Framework for Reliability Modeling of Electronics, E. Hakin, M. Osterman and C. Rust, Proceedings of the Digital Technology for the Tactical Communicator., Tactical Communications Conference, Vol. 1, pp. 317-324, May 10-12, 1994.

Computational Methods to Address Reliability of Electronic Packaging, Computational Mechanics for Electronic Devices/Components, M. Pecht, A. Dasgupta, A. Ogunjimi, and J. Evans, Proceedings of the International Symposium on Highly Advanced Computing, Chiba, Japan, pp. 145-176, August 4-5, 1994.

Conceptual Design of Multichip Modules and Systems, P. Sandborn and H. Moreno, Kluwer Academic Publishers, 1994.

C-SAM Sounds the Warning for IC Packaging Defects, P. Yalamanchili, A. Christou, and S. Martel, IEEE Circuits & Devices, pp. 36-41, July 1994.

The Demise of Plastic Encapsulated Microcircuit Myths, E. Hakim, R. Agarwal, and M. Pecht, 5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Glasgow, Scotland, Oct. 6, 1994; also Proceedings of NATO Advisory Group for Aerospace Research and Development, Avionic Panel on Advanced Packaging Concepts for Digital Avionics, San Diego, CA, June 8, 1994.

Development of an Alternative Wire Bond Test Technique, P. Lall, M. Pecht, and D. Barker, Proceedings of the 1994 Institute of Environmental Sciences Annual Technical Meeting , Vol. 2, pp. 22-27, May 1994; also 13th IEEE International Electronics Manufacturing Technology Symposium, pp. 283-287, 1992.

Development of an Alternative Wire Bond Test Technique, P. Lall, M. Pecht, and D. Barker, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 17, No. 4, pp. 610-615, December 1994.

Development of an Automated Contact Resistance Probe, M. Ranganthan and M. Pecht, 27th Annual Connector and interconnection Symposium and Trade Show, IICIT, Inc., Boston, MA. Vol. 1D, pp. 369-375, September 19-24, 1994.

Effect of Temperature and Humidity Cycling on FR-4, Bismaleide Triazine and Cyanate Ester Printed Wiring Boards, M. Li, K. Gohari, and M. Pecht, 7th International SAMPE Electronics Conference - Critical Materials Processing in a Changing World, pp. 446-457, June 20-23, 1994.

Effective Thermomechanical Behavior of Plain-Weave Fabric - Reinforced Composites Using Homogenization Theory, A. Dasgupta and S. Bhandarkar, Journal of Engineering Materials and Technology, Vol. 116, pp. 99-105, Jan. 1994.

Electronic Materials, M. Pecht and A. Prabhu, Encyclopedia of Chemical Technology, 4th edition, edited by J. Kroschwitz, John Wiley Publishing Co., New York, NY, pp. 1024-1048, 1994.

Electronic Module Technology, P. Sandborn and D. Herrell, Physical Architecture and Packaging of Microelectronic Systems, R. Hannemann, A. Kraus and M. Pecht editors, John Wiley & Sons, Inc, New York, NY, pp. 189-249, 1994.

Enhancing the Competitiveness of U.S. Electronic Packaging Industries, DoE NASA, the U.S. Trade Representative, the Office of Management and Budget, the Council of Economic Advisors, Office of S/T Policy, the Security Council, and National Economic Council.

Failure Mechanism Models for Electromigration, D. Young and A Christou, IEEE Transactions on Reliability, Vol. 43, No. 2, June 1994.

Failure Mechanism Models for Material Aging Due to Inter-Diffusion, J. Li and A. Dasgupta, IEEE Transactions on Reliability, Vol. 43, No. 1, March 1994.

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals, B. Mathieu and A. Dasgupta, ASME Journal of Electronic Packaging, Vol. 116, pp. 98-104, June 1994.

High Level Test Economics Advisor (Hi-TEA), M. Abadir, A. Parikh, L. Bal, C. Murphy, and P. Sandborn, Journal of Electronic Testing (JETTA), Vol. 5, No. 2/3, pp. 195-206, May/August 1994

Introducing a Theory for the General Solution of Steiner's Problem in Manhattan Space, W. Wong and M. Pecht, Proceedings of the First International Symposium on Microelectronic Package and PCB Technology, Beijing, China, pp. 114-115, September 19-23, 1994.

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic, J. Hu, D. Barker, R. Ghoshtagore and M. Pecht, Transaction of the ASME, Vol. 116, pp. 148-153, June 1994.

JTEC Panel Report on Electronic Manufacturing and Packaging in Japan, M. Pecht, 6th International Electronics Manufacturing Technology Symposium, La Jolla, CA, pp. 96-102, September 12-14, 1994.

Liquid Flow-Through Cooling of Electronic Modules, S. Sridhar, M. Osterman, J. Carbonell and K. Herold, AGARD Conference Proceedings 562 for the Avionics Panel Symposium, San Diego, CA, Vol. 17, No. 1-6, October 1994.

Management of Design Activities in a Concurrent Engineering Environment, B. Pourbabai and M. Pecht, International Journal of Production Research, Vol. 32, No. 4, pp. 821-832, 1994.

Modeling PTH Damage Caused by Insertion Mount Connectors, G. Ganguly and A. Dasgupta, Presented at 1994 International Mechanical Engineering Congress and Exhibition of the Winter Annual Meeting, November 6-11, 1994.

Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I - Elastic Plastic Stress Model, V. Gupta, and D. Barker, Presented at 1994 International Mechanical Engineering Congress and Exhibition of the Winter Annual Meeting, November 6-11, 1994.

Multichip Systems Tradeoff Analysis Tool, P. A. Sandborn, R. Ghosh, K. Drake, M. Abadir, L. Bal, and A. Parikh, Journal of Electronic Testing (JETTA), Vol. 5, nos. 2/3, pp. 207-218, May/August 1994.

Natural Convection Heat Transfer from an Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Liquid, Y. Joshi, M. Kelleger, M. Powell, and E. Torres, Transactions of the ASME, Vol. 116, June 1994.

A Physics-of-Failure Approach to Addressing Defect Related Reliability, R. Bauernschub, P. Lall and M. Pecht, 6th International Electronics Manufacturing Technology Symposium, La Jolla, CA, pp. 38-49, September 12-14, 1994.

A Physics-of-Failure Approach to Addressing Device Reliability in Accelerated Tests, P. Lall and M. Pecht, 5th European Symposium on Reliability of Electron Devices Failure Physics and Analysis, 1994.

A Physics-of-Failure Approach to Addressing Device Reliability in Accelerated Testing of MCMs, J. Evans, M. Cushing, P. Lall, and R. Bauernschub, MCM Conference, Santa Cruz, 1994.

Physics-of-Failure Approach to Design and Reliability Assessment of Microelectronic Packages, M. Pecht, Proceedings of the First International Symposium on Microelectronic Package and PCB Technology, Beijing, China, pp. 175-180, September 19-23, 1994.

Predicting the Reliability of Electronic Equipment, M. Pecht and F. Nash, Proceedings of the IEEE, Vol. 82, (7), pp. 992-1004, July 1994.

Probing Connector Reliability, S. Bhagath and M. Pecht, Connector Specifier, pp. 32-34, June 1994.

Simulation of the Influence of Manufacturing Quality on Reliability of Vias, V. Ramappan and A. Dasgupta, ASME - Congress and Exhibition of the Winter Annual Meeting, November 6-11, 1994.

Stress Analysis of Surface Mount interconnections due to Vibrational loading, K. Darbha, S. Ling and A. Dasgupta, Journal of Electronic Packaging, Vol. 119, p. 183, September 1994.

Technology Application Tradeoff Studies in Multichip Systems, P. A. Sandborn, H. Hashemi, L. Bal, and M. Abadir, IEEE Trans. on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 17, No. 2, pp. 161-169, May 1994.

Temperature Dependencies on Electromigration, Chapter 3, M. Pecht and P. Lall, pp. 79-104, Electromigration and Electronic Device Degradation, edited by A. Christou, John Wiley & Sons, Interscience Division, New York, NY, 1994.

The Tradeoff Between Peripheral and Area Array Bonding of Components in Multichip Modules, P. A. Sandborn, M. Abadir, and C. Murphy, IEEE Trans. on Components, Packaging, and Manufacturing, Vol. 17, No. 2, pp. 249-256, June 1994.

Tutorial: How Radiation Affects Polymeric Materials, M. Al-Sheik and A. Christou, IEEE Transactions on Reliability, Vol. 43, No. 4, December 1994.

Tutorial: Failure-Mechanism Models for Conductive-Filament Formation, B. Rudra and D. Jennings, IEEE Transactions on Reliability, Vol. 43, No. 3, September, 1994.

Using Plastic-Encapsulated Microcircuits in High Reliability Applications, L. Condra, G. Kromholtz, M. Pecht and E. Hakim, Proceedings 1994 Annual Reliability and Maintainability Symposium, pp. 481-493, Jan. 1994.

Microwave Performance of GaAs-on-Si MESFET's with Si Buffer Layers, A. Georgakilas, G. Halkias, A. Christou, C. Papavassiliou, G. Perantinos, G. Kontantinidis, and P. Panayotatos, IEEE Transaction on ELectron Devices, Vol. 40, No. 3, March, 1993.

Advances in the Design and Assessment of Reliable Electronics Using Concurrent Engineering, M. Pecht, Proceedings 47th Mechanical Failure Prevention Group, pp. 51-55, 1993.

Influence of Surface Mount Lead Geometry on Fatigue Life, V. Gupta and D. Barker, ASME Journal of Electronic Packaging, Vol. 116, pp. 157-160, June 1994; also ASME Winter Annual Meeting, Paper No. 93-WA/EEP-5, December 1993.

An Approach to the Development of Package Design Guidelines, M. Pecht, D. Barker and A. Dasgupta, ISHM, pp. 217-240, 1993; ISHM, pp. 28 - 54, November/December 1993.

Comparing MCM Technologies, P. Sandborn, Advanced Packaging, Vol. 2, No. 1, pp. 40-43, Winter 1993.

Comparison of Electronics-Reliability Assessment Approaches, M. Cushing, D. Mortin, T. Stadterman and A. Malhotra, IEEE Transactions on Reliability, Vol. 42(4), pp. 600-607, December 1993.

Component Rearrangement on Printed Wiring Boards to Maximize the Fundamental Natural Frequency, T. Chang and E. Magrab, Transaction of the ASME. 312/Vol.115, September 1993.

A Comprehensive Optimization of InAlAs Molecular Beam Epitaxy for InGaAs/InAIAs HEMT Technology, A. Georgakilas, G. Halkias, A. Christou, N. Kornilios, C. Papavassiliou, K. Zekentes, G. Konstantinidis, F. Peiro, A. Cornet, S. Ababou, A. Tabata and G. Guillot, Journal of the Electrochemical Soc., Vol. 140, No. 5, pp. 1504-1509, May 1993.

Computer Aided Conceptual Design of Multichip Systems, P. Sandborn, Proceedings of the IEEE Custom Integrated Circuits Conf. (CICC), pp. 29.4.1-29.4.4, San Diego, CA, May 1993.

Compute Aided Design and Reliability Assessment of Microelectronic Packages, P. Lall, X. Shan, C. Rust, and E. Hakim, Software Applications in Electrical Engineering, United Kingdom, pp. 63-70, July 6-8, 1993.

Computer-Aided Reliability Simulation, Design and Assessment of MCMs: A Physics of Failure Approach, P. Lall, M. Pecht, and E. Hakim, 1993 Advanced Microelectronics Technology Qualification, Reliability, and Logistics Workshop, Denver, CO, August 24-26, 1993.

Derating Guidelines for Temperature-Tolerant Design of Microelectronics, P. Lall, M. Pecht and E. Hakim, 6th International Conference Quality in Electronic Components Failure Prevention, Detection and Analysis; 4th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France, October 4-7, 1993.

Design Approach To Reliable Microelectronic Packages, M. Pecht, M. Cushing and E. Hakim, Proceedings 9th European Hybrid Microelectronics Conference, pp. 484-492, Nice, France, June 2- 4, 1993.

Design of MCMs for Insertion into Standard Surface Mount Packages, P. A. Sandborn, H. Hashemi, and L. Bal, Proceedings of the National Electronic Packaging and Production Conference (NEPCON-West), Anaheim, CA, February 1993, pp. 651-660.

A Design Model for Through-Hole Components Based on Lead-Fatigue Considerations, S. Ling, and A. Dasgupta, Advances in Electronic Packaging ASME EEP, Vol. 4 No. 2, 1993.

Design for Qualification, M. Pecht, Proceedings 1993 Annual Reliability and Maintainability Symposium, pp. 1-4, 1993.

Design of Reliable Die Attach, J. Hu, M. Pecht and A. Dasgupta, International J. Microcircuits and Electronic Packaging, Vol. 16(1), pp. 1-21, 1993.

Dynamic Investigation of Thermal and Sorptive Effects on Electronic Packages, J. Li and M. Pecht, Proceedings of the ASME Int'l Electronics Packaging Conf., September 1993.

Environmental Scanning Electron Microscopic Investigation on Interfacial Defects in Electronic Packages, J. Li and M. Pecht, International Symposium on Nondestructive Characterization of Materials, Oahu, Hawaii, pp. 225-229, June 1993.

Evaluating Terminal Pair System Reliability, M. Pecht, J. She and D. Barbe, IEICE Trans. on Fundamentals of Electronics, Communications and Computer Sciences, pp. 555-546, April 1993.

Experimental and Analytical Investigation of PTH Fatigue Life in Aramid PWBs Part II, D. Yoder, S. Bhandarkar and A. Dasgupta, IPC Review, June 1993 (part 2).

Experimental and Theoretical Investigation of Die Attach manufacturing Variables and Thermo-Mechanical Performance of GaAs MMICs on LTCC Substrates, A. Christou and D. Barker, 1993 U.S. Conference on GaAs Manufacturing TECHnology, Atlanta, GA, May 1993.

Failure Mechanism Models for Creep and Creep Rupture, J. Li, and A. Dasgupta, Transactions of the ASME, Vol. 115, pp. 416-423, December 1993.

Failure Mechanism Models For Cyclic Fatigue, A. Dasgupta, IEEE Trans. on Rel., Vol. 42, No. 4, pp. 548-555, December, 1993.

The Future of Military Standards - A Focus on Electronics, M. Pecht and E. Hakim, IEEE Aerospace and Electronic Systems, Vol. 17 (7), pp. 16-19, 1993.

A Generalized Stress Analysis Model for Fatigue Prediction of Surface Mount Solder Joints, A. Dasgupta, S. Ling and S. Verma, Advances in Electronic Packaging ASME EEP-Vol. 4-2, 1993.

An Integrated Physics-of-Failure Approach to Reliability Assessment, P. Lall and M. Pecht, Advances in Electronic Packaging ASME EEP-Vol.4-1, 1993; also ASME International Electronic Packaging Conference, Binghamton, NY, September 29-October 2, 1993.

Influence of Nonlinear Interphase/Matrix Properties on Effective Properties of Unidirectional Fiber Composites, A. Dasgupta and S. Bhandarkar, First Joint ASCE/ASME/SES Meeting, Charlottesville, VA, June 6-9, 1993.

Influence of Surface Mount Lead End Geometry on Fatigue Life, V. Gupta and D. Barker, ASME Winter Annual Meeting paper number 93-WA/EEP-5, New Orleans, LA, November. 28 - December 3, 1993.

Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment, D. Barker and Sidharth, ASME Winter Annual Meeting paper number 93-WA/EEP-4, New Orleans, LA, November 28 - December 3, 1993.

Mechanical Design Failure Models for Buckling, A. Dasgupta and H. Haslach, IEEE Transactions on Reliability, Vol. 42, No. 1, pp. 9-16, March 1993.

Microelectronic Packaging Technology Transfer, J. Key, University/Government/Industry Microelectronics Symposium, Research Triangle Park, NC, pp. 10-16, May 18-19, 1993.

Microwave Performance of GaAs on Silicon MESFETs with Si Buffer Layer, A. Georgakilas, A. Christou and G. Halkias, IEEE Trans. on Electron Devices, Vol. 40, No. 3, pp. 507-512, March 1993.

Modeling the Effects of Mixed Flowing Gas Corrosion and Stress Relaxation on Contact Interface Resistance, S. Bhagath and M. Pecht, ASME Journal of Electronic Packaging, Vol. 115, pp. 404-409, Dec. 1993.

Module Level Performance Simulator for the Figure of Merit of Electrical and Optical Interconnects, L. Guan, C. Pusarla, G. Halkias, A. Christou, NASCODE X, Ninth International Conference on Numerical Analysis, Copper Mountain, Co, April 6-9, 1993.

Multi-Chip Modules: An Overview, P. Lall and S. Bhagath, Solid State Technology, Vol. 36(8), September 1993.

A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach, S. Verma, A. Dasgupta, and D. Barker, Transactions of the ASME, Vol. 115, pp. 416-423, December 1993.

An Overview of Multichip Modules, P. Lall and S. Bhagath, Solid State Technology, September 1993.

A Partitioning Advisor for Studying the Tradeoff Between Peripheral and Area Array Bonding of Components in Multichip Modules, P. Sandborn, M. Abadir and C. Murphy, Proceedings of the International Electronics Manufacturing Technology Symposium (IEMT), pp. 271-276, Santa Clara, CA, October 1993.

Physics of Failure Based Computer Tools for Design of Microelectronic Packages, P. Lall and E. Hakim, 2nd ESA Electronic Components Conference, Noordwijk, The Netherlands, May 24-28, 1993.

Physics of Failure Based Computer Tools For Design of Microelectronic Packages, P. Lall and M. Pecht, 3rd International Microelectronics and Systems 93' Conference, Kuala Lumpur, Malaysia, August 10-13, 1993.

Plastic Packaged Microcircuits: Quality, Reliability, and Cost Issues, M. Pecht, R. Agarwal and D. Quearry, IEEE Transactions on Reliability, Vol. 42(4), pp. 630-635, December 1993.

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design, R. Agarwal and A. Dasgupta, Journal of Electronic Packaging, Vol. 115, No. 2, pp. 219-224, June 1993, Also ASME Winter 1993 Meeting, paper number 92-WA/EEP-24.

Reliability Evaluation of Plastic Encapsulated Parts, L. Weil, M. Pecht and E. Hakim, IEEE Transactions on Reliability, Vol. 42(4), pp. 608-616, December 1993.

Reliability Evaluation of Simple Logic Microcircuits in Surface Mount Plastic Packages, L. Condra, G. Wenzel and M. Pecht, EEP-Vol. 6, Electronic Packaging Reliability, pp. 85-100, Nov. 1993.

Resistors, Chapter 2, M. Pecht, P. Lall, The Electrical Engineering Handbook, edited by Richard Dorf, CRC Press Inc., Boca Raton, FL, 1993.

Role of Failure Mechanism Identification in Accelerated Testing, J. Hu, D. Barker and A. Dasgupta and A. Arora, Journal of the IES, July/August 1993.

Solder Joint Crack Initiation and Crack Propagation in a TSOP Using Strain Energy Partitioning, D. Barker, V. Gupta and K. Cluff, Proceedings of ASME International Electronic Packaging Conference, Binghamton, NY, pp. 943-950, September 19 - October 2, 1993.

Stress Analysis of Glass-to-Metal Lead Seals, B. Mathieu and A. Dasgupta, Presented at the ASME Winter Annual Meeting New Orleans, LA, November 28 - December 3, 1993.

Surface Related Failure Mechanisms in Polyimide Passivated L-Band MMICs, G. Halkias, A. Christou, K. Huang and J. Li, IEEE - IRPS, March 1993.

Thermal Derating Guidelines for Temperature - Tolerant Design of Microelectronic Devices, P. Lall, M. Pecht and E. Hakim, ESREF (Bordaux France), 1993.

Thermal Stress Issues in Plated-Through-Hole Reliability, Chapter 20, D. Barker and A. Dasgupta; Mechanics of Wirebond Interconnects, Chapter 22, M. Pecht and P. Lall; Corrosion in Microelectronic Packages, Chapter 23, X. Shan and M. Pecht; Thermal Stress and Strain in Microelectronics Packaging, edited by John Lau, Van Nostrand Reinhold, New York, NY, 1993.

Tradeoff Analysis for a 300 MHz Module, P. A. Sandborn, Presented at the Workshop on Interconnections within High-Speed Digital Systems, Santa Fe, NM, May 1993.

Training the Shop Floor Worker: University Perspectives, A. Dasgupta, Surface Mount International Conference, San Jose, CA, August 29 - September 2, 1993.

Using Plastic Encapsulated Microcircuits in High Reliability Applications, L. Condra, G. Kromholtz, M. Pecht, and E. Hakim, 1993.

Vibrational Fatigue Life Calculations for Components Mounted on PWBs, D. Barker, Y. Chen and A. Dasgupta, Journal of Electronic Packaging, Vol. 115, No. 2, pp. 195-200, June 1993, Also ASME Winter 1993 Meeting, paper number 92-WA/EEP-18.

Estimating the Vibration fatigue Life of Quad Leaded Surface Mount Components, D. Barker, Y. Chen, and A. Dasgupta, Journal of Electronic Packaging , Vol. 115, June 1993.

Alloy Clustering and Defect Structure in the Molecular Beam Epitaxy of In0.53Ga0.47As on Silicon, A. Georgakilas, A. Christou, A. Dimoulas and J. Stoemenos, J. Mater. Res., Vol. 7(8), pp. 2194 - 2204, August 1992.

Anisotropic Spinodal Decomposition in MBE InGaAs Films Grown on Misoriented <001> Si Substrates, A. Georgakilas, J. Stoemenos and A. Christou, 1992 GaAs and Related Compounds Sym. Proceedings, Karuizawa, Japan, September 28-October 1, 1992.

The Close Attached Capacitor: a Solution to Switching Noise Problems, S. H. Hashemi, P. A. Sandborn, D. Disko, and R. Evans, IEEE Trans. on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6, pp. 1056-1063, December 1992.

Are Components Still the Major Problem: A Review of Electronic System and Device Field Failure Returns, M. Pecht and V. Ramappan, IEEE Trans. CHMT, 15(6), 1160-1164, 1992.

Comparison of Plastic and Hermetic Microcircuits Under Temperature Cycling and Temperature-Humidity-Bias, L. Condra, S. O'Rear, T. Freedman, L. Flancia, M. Pecht and D. Barker, IEEE Trans. CHMT, Vol. 15(5), pp. 640-650, 1992.

Composite Materials in Electronic Packaging, A. Dasgupta, 6th international Sampe Electronic Material and Process Conference, Baltimore, MD, June, 1992.

A Computer Integrated Product Development Environment, G. Bonadies and M. Pecht, Proceedings CE and CALS Washington '92 Conference and Exposition, pp. 151-164, June 1-4, 1992.

Conductive Filament Formation in Printed Wiring Boards, M. Pecht, B. Wu and D. Jennings, 13th IEEE Intern. Electronics Manuf. Techn. Symposium, pp. 74-79, 1992.

Cooling of Electronic Boards Using Internal Fluid Flows, K. Herold, S. Sridhar and S. Hu, Proceedings 1992 Joint ASME/JSME Conference on Electronic Packaging: Advances in Electronic Packaging 1992, pp. 285-290, April 9-12, 1992.

Correlation Between Mechanical Strength and Processing Parameters of GaAs Wafers, J.M. Hu and A. Christou, 1992 Conference on GaAs Manufacturing Techniques, April 22-25, 1992.

Corrosion Modeling in Micorelectronic Packaging, A. Christou, X. Shan, and M. Pecht, International Journal of Microcircuits and Electronic Packaging, Vol. 15, No. 1, First Quarter 1992.

Design Approach of Reliable MCM Packages Based on Physics-of- failure Models, J. Hu and D. Barker, Proceedings 1992 ICMCM, pp. 386-393, April 1-3, 1992.

Design Guidelines for Leads of Microelectronic Packages, A. Arora, M. Pecht, and A. Dasgupta, Proceedings 1992 Surface Mount Technology and Modern Circuit Making Conference, pp. 89-100, April 13-16, 1992.

Design of Reliable Electronic Packages Bases on Physics of Failure, Proceedings of NASA JSC Conference on Surface Mount Technology, Houston, TX, July 28-29, 1992.

Design of Reliable Electronic Packages Based on a Physics-of- Failure Approach, J. Hu and D. Barker, Proceedings 1992 Surface Mount Technology and Modern Circuit Making Conference, pp. 161-171, April 13-16, 1992.

Design of Software Tools for Use in a Concurrent Engineering Environment, M. Osterman, Proceedings CE and CALS Washington '92 Conference and Exposition, pp. 165-173, June 1-4, 1992.

Development of An Alternative Wire Bond Test Technique, M. Pecht, P. Lall and D. Barker, 13th IEEE Intern. Electronics Manuf. Techn. Symposium , pp. 283-287, 1992.

Dual Functional Distribution of Failure in GaAs Multichip Microwave Monolithic Integrated Circuits (MMICs), A. Christou, P. Tang and J. Hu, IEEE Trans. on Electron Devices, Vol. 39(10), October 1992.

Education in Reliable Electronic Packaging, M. Pecht and D. Weiss, Proceedings 1992 Annual Reliability and Maintainability Symposium, pp. 144-149, January 1992.

Effect of Humidity Cycling on Reliability of Overlaid High-density Interconnects, X. Shan, R. Agarwal, M. Pecht and J. Evans, Proceedings IEEE Multichip Module Conference, pp. 106-109, March 18-20, 1992.

Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life, D. Barker, I. Sharif, A. Dasgupta and M. Pecht, Journal of Electronic Packaging, Transactions of the ASME, Vol. 144, pp. 177-184, June 1992.

Electronic Packaging Education for Mechanical Engineers: A Panel Response, J. Dally, T. Kawakami, W. Nakayama, K. Torrance, and A. Kraus, Advances in Electronic Packaging, ASME 1992.

Evaluation of Manufacturing Variables in the Reliability of Surface Mount Capacitors, L. Condra, G. Johnson, M. Pecht and A. Christou, IEEE Trans. CHMT, Vol. 15(4), pp. 542-552, 1992.

Failure Mechanism Model for Brittle Fracture, A. Dasgupta, and J. Hu, IEEE Trans. on Reliability, Vol. 41 (3), September 1992.

Failure Mechanism Model for Ductile Fracture, A. Dasgupta, and J. Hu, IEEE Trans. on Reliability, Vol. 41(4), November 1992.

Failure Mechanism Models for Excessive Elastic Deformation, A. Dasgupta and J. Hu, IEEE Transactions on Reliability, Vol. 41 (1), pp. 37-47, March 1992.

Failure Mechanism Models for Plastic Deformation, A. Dasgupta, and J. Hu, IEEE Trans. on Reliability, Vol. 41(2).

Fatigue Life of Misregistered J-lead Solder Joints Through an Energy-partitioning Analysis, A. Dasgupta, S. Verma and D. Barker, ASME Winter Annual Meeting, Anaheim, CA, Nov. 8-13, 1992.

Finite Element Modeling of the Influence of Intermetallics on Solder Joint Reliability, S. Verma and A. Dasgupta, 21st Joint Hybrid Microelectronics Symposium, ISHM, Cherry Hill, NJ, pp. 11, May 27-28, 1992.

A Generalized Self-Consistent Mori-Tanaka Scheme for Fiber Composites with Multiple Interphases, A. Dasgupta and S. Bhandarkar, Mechanics of Materials, Vol. 14, pp. 67-82, 1992.

HBT Self-Aligned Collector-Base Interface State Related Failure Mechanism, A. Christou and A. Georgakilas, 1992 GaAs and Related Compounds Sym. Proce., Karuizawa, Japan, pp. 711-716, September 28 - October 1, 1992.

Heterojunction Bipolar Transistor Surface Related Failure Mechanisms, A. Christou, P. Tang, A. Georgakilas, L. Zhu and B. Marazas, ESREF 92 Proceedings, Schwabish Gmund, Germany, Oct. 5-8, 1992.

High Electron Mobility Transistors with Optically Processed Silicide Metallizations; Thermal and Microwave Analysis, P. Tang, M. Fan, A. Iliadis and A. Christou, Proceedings Materials Research Society Symposium 1991, Boston, MA, pp. 139-144, December 3-5, 1991.

Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures, S. Bhandarkar, A. Dasgupta, D. Barker, M. Pecht and W. Engelmaier, Journal of Electronic Packaging, Vol. 114 (1), pp. 8-13, March 1992.

InGaAs Molecular Beam Epitaxy in InP Wells Prepared by Reactive Ion Etching, A. Georgakilas, K. Zekentes, K. Tsagaraki, P. Lefebvre, J. Allegre and A. Christou, 4th International Conference on InP and Related Materials, Newport, RI, April 21-24 1992, pp. 101-104, April 21-24, 1992.

Manufacturing Defects and Failures in Flexible Printed Circuits, D. Wolfowitz and D. Barker, Proceedings 1992 Surface Mount Technology and Modern Circuit Making Conference, April 13-16, 1992, pp. 101-120, 1992.

Micromechanical Simulation of Thermo-mechanical and Thermal Properties of Woven-Fabric Composites, S.M. Bhandarkar, R. Agarwal and A. Dasgupta, Proceedings Third International Conference CADCOMP 92, Newark, Delaware, pp. 547-558 May 13-15, 1992.

Modeling the Vibrational Restraint of Wedge Lock Card Guides, D. Barker, Y. Chen, ASME Winter Annual Meeting, paper number 92-WA/EEP-16, Anaheim, CA, November 9-13, 1992.

Natural Convection Liquid Cooling of a Substrate-Mounted Protrusion in a Square Enclosure: A Parametric Study, S. Sathe and Y. Joshi, Journal of Heat Transfer, Vol. 114, May 1992.

Optical Properties of InGaAs Films Embedded in Plasma Etched InP Wells, A. Georgakilas, A. Christou, P. Lefebvre, J. Allegre, K. Zekentes and G. Halkias, Appl. Phys. Lett. Vol. 61 (7), pp. 798-800, August 1992.

Orthotropic Electrical Permittivity and Thermal Conductivity of Woven-Fabric Composites, R. Agarwal, American Society for Composites 7th Tech. Conf. on Composite Materials, University Park, PA, pp. 519-528, October 13-15, 1992.

Orthotropic Thermal Conductivity of Plain-weave Fabric Composites Using a Homogenization Technique, A. Dasgupta and R. Agarwal, Journal of Composite Materials, Vol. 26 (18), pp. 2736-2758, 1992.

A Physics-of-Failure Approach to Component Placement, M. Osterman, Journal of Electronic Packaging, Vol. 114, September 1992.

A Physics-of-Failure Approach to IC Burn-In, M. Pecht and P. Lall, Proceedings 1992 Joint ASME/JSME Conference on Electronic Packaging: Advances in Electronic Packaging 1992, April 9-12, 1992, pp. 917-924; also presented at 21st Joint Hybrid Microelectronics Symposium, ISHM, Cherry Hill, NJ, May 27-28, 1992.

Placement Design for Producibility, M. Pecht, J. Watts and S. Balakrishnan, Journal of Electronics Manufacturing, Vol. 1 (2), pp. 61-76, 1992.

Potential Failure Mechanism in Overlaid High Density Interconnects, R. Agarwal, M. Pecht, X. Shan, J. Evans, ISHM-IEPS Proceedings 92, Intern. Conf. Multichip Modules, pp. 361-367, 1992.

Prediction of Electrical Properties of Plain-Weave Fabric Reinforced Composites for Printed Circuit Board Design, R. Agarwal and A. Dasgupta, ASME Winter Annual Meeting, Anaheim, CA, November 8-13, 1992.

PWB Solder Joint Life Calculations Under Thermal and Vibrational Loading, D. Barker, A. Dasgupta, M. Pecht, Journal of the IES, Vol. 35 (1), pp. 17-25, February 1992.

Reliability of GaAs Microwave Monolithic Integrated Circuits, A. Christou, Proceedings of ESREF 92, Swchabish Gmund, Germany, October 5-8, 1992.

Reliability of k-out-of-n Warm-Standby System, J. She and M. Pecht, IEEE Transactions on Reliability, Vol. 41 (1), pp. 72-75, March 1992.

Reliability and Yield and Manufacturing Defect Correlation in Microwave and Optoelectronic Circuits, A. Christou and A. Georgakilas, Advances in Electronic Packaging, 1992.

RF Performance of GaAs/Si/Si MESFETs for MIMICs, G. Halkias, A. Georgakilas, C. Papavassiliou, G. Perantinos, M. Lagadas, G. Konstantinidis and A. Christou, GaAs'92, European GaAs Application Symposium, ESTEC, Noordwijk, The Netherlands, April 27-29, 1992.

Role and Measurement of Trimming Shock on Component Leads, D. Wolfovitz, D. Barker, M. Pecht, 13th IEEE Intern. Electronics Manuf. Techn. Symposium, pp. 64-67, 1992.

Role of Failure-mechanism Identification in Accelerated Testing, J. Hu, D. Barker, A. Dasgupta, and A. Arora, Proceedings 1992 Annual Reliability and Maintainability Symposium, January 1992, pp. 181-188.

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach, A. Dasgupta, C. Oyan, M. Pecht and D. Barker, AMSE Journal of Electronic Packaging, Vol. 144, pp. 152-160, June 1992. Presented all at Mechanics of Surface Mount Assemblies Symposium, ASME/WAM, GA, Dec. 1-6, 1991.

Suppression of the Kink Effect in InGaAs/InAlAs HEMT Grown by MBE by Optimizing the InAlAs Buffer Layer, A. Georgakilas, K. Zekentes, N. Kornilios, G. Halkias, A. Dimoulas, A. Christou, F. Peiro, A. Cornet, T. Benyattou, A. Tabata and G. Guillot, 4th International Conference on InP and Related Materials, Newport, RI, pp. 97-100, April 21-24, 1992.

Technology Application Tradeoff Studies in Multichip Systems, P. Sandborn, Proceedings of the 1st International Conference on MCM's, Denver, CO, pp. 150-159, April 1992.

The Technology and Reliability of Laser Processed Heterojunction Devices, A. Christou, Proceedings of SAMPE 1992, Baltimore, MD, June 22-25, 1992.

Temperature Dependence on Integrated Circuit Failure Mechanisms, Chapter 2, pp. 61-152, M. Pecht, P. Lall and E. Hakim, Advances in Thermal Modeling III, edited by A. Bar-Cohen and A. Kraus, IEEE Press, November, 1992.

Towards a QML Approach in Electronic Packaging, A. Dasgupta, S. Verma and R. Agarwal, 13th IEEE/CHMT International Electronics Manuf. Technology Sym., Baltimore, MD, pp. 19-29, September 28-30, 1992.

Transient Natural Convection from a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study, D. Wroblewski, and Y. Joshi, Journal of Electronic Packaging, Vol. 114, September 1992.

Transition of MIL-STD-785 from a Military to a Physics-of-failure based Com-military Document, M. Pecht, A. Malhotra, D. Wolfowitz, M. Oren and M. Cushing, 9th Int'l Conf. of the Israel Society for Quality Assurance, Jerusalem, Israel, November 16-19, 1992.

Two-Dimensional Thermal Modeling of Power Monolithic Microwave Integrated Circuits, M. Fan, A. Christou, M. Pecht, IEEE Trans. on Electron Devices, Vol. 39 (5), pp. 1075-1079, May 1992.

The Influence of Temperature on Integrated Circuit Failure Mechanisms, M. Pecht, P. Lall and E. Hakim, Quality and Reliability Engineering Intl, Vol. 8, pp. 167-175, 1992.

Vibrational Fatigue Life Calculations for Components Mounted on PWBs, D. Barker, Y. Chen and A. Dasgupta, ASME Winter Annual Meeting, 92-WA/EEP-18, Anaheim, CA, November 9-13, 1992.

Commercial Microcircuit Options in Military Avionics Systems Demand Reliability, L. Condra and M. Pecht, Defense Electronics, August, 1991.

CAD for Multichip Packaging: Issues for Today and Needs for the Future, P. A. Sandborn, Proceedings of the SRC Topical Research Conference on IC Packaging Design, Analysis and Simulation, pp. 9-12, May 1991.

CAD Specification for Multichip System Packaging, P. Sandborn, and K. Drake, Proceedings of  the 1991 VLSI and GaAs Packaging Workshop, pp. 43-45, October 1991.

Close Attached Capacitors for MCM Decoupling, H. Hashemi and P. A. Sandborn, presented at the National Electronic Packaging and Production Conference (NEPCON-West), February 1991.

Design and Analysis of Electronic Assemblies Using CALCE Software Version 3.0, E. Hakim, M. Pecht and D. Barker, 1991 Proceedings-Institute of Environmental Science, pp. 36-40, 1991.

Dislocation Mechanics and Shock Deformation, V. Ramachandran, R. Armstrong, D. Barker, C. Coffey, R. Dick, W. Holt, J. McKirgan, W. Mock, Jr., W. Soper, J. Williams, F. Zerilli and X. Zhang, Proceedings of XIII AIRAPT International Conference on High Pressure Science and Technology, Bangalore, India, Oxford and IBH Publishing Co., New Delhi, India, October 7-11, 1991.

Effective Properties of Fiber Composites with Multiple Interphases, A. Dasgupta, S. Bhandarkar, M. Pecht, and D. Barker, Composites, Albany, NY, pp. 1044-1053, October 6-9, 1991.

Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material, J. Ju, M. Pecht, D. Barker and A. Dasgupta, Proceedings of 1991 Spring Meeting of the Material Research Society, 1991.

Failure Distribution Functions for GaAs MMICs, A. Christou and P. Tang, ESREF 91 Proceedings, 5th International Conference Quality in Electronic Components, Bordeaux, France, pp. 327-334, October 7-10, 1991.

GaAs on Silicon Materials and Devices for Microwave Integrated Circuits and Optical Interconnects, A. Christou, Proceedings 1991 International Semiconductor Device Research Symposium, (Invited) Charlottesville, VA, pp. 285-289, December 4-6, 1991.

An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies, T. Chang and E. Magrab, Journal of Electronic Packaging, Vol. 113, pp. 427-430, December 1991.

The Influence of Temperature on Integrated Circuit Failure Mechanisms; Part II, M. Pecht, P. Lall and E. Hakim, 5th International Conference on Quality in Electronic Components, Bordeaux, France, pp. 85-92, October 7-10, 1991.

Material Failure Mechanisms and Damage Models, A. Dasgupta and M. Pecht, IEEE Transactions on Reliability, Vol. 40 (5), pp. 531-536, December 1991.

Microelectronic Reliability/Temperature Independence, Part I, E. Hakim, M. Pecht and P. Lall, 5th International Conference on Quality in Electronic Components, Bordeaux, France, pp. 49-54, October 7-10, 1991.

Minimizing Life Cycle Costs, M. Pecht, J. She, J. Hu and K. Richter, Concurrent Engineering, pp. 11-24, 1991.

Modeling the Influence of Absolute Temperature on Microelectronic Device Reliability, M. Pecht and P. Lall, Internepcon/Semiconductor Thailand '91, Bangkok, Thailand, December 2-4, 1991.

Modulation Doped Channel Transistors: Performance Reliability and Comparison with a Quasi-charge Control Model, A. Christou, A. Iliadis, and P. Tang, Proceedings 1991 International Semiconductor Device Research Symposium, pp. 659-663, December 1991.

Natural Convection Arising from a Heat Generating Substrate-Mounted Protrusion in a Liquid-Filled Two-Dimensional Enclosure, S. Sathe, and Y. Joshi, International Heat and Mass Transfer, Vol. 34 (8), pp. 2149-2163, 1991.

Natural Convection Cooling of a Ceramic Substrate Mounted Leadless Chip Carrier in Dielectric Liquids, Y. Joshi, and R. Paje, International Heat and Mass Transfer, Vol. 34 (8), pp. 39-47, 1991.

Negative Photoconductivity in Dual-channel InGaAs Pseudomorphic High Electron Mobility Transistors, A. Christou, P. Tang and A. Iliadis, Proceedings 1991 International Semiconductor Device Research Symposium, pp. 313-316, December 1991.

Non-Linear Thermo-Mechanical Properties of Fabric Reinforced Printed Wiring Boards, S. Bhandarker, A. Dasgupta, M. Pecht, and D. Barker, 5th International SAMPE Electronics Conference, June 18-20, 1991

Prediction of PWB/PCB Thermal Conductivity, A. Agarwal, A. Dasgupta, M. Pecht and D. Barker, Inter. Journal Hybrid Microelectronics, Vol. 14 (3), pp. 83-95, 1991.

A Probabilistic Approach for Prediction of Thermal Fatigue Life of Wire Bonding in Microelectronics, J. Hu, M. Pecht and A. Dasgupta, Journal of Electronic Packaging, Vol. 113, pp. 275-285, September 1991.

Reliability of Advanced LAMBE FETs and HEMTs, W. Anderson and A. Christou (Naval Research Laboratory, Washington, DC- University of Maryland, College Park, MD, study), Proceedings of ESREF '91, pp. 323-329, October 1991.

Role of Strain-Partitioning Analysis in Solder Life Prediction, C. Oyan, A. Dasgupta, M. Pecht and D. Barker, Inter. Journal Hybrid Microelectronics, Vol. 14 (2), pp. 37-47, 1991.

A Software Tool for Technology Tradeoff Evaluation in Multichip Packaging, P. Sandborn, Proceedings of the Eleventh International Electronics Manufacturing Technology Symposium (IEMT), San Francisco, CA, pp. 337-341, Sept. 1991.

Temperature Dependence of the Mechanical Properties of GaAs Wafers, J. Hu, M. Pecht, Journal of Electronic Packaging, Vol. 113 (4), pp. 331-336, December 1991.

A Tool for Evaluating Performance and Technology Tradeoffs in Integrated Circuit Packaging, P. Sandborn, Proceedings of NEPCON-East, pp. 569-576, June 1991.

Transient Thermal Stress Analysis of Plated Through Hole Subjected to Wave Soldering, D. Barker, M. Pecht, A. Dasgupta and S. Naqvi, Journal of Electronic Packaging, Vol. 113, pp. 149-155, June 1991.

True Temperature Measurement of Complex Devices Using Infrared Thermography, C. Lamb, G. Braunberg, and M. Pecht, Printed Circuit Design, pp. 20-24, March 1991.

A Viscoelastic Constitutive Model for Constant Rate Loading at Different Relative Humidities, M. Pecht, and H. Haslach, Jr., Mechanics of Materials, Vol. 11., pp. 337-345, 1991.

Generative Mechanisms and Preventive Methods for Micro-Defects in PCB, N. Tsujioka, M. Pecht, and D. Jennings, Proceedings of the Printed Circuit World Convention, Heazell Books, B 2, pp. 3-12, Aylesbury, UK, 1990.

How Failure Prediction Methodology affects Electronic Equipment Design, C. Leonard and M. Pecht, Quality & Reliability Engineering International, Vol. 6, pp. 243-249, 1990.

A Corrosion Rate Equation for Microelectronic Die Metallization, M. Pecht and W. Ko, The International Journal for Hybrid Microelectronics, Vol. 13 (2), pp. 41-52, June 1990.

A Design Advisor and Model Building Tool for the Analysis of Switching Noise in Multichip Modules, P. Sandborn and H. Hashemi, Proceedings of the 1990 International Symposium on Microelectronics (ISHM), Chicago, IL, pp. 652-657, October 1990.

Analytical and Simulation Study of Switching Noise in CMOS Circuits, H. Hashemi, U. Ghoshal, K. Ziai, and P. Sandborn, Proceedings of the 1990 International Electronics Packaging Conference (IEPS), Marlborough, MA, pp. 762-773, September 1990.

Design and Analysis for a Reduced Parasitic Power Distribution System, H. Hashemi and P. Sandborn, presented at the Ninth Annual VLSI and GaAs Packaging Workshop, Boston, MA, September 1990.

Effect of Voids in Solder-Filled Plated through Holes, M. Pecht, D. Barker, A. Dasgupta, and S. Bhandarker, IPC 33rd Annual Meeting, April 1-6, 1990.

Fatigue Analysis of a Planarpak Surface Mount Component, I. Sharif, D. Barker, and M. Pecht, American Society of Medical Engineers Winter Annual Meeting, Dallas, TX, November 25-30, 1990.

A Model for Moisture Induced Corrosion Failures in Microelectronic Packages, M. Pecht, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13 (2), pp. 383-389, June 1990.

Operational Temperature Cycle Values for Application Environment Categories, S. Whelan, M. Pecht, and A. Dasgupta International Journal for Hybrid Microelectronics, Vol. 13 (1), pp. 6-11, March 1990.

Automated Design for Maintainability, H. Reinhart and M. Pecht, IEEE CH2881-1/90/0000-1227, pp. 1227-1232, 1990.

Acceleration Sensors for Solid State Electronic Safety and Arming Devices, S. Grenberg, M. Pecht, Vol. 12 (3), September 1989.

Approximation the Steiner-Tree in the Placement Process, Y. Wong and M. Pecht, Journal of Electronic Packaging, Vol. 111, pp. 228-235, September 1989.

A Failure Prediction Model for Wire Bonds, M. Pecht, A. Dasgupta and P. Lall, October 17-19, 1989 Proceedings, October 1989.

A Critique of Mil-Hdbk-217E Reliability Prediction methods, M. Pecht and W. Kang, IEEE Transactions on Reliability, Vol. 37 (5), pp. 453-457, December 1988.

A Coupled Algorithmic-Heuristic Approach for Design Optimization, S. Azarm, and M. Pecht, IEEE Transactions on Systems, Man and Cybernetics, Vol. SMC-17 (2), pp. 289-293, 1987.

An Investigation into PWB Component-Placement Tradeoffs, M. Pecht, M. Paomer, W. Schenke, and R. Porter, IEEE Transactions on Reliability, Vol. R-36 (5) December 1987.

PCB Design for Thermal Reliability, M. Pecht and B. Sawyer, Vol. 4 (5), pp. 12, May 1987,

Placement of Integrated Circuits for Reliability on Conductivity Cooled Printed Wiring Boards, M. Osterman and M. Pecht, ASME Winter Annual Meeting Boston, Massachusetts- December 13-18, 1987.

Status of Compound Semiconductor Device Reliability, W. Anderson and A. Christou, Kluwer Academic Publishers (Printed in Netherlands), pp. 423, 1990.

Switching Noise in ECL Packaging and Interconnect Systems, P. A. Sandborn, H. Hashemi, and K. Ziai, Proceedings of the IEEE 1990 Bipolar Circuits and Technology Meeting (BCTM), Minneapolis, MN, pp. 148-151, September 1990.

Switching Noise in a Medium Film Copper/ Polyimide Multichip Module, P. Sandborn, H. Hashemi, and B. Weigler, Proceedings of the SPIE International Symposium on Advances in Interconnects and Packaging, Boston, MA, pp. 177-186, November 1990.

Temperature Dependence of Micro Electronic Device Failures M. Pecht, P. Lall and S. Whelan (Westinghouse), Quality and Reliability Engineering Intl, Vol. 6, pp. 275-284, 1990.

Placement for Reliability and Routability of Convectively Cooled PWBs, M. Osterman, and M. Pecht, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 9, No. 7, pp. 734-744, July 1990.

Placement for Reliability Bases on Physics of Failure Concepts, M. Osterman, and M. Pecht, IEEE National Aerospace and Electronics Conference NAECON, Dayton, Ohio, pp. 1021-1027, May 21-25, 1990.

The Reliability Physics Approach to Failure Prediction Modelling, M. Pecht, A. Dasgupta, D. Barker and C. Leonard, Quality and Reliability Engineering Intl, Vol. 6, pp. 267-273, 1990.

A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation, M. Pecht and C. Tan, Journal of Electronic Packaging, Vol. 112, pp. 260-266, September 1990.

Reliability Prediction of Electronic Packages, A. Dasgupta, D. Barker and M. Pecht, Annual Reliability and Maintainability Symposium, pp. 323-330, 1990.

Solder Joint Fatigue - A Total Strain versus Life Approach, J. Vodzak, D. Barker, A. Dasgupta and M. Pecht, ASME Winter Annual Meeting, December 10-15, 1989.

Time Resolved Infrared Radiometry of Laser-Heated Silicon, K. Cho and C. Davis, IEEE Journal of Quantum Electronics, Vol. 25 (5), May 1989.

Verification of Thermal Analysis of PWBs for RAMCAD, J. Gore, M. DiMarzo, C. Resch, and M. Pecht, 1989 Proceedings Annual Reliability and Maintainability Symposium, pp. 474-478, 1989.

Component-Placement Optimization for Convectively Cooled Electronics, D. Dancer and M. Pecht, IEEE Transactions on Reliability, Vol. 38, No. 2, June 1989.

Concurrent Design, M. Pecht, Reliability and Maintainability in Computer-Aided Engineering Workshop, 1988. R&M - CAE, 1988 Proceedings, pp. 45-48, 27-29 September 1988.

Intelligent derating for reliability, IEEE International Symposium on Intelligent Control, Proceedings, pp. 98-102, August 24-26, 1988.

What Research is Underway to Advance R&M Automation for Electronics? M. Pecht, IEEE Transactions on Reliability, Vol. R-36, No.5, pp. 516-520, December 1987.

Aging of Thermoplastics, Mechanics Research Communications, M. Pecht, Mechanics Research Communication, Vol. 12, No. 1, pp. 11-18, 1985.

The Strain Response of Paper Under Various Constant Regain States, M. Pecht and M. Johnson Jr., Tappi Journal, pp. 90-93, Jan 1985.

Creep of Regain-Rheologically Simple Hydrophilic Polymers, M. Pecht, Journal of Strain Analysis, Vol. 20, No. 3, pp. 179-181, 1985.

Reliability of InGaAs HEMTs on GaAs Substrates, A. Christou, J. Hu, and W. Anderson.

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